characterised by the type of processing

Industry

CPC
H01J2237/33

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS H01J2237/00Discharge tubes exposing object to beam

Current Industry

H01J2237/33characterised by the type of processing

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Nano-coating protection method for electrical devices
- Patent number 12,252,789
- Issue date Mar 18, 2025
- Jiangsu Favored Nanotechnology Co., LTD
- Jian Zong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Embedded high-z marker material and process for alignment of multil...
- Patent number 12,255,047
- Issue date Mar 18, 2025
- HRL Laboratories, LLC
- Christopher Bohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for depositing a layer
- Patent number 12,255,053
- Issue date Mar 18, 2025
- ASM IP Holding B.V.
- Daniele Piumi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process control for ion energy delivery using multiple generators a...
- Patent number 12,255,052
- Issue date Mar 18, 2025
- Lam Research Corporation
- Ranadeep Bhowmick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-shape voltage pulse trains for uniformity and etch profile tu...
- Patent number 12,255,051
- Issue date Mar 18, 2025
- Applied Materials, Inc.
- Linying Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cleaning process for substrate etching
- Patent number 12,255,055
- Issue date Mar 18, 2025
- Applied Materials, Inc.
- Yi Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
In-situ PECVD cap layer
- Patent number 12,252,782
- Issue date Mar 18, 2025
- Lam Research Corporation
- Jeremy David Fields
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods to eliminate of deposition on wafer bevel and backside
- Patent number 12,255,054
- Issue date Mar 18, 2025
- Applied Materials, Inc.
- Venkata Sharat Chandra Parimi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chemical etch nonvolatile materials for MRAM patterning
- Patent number 12,256,645
- Issue date Mar 18, 2025
- Lam Research Corporation
- Wenbing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor wafer with wafer chuck havin...
- Patent number 12,249,493
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Chun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sputtering apparatus
- Patent number 12,249,497
- Issue date Mar 11, 2025
- Samsung Display Co., Ltd.
- Hyun-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon based depositions used for critical dimension control during...
- Patent number 12,249,514
- Issue date Mar 11, 2025
- Lam Research Corporation
- Jon Henri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and etching apparatus
- Patent number 12,249,515
- Issue date Mar 11, 2025
- Tokyo Electron Limited
- Shigeru Tahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, method of manufacturing semiconduct...
- Patent number 12,249,485
- Issue date Mar 11, 2025
- Kokusai Electric Corporation
- Takeshi Yasui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device improvement
- Patent number 12,249,489
- Issue date Mar 11, 2025
- Applied Materials, Inc.
- Yue Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate treating apparatus and substrate support unit
- Patent number 12,249,491
- Issue date Mar 11, 2025
- Semes Co., Ltd.
- Hyoungkyu Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate supporting unit, apparatus for treating substrate includi...
- Patent number 12,243,726
- Issue date Mar 4, 2025
- Semes Co., Ltd.
- Jae-Won Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus
- Patent number 12,243,716
- Issue date Mar 4, 2025
- Tokyo Electron Limited
- Taro Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing method and plasma processing apparatus
- Patent number 12,243,718
- Issue date Mar 4, 2025
- Tokyo Electron Limited
- Eiki Kamata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma generating device and process executing apparatus including...
- Patent number 12,243,721
- Issue date Mar 4, 2025
- NP HOLDINGS CO., LTD.
- Dai Kyu Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate holding method and substrate processing apparatus
- Patent number 12,243,728
- Issue date Mar 4, 2025
- Tokyo Electron Limited
- Shinsuke Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus
- Patent number 12,243,723
- Issue date Mar 4, 2025
- Tokyo Electron Limited
- Yusuke Hayasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus including electrostatic chuck, subst...
- Patent number 12,243,727
- Issue date Mar 4, 2025
- Semes Co., Ltd.
- Dong Chan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Member for semiconductor manufacturing apparatus and method for man...
- Patent number 12,243,729
- Issue date Mar 4, 2025
- NGK Insulators, Ltd.
- Hiroshi Takebayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for processing substrate using plasma
- Patent number 12,237,151
- Issue date Feb 25, 2025
- SEMES CO, LTD.
- Seong Gil Lee
- B08 - CLEANING
Information Patent Grant
Reducing aspect ratio dependent etch with direct current bias pulsing
- Patent number 12,237,149
- Issue date Feb 25, 2025
- Applied Materials, Inc.
- Deyang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma ion processing of substrates
- Patent number 12,237,150
- Issue date Feb 25, 2025
- LIFEHOUSE AUSTRALIA AS TRUSTEE FOR THE LIFEHOUSE AUSTRALIA TRUST
- David R. McKenzie
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Two-dimensional electronic component and method of manufacturing same
- Patent number 12,237,152
- Issue date Feb 25, 2025
- National Central University
- Ching-Yuan Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch feedback for control of upstream process
- Patent number 12,237,158
- Issue date Feb 25, 2025
- Applied Materials, Inc.
- Priyadarshi Panda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lift pin interface in a substrate support
- Patent number 12,237,200
- Issue date Feb 25, 2025
- Applied Materials, Inc.
- Alexander Sulyman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20250095963
- Publication date Mar 20, 2025
- Hitachi High-Tech Corporation
- Haixiang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD
- Publication number 20250095981
- Publication date Mar 20, 2025
- Hitachi High-Tech Corporation
- Jiahui LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20250095969
- Publication date Mar 20, 2025
- Kokusai Electric Corporation
- Takeshi Yasui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS AND METHOD FOR FABRICATING SEMICONDUCTO...
- Publication number 20250095971
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Ji Mo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR PARTICLE CONTROL IN MRAM PROCESSING
- Publication number 20250095975
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsung-Han KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS TRANSPORT SYSTEM
- Publication number 20250092892
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jheng-Syun LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20250095991
- Publication date Mar 20, 2025
- TOKYO ELECTRON LIMITED
- Koki MUKAIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO CONTROL ETCH PROFILE BY RF PULSING
- Publication number 20250095964
- Publication date Mar 20, 2025
- LAM RESEARCH CORPORATION
- Daksh AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
- Publication number 20250095974
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Yongseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF MATERIAL COMPRISING SILICON AND OXYGEN USIN...
- Publication number 20250092515
- Publication date Mar 20, 2025
- ASM IP HOLDING B.V.
- Viraj Madhiwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING CHAMBER LID COOLING
- Publication number 20250095970
- Publication date Mar 20, 2025
- Applied Materials, Inc.
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR MANUFAC...
- Publication number 20250098248
- Publication date Mar 20, 2025
- Kioxia Corporation
- Masaya NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNABLE PATTERNED SURFACE UNIFORMITY USING DIRECT CURRENT BIAS
- Publication number 20250087459
- Publication date Mar 13, 2025
- TOKYO ELECTRON LIMITED
- Pingshan Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PULSED VOLTAGE-ASSISTED PLASMA STRIKE
- Publication number 20250087461
- Publication date Mar 13, 2025
- Applied Materials, Inc.
- Shreeram Jyoti DASH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY (RF) MATCHING NETWORK AND TUNING TECHNIQUE
- Publication number 20250087462
- Publication date Mar 13, 2025
- Applied Materials, Inc.
- Yue GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD
- Publication number 20250087497
- Publication date Mar 13, 2025
- HITACHI HIGH-TECH CORPORATION
- Yohei ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20250087454
- Publication date Mar 13, 2025
- TOKYO ELECTRON LIMITED
- Sho KUMAKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RING ASSEMBLY FOR SEMICONDUCTOR PROCESS, SUBSTRATE PROCESSING APPAR...
- Publication number 20250087465
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Hyungsik KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHALLOW ETCHING PROCESS CHAMBER
- Publication number 20250087467
- Publication date Mar 13, 2025
- VM Inc.
- Sang Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20250087455
- Publication date Mar 13, 2025
- TOKYO ELECTRON LIMITED
- Sho KUMAKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESS DEVICE AND METHOD OF MONITORING SEMICONDUCTOR...
- Publication number 20250087509
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Jitae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMULTANEOUS ETCHING OF MULTI-FACETED SUBSTRATES
- Publication number 20250087472
- Publication date Mar 13, 2025
- INTEVAC, INC.
- Samuel D. Harkness
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC WAVE SUPPLY MECHANISM AND PLASMA PROCESSING APPARATUS
- Publication number 20250087463
- Publication date Mar 13, 2025
- TOKYO ELECTRON LIMITED
- Mitsutoshi ASHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING APPARATUS AND PROCESSING METHOD
- Publication number 20250087466
- Publication date Mar 13, 2025
- United Semiconductor (Xiamen) Co., Ltd.
- Ching-Shu Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-FORMING METHOD AND FILM-FORMING APPARATUS
- Publication number 20250084530
- Publication date Mar 13, 2025
- TOKYO ELECTRON LIMITED
- Yohei MATSUYAMA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20250084535
- Publication date Mar 13, 2025
- Kokusai Electric Corporation
- Kazuyuki OKUDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WAFER PLACEMENT TABLE AND METHOD OF USING THE SAME
- Publication number 20250079230
- Publication date Mar 6, 2025
- NGK Insulators, Ltd.
- Ikuhisa MORIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC PLASMA ETCHING USING C2H2F2
- Publication number 20250079127
- Publication date Mar 6, 2025
- L'air Liquide, Societe Anonyme Pour L'Etude et L'Exploitation Des Procedes Ge...
- Nathan STAFFORD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND METHOD FOR INSTALLING EDGE RING
- Publication number 20250079138
- Publication date Mar 6, 2025
- TOKYO ELECTRON LIMITED
- Takashi ARAMAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE TREATMENT APPARATUS
- Publication number 20250079126
- Publication date Mar 6, 2025
- SHIBAURA MACHINE CO., LTD.
- Rintaro SUEKI
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the type of processing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Nano-coating protection method for electrical devices

Embedded high-z marker material and process for alignment of multil...

Methods and systems for depositing a layer

Process control for ion energy delivery using multiple generators a...

Multi-shape voltage pulse trains for uniformity and etch profile tu...

Integrated cleaning process for substrate etching

In-situ PECVD cap layer

Methods to eliminate of deposition on wafer bevel and backside

Chemical etch nonvolatile materials for MRAM patterning

Method for manufacturing semiconductor wafer with wafer chuck havin...

Sputtering apparatus

Carbon based depositions used for critical dimension control during...

Etching method and etching apparatus

Substrate processing apparatus, method of manufacturing semiconduct...

Optical device improvement

Substrate treating apparatus and substrate support unit

Substrate supporting unit, apparatus for treating substrate includi...

Plasma processing apparatus

Plasma processing method and plasma processing apparatus

Plasma generating device and process executing apparatus including...

Substrate holding method and substrate processing apparatus

Plasma processing apparatus

Substrate processing apparatus including electrostatic chuck, subst...

Member for semiconductor manufacturing apparatus and method for man...

Apparatus and method for processing substrate using plasma

Reducing aspect ratio dependent etch with direct current bias pulsing

Plasma ion processing of substrates

Two-dimensional electronic component and method of manufacturing same

Etch feedback for control of upstream process

Lift pin interface in a substrate support

Patents Applicationslast 30 patents

PLASMA PROCESSING APPARATUS

PLASMA PROCESSING METHOD

SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCT...

PLASMA PROCESSING APPARATUS AND METHOD FOR FABRICATING SEMICONDUCTO...

SYSTEM AND METHOD FOR PARTICLE CONTROL IN MRAM PROCESSING

GAS TRANSPORT SYSTEM

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

METHOD TO CONTROL ETCH PROFILE BY RF PULSING

SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

SELECTIVE DEPOSITION OF MATERIAL COMPRISING SILICON AND OXYGEN USIN...

PLASMA PROCESSING CHAMBER LID COOLING

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR MANUFAC...

TUNABLE PATTERNED SURFACE UNIFORMITY USING DIRECT CURRENT BIAS

PULSED VOLTAGE-ASSISTED PLASMA STRIKE

RADIO-FREQUENCY (RF) MATCHING NETWORK AND TUNING TECHNIQUE

PLASMA PROCESSING METHOD

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

RING ASSEMBLY FOR SEMICONDUCTOR PROCESS, SUBSTRATE PROCESSING APPAR...

SHALLOW ETCHING PROCESS CHAMBER

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

SEMICONDUCTOR PROCESS DEVICE AND METHOD OF MONITORING SEMICONDUCTOR...

SIMULTANEOUS ETCHING OF MULTI-FACETED SUBSTRATES

ELECTROMAGNETIC WAVE SUPPLY MECHANISM AND PLASMA PROCESSING APPARATUS

PROCESSING APPARATUS AND PROCESSING METHOD

FILM-FORMING METHOD AND FILM-FORMING APPARATUS

SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCT...

WAFER PLACEMENT TABLE AND METHOD OF USING THE SAME

DIELECTRIC PLASMA ETCHING USING C2H2F2

SUBSTRATE PROCESSING SYSTEM AND METHOD FOR INSTALLING EDGE RING

SURFACE TREATMENT APPARATUS