characterised by the type of layer

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H01L21/02109

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02109characterised by the type of layer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,862,469
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Planarizing process and composition
- Patent number 11,721,543
- Issue date Aug 8, 2023
- Fujifilm Electronic Materials U.S.A., Inc.
- Raj Sakamuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with thermal vias and sinter-bonded thermal dissipation s...
- Patent number 11,621,228
- Issue date Apr 4, 2023
- NXP USA, INC.
- Lu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package stack structure and method for manufacturing the same
- Patent number 11,516,925
- Issue date Nov 29, 2022
- Siliconware Precision Industries Co., Ltd.
- Han-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully-printed stretchable thin-film transistors and integrated logi...
- Patent number 11,302,685
- Issue date Apr 12, 2022
- Board of Trustees of Michigan State University
- Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,295,957
- Issue date Apr 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Semiconductor component and method for fabricating the same
- Patent number 11,158,499
- Issue date Oct 26, 2021
- XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
- Deok-Yong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Differential type sensing circuit with differential input and outpu...
- Patent number 10,930,746
- Issue date Feb 23, 2021
- Ememory Technology Inc.
- Chen-Hao Po
- G11 - INFORMATION STORAGE
Information Patent Grant
Shaped gate caps in spacer-lined openings
- Patent number 10,818,498
- Issue date Oct 27, 2020
- GLOBALFOUNDRIES Inc.
- Yanping Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 10,741,404
- Issue date Aug 11, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and manufacturing method thereof
- Patent number 10,692,981
- Issue date Jun 23, 2020
- Ememory Technology Inc.
- Yen-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of multilayer nanograting structures
- Patent number 10,490,679
- Issue date Nov 26, 2019
- The Curators of the University of Missouri
- Shubhra Gangopadhyay
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Microelectronic systems containing embedded heat dissipation struct...
- Patent number 10,431,449
- Issue date Oct 1, 2019
- NXP USA, INC.
- Jaynal A. Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid carbon hardmask for lateral hardmask recess reduction
- Patent number 10,410,864
- Issue date Sep 10, 2019
- Applied Materials, Inc.
- Thomas Jongwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including contact structure
- Patent number 10,373,961
- Issue date Aug 6, 2019
- Samsung Electronics Co., Ltd.
- Chan-sic Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QLED device and manufacturing method thereof, QLED display panel an...
- Patent number 10,347,836
- Issue date Jul 9, 2019
- BOE Technology Group Co., Ltd.
- Wenhai Mei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating electrodes, method of fabricating thin film t...
- Patent number 10,262,860
- Issue date Apr 16, 2019
- BOE Technology Group Co., Ltd.
- Liangchen Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for oxidizing a substrate surface using oxygen
- Patent number 10,256,290
- Issue date Apr 9, 2019
- Comptek Solutions Oy
- Pekka Laukkanen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor device
- Patent number 10,234,628
- Issue date Mar 19, 2019
- Sumitomo Electric Industries, Ltd.
- Yukihiro Tsuji
- G02 - OPTICS
Information Patent Grant
Sinker with a reduced width
- Patent number 10,163,678
- Issue date Dec 25, 2018
- Texas Instruments Incorporated
- Binghua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic systems containing embedded heat dissipation struct...
- Patent number 10,141,182
- Issue date Nov 27, 2018
- NXP USA, INC.
- Jaynal A. Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of multilayer nanograting structures
- Patent number 10,103,357
- Issue date Oct 16, 2018
- The Curators of the University of Missouri
- Shubhra Gangopadhyay
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Hybrid carbon hardmask for lateral hardmask recess reduction
- Patent number 9,991,118
- Issue date Jun 5, 2018
- Applied Materials, Inc.
- Thomas Jongwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,972,718
- Issue date May 15, 2018
- Semiconductor Energy Laboratory Co., Ltd.
- Junichi Koezuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of metal dielectric film for hardmasks
- Patent number 9,875,890
- Issue date Jan 23, 2018
- Lam Research Corporation
- Fayaz Shaikh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for oxidizing a substrate surface using oxygen
- Patent number 9,837,486
- Issue date Dec 5, 2017
- Comptek Solutions Oy
- Pekka Laukkanen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,530,892
- Issue date Dec 27, 2016
- Semiconductor Energy Laboratory Co., Ltd.
- Junichi Koezuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposited material and method of formation
- Patent number 9,524,868
- Issue date Dec 20, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Wen Chang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for producing mechanically flexible silicon substrate
- Patent number 9,520,293
- Issue date Dec 13, 2016
- King Abdullah University of Science and Technology
- Muhammad M. Hussain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate, eletronic device and method for manufactur...
- Patent number 9,460,965
- Issue date Oct 4, 2016
- Napra Co., Ltd
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TRANSISTOR AND METHOD FOR FABRICATING THE SAME
- Publication number 20240170342
- Publication date May 23, 2024
- SK HYNIX INC.
- Jeong Hwan SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240087903
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SUBSTRATES WITH THERMAL VIAS AND SINTER-BONDE...
- Publication number 20230230924
- Publication date Jul 20, 2023
- NXP USA, Inc.
- Lu LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220223424
- Publication date Jul 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH THERMAL VIAS AND SINTER-BONDED THERMAL DISSIPATION S...
- Publication number 20220068817
- Publication date Mar 3, 2022
- NXP USA, Inc.
- Lu LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD FOR FABRICATING THE SAME
- Publication number 20210280412
- Publication date Sep 9, 2021
- XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
- DEOK-YONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Planarizing Process and Composition
- Publication number 20210104398
- Publication date Apr 8, 2021
- Fujifilm Electronic Materials U.S.A., Inc.
- Micheala Connell
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200343096
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Feng-Cheng Hsu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Fully-Printed Stretchable Thin-Film Transistors and Integrated Logi...
- Publication number 20190157256
- Publication date May 23, 2019
- Board of Trustees of Michigan State University
- Chuan Wang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MICROELECTRONIC SYSTEMS CONTAINING EMBEDDED HEAT DISSIPATION STRUCT...
- Publication number 20190148138
- Publication date May 16, 2019
- NXP USA, Inc.
- JAYNAL A. MOLLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF MULTILAYER NANOGRATING STRUCTURES
- Publication number 20190051863
- Publication date Feb 14, 2019
- THE CURATORS OF THE UNIVERSITY OF MISSOURI
- Shubhra GANGOPADHYAY
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
QLED DEVICE AND MANUFACTURING METHOD THEREOF, QLED DISPLAY PANEL AN...
- Publication number 20180294414
- Publication date Oct 11, 2018
- BOE TECHNOLOGY GROUP CO., LTD.
- Wenhai MEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STACK STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180288886
- Publication date Oct 4, 2018
- Siliconware Precision Industries Co., Ltd.
- Han-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CARBON HARDMASK FOR LATERAL HARDMASK RECESS REDUCTION
- Publication number 20180277370
- Publication date Sep 27, 2018
- Applied Materials, Inc.
- Thomas Jongwan KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20180149809
- Publication date May 31, 2018
- Sumitomo Electric Industries, Ltd.
- Yukihiro TSUJI
- G02 - OPTICS
Information Patent Application
METHOD FOR TREATING A SUBSTRATE AND A SUBSTRATE
- Publication number 20180069074
- Publication date Mar 8, 2018
- Comptek Solutions Oy
- Pekka LAUKKANEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION OF METAL DIELECTRIC FILM FOR HARDMASKS
- Publication number 20160284541
- Publication date Sep 29, 2016
- LAM RESEARCH CORPORATION
- Fayaz Shaikh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR TREATING A SUBSTRATE AND A SUBSTRATE
- Publication number 20160049295
- Publication date Feb 18, 2016
- TURUN YLIOPISTO
- Pekka Laukkanen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPUTTER AND SURFACE MODIFICATION ETCH PROCESSING FOR METAL PATTERNI...
- Publication number 20150243602
- Publication date Aug 27, 2015
- International Business Machines Corporation
- Cyril Cabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING NON-VOLATILE MEMORY DEVICES
- Publication number 20150236111
- Publication date Aug 20, 2015
- Samsung Electronics Co., Ltd.
- Chang-Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINKER WITH A REDUCED WIDTH
- Publication number 20150214096
- Publication date Jul 30, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Binghua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING FUNCTIONALIZED CARRIER STRUCTURES WITH CORELESS PACKAGES
- Publication number 20150179559
- Publication date Jun 25, 2015
- Intel Corporation
- Ravi K. Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TREATMENT FOR FLOWABLE DIELECTRIC DEPOSITION ON SUBSTRATE SURFACES
- Publication number 20150118862
- Publication date Apr 30, 2015
- LAM RESEARCH CORPORATION
- Patrick Reilly
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUS FOR FORMING FLOWABLE DIELECTRIC FILMS HAVING...
- Publication number 20150118863
- Publication date Apr 30, 2015
- LAM RESEARCH CORPORATION
- Megha Rathod
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR DEVICES HAVING WRAPPING LAYER
- Publication number 20150011074
- Publication date Jan 8, 2015
- Samsung Electronics Co., Ltd.
- Dong-Hyun HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR PROCESSIN...
- Publication number 20140342573
- Publication date Nov 20, 2014
- Hitachi Kokusai Electric Inc.
- Yoshiro Hirose
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CRACK CONTROL FOR SUBSTRATE SEPARATION
- Publication number 20140315389
- Publication date Oct 23, 2014
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deposited Material and Method of Formation
- Publication number 20140291745
- Publication date Oct 2, 2014
- Yao-Wen Chang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PRODUCING MECHANICALLY FLEXIBLE SILICON SUBSTRATE
- Publication number 20140239459
- Publication date Aug 28, 2014
- King Abdullah University of Science and Technology
- Muhammad M. Hussain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Power Semiconductor Device
- Publication number 20140235058
- Publication date Aug 21, 2014
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the type of layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package structure and method of manufacturing the same

Planarizing process and composition

Substrate with thermal vias and sinter-bonded thermal dissipation s...

Package stack structure and method for manufacturing the same

Fully-printed stretchable thin-film transistors and integrated logi...

Package structure and method of manufacturing the same

Semiconductor component and method for fabricating the same

Differential type sensing circuit with differential input and outpu...

Shaped gate caps in spacer-lined openings

Package structure and method of manufacturing the same

Memory device and manufacturing method thereof

Fabrication of multilayer nanograting structures

Microelectronic systems containing embedded heat dissipation struct...

Hybrid carbon hardmask for lateral hardmask recess reduction

Semiconductor device including contact structure

QLED device and manufacturing method thereof, QLED display panel an...

Method of fabricating electrodes, method of fabricating thin film t...

Method for oxidizing a substrate surface using oxygen

Method for producing semiconductor device

Sinker with a reduced width

Microelectronic systems containing embedded heat dissipation struct...

Fabrication of multilayer nanograting structures

Hybrid carbon hardmask for lateral hardmask recess reduction

Semiconductor device and method for manufacturing the same

Deposition of metal dielectric film for hardmasks

Method for oxidizing a substrate surface using oxygen

Semiconductor device and method for manufacturing the same

Deposited material and method of formation

Method for producing mechanically flexible silicon substrate

Semiconductor substrate, eletronic device and method for manufactur...

Patents Applicationslast 30 patents

TRANSISTOR AND METHOD FOR FABRICATING THE SAME

PACKAGE STRUCTURE

METHOD OF FABRICATING SUBSTRATES WITH THERMAL VIAS AND SINTER-BONDE...

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SUBSTRATE WITH THERMAL VIAS AND SINTER-BONDED THERMAL DISSIPATION S...

SEMICONDUCTOR COMPONENT AND METHOD FOR FABRICATING THE SAME

Planarizing Process and Composition

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Fully-Printed Stretchable Thin-Film Transistors and Integrated Logi...

MICROELECTRONIC SYSTEMS CONTAINING EMBEDDED HEAT DISSIPATION STRUCT...

FABRICATION OF MULTILAYER NANOGRATING STRUCTURES

QLED DEVICE AND MANUFACTURING METHOD THEREOF, QLED DISPLAY PANEL AN...

PACKAGE STACK STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

HYBRID CARBON HARDMASK FOR LATERAL HARDMASK RECESS REDUCTION

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

METHOD FOR TREATING A SUBSTRATE AND A SUBSTRATE

DEPOSITION OF METAL DIELECTRIC FILM FOR HARDMASKS

METHOD FOR TREATING A SUBSTRATE AND A SUBSTRATE

SPUTTER AND SURFACE MODIFICATION ETCH PROCESSING FOR METAL PATTERNI...

METHODS OF MANUFACTURING NON-VOLATILE MEMORY DEVICES

SINKER WITH A REDUCED WIDTH

FORMING FUNCTIONALIZED CARRIER STRUCTURES WITH CORELESS PACKAGES

TREATMENT FOR FLOWABLE DIELECTRIC DEPOSITION ON SUBSTRATE SURFACES

METHODS AND APPARATUS FOR FORMING FLOWABLE DIELECTRIC FILMS HAVING...

METHODS OF FABRICATING SEMICONDUCTOR DEVICES HAVING WRAPPING LAYER

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR PROCESSIN...

CRACK CONTROL FOR SUBSTRATE SEPARATION

Deposited Material and Method of Formation

METHOD FOR PRODUCING MECHANICALLY FLEXIBLE SILICON SUBSTRATE

Method for Forming a Power Semiconductor Device