characterised by the type of device to be heated or cooled

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H01L2023/4018

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2023/4018characterised by the type of device to be heated or cooled

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Power conversion device
- Patent number 11,711,897
- Issue date Jul 25, 2023
- Mitsubishi Electric Corporation
- Toshikazu Takagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including heat dissipation structure and fabri...
- Patent number 11,694,943
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for detaching a microprocessor from a heat sink
- Patent number 11,296,009
- Issue date Apr 5, 2022
- Intel Corporation
- Rolf Laido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including heat dissipation structure and fabri...
- Patent number 11,177,192
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit device
- Patent number 10,930,578
- Issue date Feb 23, 2021
- Autonetworks Technologies, Ltd.
- Akira Haraguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical assembly equipped with auxiliary retention for facilitat...
- Patent number 10,861,771
- Issue date Dec 8, 2020
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Heng-Kang Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module and semiconductor apparatus
- Patent number 10,861,770
- Issue date Dec 8, 2020
- Mitsubishi Electric Corporation
- Teruaki Nagahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation structure of semiconductor device
- Patent number 10,304,754
- Issue date May 28, 2019
- Omron Corporation
- Takeo Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-based heat dissipation device for heat-generating devices
- Patent number 10,177,065
- Issue date Jan 8, 2019
- Gerald Ho Kim
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Apparatus, system, and method for improving the thermal conduction...
- Patent number 10,121,727
- Issue date Nov 6, 2018
- Juniper Networks, Inc.
- Michael E. Lucas
- G02 - OPTICS
Information Patent Grant
Package assembly
- Patent number 9,877,408
- Issue date Jan 23, 2018
- DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTD
- Chad-Yao Tan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Packaging for high power integrated circuits and infrared emitter a...
- Patent number 9,812,378
- Issue date Nov 7, 2017
- OLESON CONVERGENT SOLUTIONS LLC
- Jim Oleson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging and cooling method and apparatus for power semiconductor...
- Patent number 9,443,786
- Issue date Sep 13, 2016
- A.C. Propulsion, Inc.
- Wally E. Rippel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and on-board power conversion device
- Patent number 9,147,634
- Issue date Sep 29, 2015
- Mitsubishi Electric Corporation
- Katsuhisa Kodama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package structure
- Patent number 6,809,418
- Issue date Oct 26, 2004
- Kung-Chao Tung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEAT SINK FOR A SEMICONDUCTOR SWITCHING DEVICE, AND SEMICONDUCTOR S...
- Publication number 20240087981
- Publication date Mar 14, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Walter Apfelbacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lid Allowing for a Thermal Interface Material with Fluidity in a Li...
- Publication number 20230298960
- Publication date Sep 21, 2023
- Yuci SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING HEAT DISSIPATION STRUCTURE AND FABRI...
- Publication number 20220077024
- Publication date Mar 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATING METHOD OF THE SAME
- Publication number 20200105644
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL ASSEMBLY EQUIPPED WITH AUXILIARY RETENTION FOR FACILITAT...
- Publication number 20200058572
- Publication date Feb 20, 2020
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- HENG-KANG WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT DEVICE
- Publication number 20200020608
- Publication date Jan 16, 2020
- AUTONETWORKS TECHNOLOGIES, LTD.
- Akira Haraguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR DETACHING A MICROPROCESSOR FROM A HEAT SINK
- Publication number 20190304871
- Publication date Oct 3, 2019
- Intel Corporation
- Rolf Laido
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE AND SEMICONDUCTOR APPARATUS
- Publication number 20190252292
- Publication date Aug 15, 2019
- Mitsubishi Electric Corporation
- Teruaki NAGAHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION STRUCTURE OF SEMICONDUCTOR DEVICE
- Publication number 20190027421
- Publication date Jan 24, 2019
- Omron Corporation
- Takeo NISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon-Based Heat Dissipation Device For Heat-Generating Devices
- Publication number 20180019179
- Publication date Jan 18, 2018
- Gerald Ho Kim
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
PACKAGING FOR HIGH POWER INTEGRATED CIRCUITS AND INFRARED EMITTER A...
- Publication number 20170243807
- Publication date Aug 24, 2017
- Jim Oleson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND ON-BOARD POWER CONVERSION DEVICE
- Publication number 20140252587
- Publication date Sep 11, 2014
- MITSUBISHI ELECTRIC CORPORATION
- Katsuhisa Kodama
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the type of device to be heated or cooled

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power conversion device

Semiconductor device including heat dissipation structure and fabri...

Method and apparatus for detaching a microprocessor from a heat sink

Semiconductor device including heat dissipation structure and fabri...

Circuit device

Electrical assembly equipped with auxiliary retention for facilitat...

Power module and semiconductor apparatus

Heat dissipation structure of semiconductor device

Silicon-based heat dissipation device for heat-generating devices

Apparatus, system, and method for improving the thermal conduction...

Package assembly

Packaging for high power integrated circuits and infrared emitter a...

Packaging and cooling method and apparatus for power semiconductor...

Semiconductor device, and on-board power conversion device

Integrated circuit package structure

Patents Applicationslast 30 patents

HEAT SINK FOR A SEMICONDUCTOR SWITCHING DEVICE, AND SEMICONDUCTOR S...

Lid Allowing for a Thermal Interface Material with Fluidity in a Li...

SEMICONDUCTOR DEVICE INCLUDING HEAT DISSIPATION STRUCTURE AND FABRI...

SEMICONDUCTOR DEVICE AND FABRICATING METHOD OF THE SAME

ELECTRICAL ASSEMBLY EQUIPPED WITH AUXILIARY RETENTION FOR FACILITAT...

CIRCUIT DEVICE

METHOD AND APPARATUS FOR DETACHING A MICROPROCESSOR FROM A HEAT SINK

POWER MODULE AND SEMICONDUCTOR APPARATUS

HEAT DISSIPATION STRUCTURE OF SEMICONDUCTOR DEVICE

Silicon-Based Heat Dissipation Device For Heat-Generating Devices

PACKAGING FOR HIGH POWER INTEGRATED CIRCUITS AND INFRARED EMITTER A...

SEMICONDUCTOR DEVICE, AND ON-BOARD POWER CONVERSION DEVICE