characterised by the type of processing

Industry

CPC
H01J2237/33

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Parent Industries

HELECTRICITY H01Electric elements H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS H01J2237/00Discharge tubes exposing object to beam

Current Industry

H01J2237/33characterised by the type of processing

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wafer treatment system and method of treating wafer
- Patent number 12,183,550
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced ripple in switch mode power supply with snubber
- Patent number 12,184,161
- Issue date Dec 31, 2024
- Advanced Energy Industries, Inc.
- Mike Armstrong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gas nozzle, manufacturing method of gas nozzle, and plasma treatmen...
- Patent number 12,183,551
- Issue date Dec 31, 2024
- Kyocera Corporation
- Yukio Noguchi
- B24 - GRINDING POLISHING
Information Patent Grant
Bottom and middle edge rings
- Patent number 12,183,554
- Issue date Dec 31, 2024
- Lam Research Corporation
- Hiran Rajitha Rathnasinghe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remote source pulsing with advanced pulse control
- Patent number 12,183,583
- Issue date Dec 31, 2024
- Tokyo Electron Limited
- Peter Lowell George Ventzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage waveform generator for plasma assisted processing apparatuses
- Patent number 12,183,547
- Issue date Dec 31, 2024
- PRODRIVE TECHNOLOGIES INNOVATION SERVICES B.V.
- Jordi Everts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for temperature control in a substrate processing chamber
- Patent number 12,183,559
- Issue date Dec 31, 2024
- Applied Materials, Inc.
- Vishwas Kumar Pandey
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing device
- Patent number 12,173,400
- Issue date Dec 24, 2024
- ASM IP Holding B.V.
- JaeMin Roh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cleaning method and plasma processing apparatus
- Patent number 12,176,187
- Issue date Dec 24, 2024
- Tokyo Electron Limited
- Chishio Koshimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for filling a recess formed within a substrate...
- Patent number 12,176,243
- Issue date Dec 24, 2024
- ASM IP Holding B.V.
- Viljami Pore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scanning ion beam deposition and etch
- Patent number 12,176,178
- Issue date Dec 24, 2024
- Plasma-Therm NES LLC
- Sarpangala Hariharakeshava Hegde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for processing substrate using plasma
- Patent number 12,176,185
- Issue date Dec 24, 2024
- Semes Co., Ltd.
- Min Sung Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas transport system
- Patent number 12,173,736
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jheng-Syun Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
System and method for particle control in MRAM processing
- Patent number 12,176,192
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Han Kuo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor manufacturing apparatus and method for manufacturing...
- Patent number 12,176,236
- Issue date Dec 24, 2024
- Kioxia Corporation
- Wu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetron design for improved bottom coverage and uniformity
- Patent number 12,176,191
- Issue date Dec 24, 2024
- Applied Materials, Inc.
- Cory Lafollett
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Showerhead assembly with heated showerhead
- Patent number 12,170,186
- Issue date Dec 17, 2024
- Applied Materials, Inc.
- Anantha K. Subramani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma abatement system utilizing water vapor and oxygen reagent
- Patent number 12,170,192
- Issue date Dec 17, 2024
- Applied Materials, Inc.
- Colin John Dickinson
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Vacuum deposition into trenches and vias and etch of trenches and via
- Patent number 12,170,185
- Issue date Dec 17, 2024
- Ascentool, Inc.
- George Xinsheng Guo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Coating apparatus and coating method
- Patent number 12,170,189
- Issue date Dec 17, 2024
- Jiangsu Favored Nanotechnology Co., LTD
- Jian Zong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition method and plasma processing apparatus
- Patent number 12,170,198
- Issue date Dec 17, 2024
- Tokyo Electron Limited
- Hiroyuki Matsuura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ceramic sintered body and member for plasma processing apparatus
- Patent number 12,165,853
- Issue date Dec 10, 2024
- Kyocera Corporation
- Manpei Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support and substrate processing apparatus
- Patent number 12,165,854
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Nobutaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for advanced ion control for etching processes
- Patent number 12,165,872
- Issue date Dec 10, 2024
- Lam Research Corporation
- Zhongkui Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor mask reshaping using a sacrificial layer
- Patent number 12,165,878
- Issue date Dec 10, 2024
- Lam Research Corporation
- Zhongkui Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical diagnostics of semiconductor process using hyperspectral im...
- Patent number 12,165,937
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Yan Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual-frequency, direct-drive inductively coupled plasma source
- Patent number 12,165,841
- Issue date Dec 10, 2024
- Lam Research Corporation
- Maolin Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniformity control circuit for impedance match
- Patent number 12,165,844
- Issue date Dec 10, 2024
- Lam Research Corporation
- Alexei M. Marakhtanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing method for manufacturing semiconductor structure
- Patent number 12,165,851
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lun Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic heater
- Patent number 12,165,855
- Issue date Dec 10, 2024
- NGK Insulators, Ltd.
- Hideaki Takasaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20240429027
- Publication date Dec 26, 2024
- TOKYO ELECTRON LIMITED
- Noriyuki SAKAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS BLOCK, METHOD FOR PRODUCING SAME, AND PLASMA-RESISTANT MEMBER
- Publication number 20240425407
- Publication date Dec 26, 2024
- AGC Inc.
- Shuhei OGAWA
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
PHYSICAL VAPOR DEPOSITION (PVD) WITH TARGET EROSION PROFILE MONITORING
- Publication number 20240429036
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hsi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING PRECLEAN METHODS AND APPARATUS
- Publication number 20240429038
- Publication date Dec 26, 2024
- ASM IP HOLDING B.V.
- Chuang Wei
- B08 - CLEANING
Information Patent Application
PLASMA TREATMENT APPARATUS
- Publication number 20240429030
- Publication date Dec 26, 2024
- KIOXIA Corporation
- Kazuya EMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20240429044
- Publication date Dec 26, 2024
- ASM IP HOLDING B.V.
- Yan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSITION CONTROL IN A BIAS SUPPLY
- Publication number 20240429023
- Publication date Dec 26, 2024
- Advanced Energy Industries, Inc.
- Hien Minh Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCREASED ETCH RATES OF SILICON-CONTAINING MATERIALS
- Publication number 20240429062
- Publication date Dec 26, 2024
- Applied Materials, Inc.
- Alok Ranjan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS HAVING A MIDDLE ELECTRODE
- Publication number 20240429070
- Publication date Dec 26, 2024
- SK HYNIX INC.
- Jin Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER EDGE RING LIFTING SOLUTION
- Publication number 20240429088
- Publication date Dec 26, 2024
- Applied Materials, Inc.
- Michael R. RICE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA SHIELD ASSEMBLY AND PLASMA PROCESSING APPARATUS INCLUDING TH...
- Publication number 20240420928
- Publication date Dec 19, 2024
- SAMSUNG DISPLAY CO., LTD.
- Eun Chan LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, SYSTEM, AND APPARATUS FOR DEPOSITION OF TRANSITION METAL FILM
- Publication number 20240420958
- Publication date Dec 19, 2024
- ASM IP HOLDING B.V.
- Venkata Surya Naga Raju Chava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF SELECTIVELY ETCHING SILICON NITRIDE
- Publication number 20240420962
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Doreen Wei Ying Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFICATION OF METAL-CONTAINING SURFACES IN HIGH ASPECT RATIO PLAS...
- Publication number 20240420963
- Publication date Dec 19, 2024
- LAM RESEARCH CORPORATION
- He Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL
- Publication number 20240420996
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Jiajie Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING PROCESS CHAMBER COOLING FLANGE FOR REMO...
- Publication number 20240420924
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Amit Sahu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR CARBON PLUG FORMATION
- Publication number 20240420927
- Publication date Dec 19, 2024
- LAM RESEARCH CORPORATION
- Daniela ANJOS RIGSBY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTREME EDGE FEATURE PROFILE TILT CONTROL BY ALTERING INPUT VOLTAGE...
- Publication number 20240420929
- Publication date Dec 19, 2024
- LAM RESEARCH CORPORATION
- Rajesh Dorai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROTATING SUBSTRATE SUPPORT
- Publication number 20240420931
- Publication date Dec 19, 2024
- ASM IP HOLDING B.V.
- Yukihiro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT
- Publication number 20240420932
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Yogananda Sarode Vishwanath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU ETCH AND INHIBITION IN PLASMA ENHANCED ATOMIC LAYER DEPOSITION
- Publication number 20240420934
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Bhaskar Soman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA CHAMBER HAVING SWIRL MOTION SIDE GAS FEED
- Publication number 20240420925
- Publication date Dec 19, 2024
- NYSEPLASMA CORP.
- Nam Hun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTIVITY-CONTROLLED DIELECTRIC MATERIALS FOR SUBSTRATE SUPPORTS...
- Publication number 20240420933
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Amir H. Tavakoli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS CHAMBERS HAVING MULTIPLE COOLING PLATES
- Publication number 20240412954
- Publication date Dec 12, 2024
- Dinkesh HUDERI SOMANNA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240412958
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Jeongil MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20240414919
- Publication date Dec 12, 2024
- SEMES CO., LTD.
- Sung Min CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DRY ETCHING USING PLASMA
- Publication number 20240412979
- Publication date Dec 12, 2024
- Research & Business Foundation Sungkyunkwan University
- Geun Young YEOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND SYSTEMS FOR AMMONIA/CHLORINE CHEMISTRY SEMICONDUCTO...
- Publication number 20240412953
- Publication date Dec 12, 2024
- LAM RESEARCH CORPORATION
- Bradley Taylor Streng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE ADJUSTING SYSTEM, TEMPERATURE ADJUSTING METHOD, SUBSTRA...
- Publication number 20240412955
- Publication date Dec 12, 2024
- TOKYO ELECTRON LIMITED
- Masahiko YOKOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH TEMPERATURE BIASABLE HEATER WITH ADVANCED FAR EDGE ELECTRODE,...
- Publication number 20240412957
- Publication date Dec 12, 2024
- Applied Materials, Inc.
- Gautam PISHARODY
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the type of processing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wafer treatment system and method of treating wafer

Reduced ripple in switch mode power supply with snubber

Gas nozzle, manufacturing method of gas nozzle, and plasma treatmen...

Bottom and middle edge rings

Remote source pulsing with advanced pulse control

Voltage waveform generator for plasma assisted processing apparatuses

Apparatus for temperature control in a substrate processing chamber

Substrate processing device

Cleaning method and plasma processing apparatus

Method and apparatus for filling a recess formed within a substrate...

Scanning ion beam deposition and etch

Apparatus and method for processing substrate using plasma

Gas transport system

System and method for particle control in MRAM processing

Semiconductor manufacturing apparatus and method for manufacturing...

Magnetron design for improved bottom coverage and uniformity

Showerhead assembly with heated showerhead

Plasma abatement system utilizing water vapor and oxygen reagent

Vacuum deposition into trenches and vias and etch of trenches and via

Coating apparatus and coating method

Deposition method and plasma processing apparatus

Ceramic sintered body and member for plasma processing apparatus

Substrate support and substrate processing apparatus

Methods and systems for advanced ion control for etching processes

Semiconductor mask reshaping using a sacrificial layer

Optical diagnostics of semiconductor process using hyperspectral im...

Dual-frequency, direct-drive inductively coupled plasma source

Uniformity control circuit for impedance match

Plasma processing method for manufacturing semiconductor structure

Ceramic heater

Patents Applicationslast 30 patents

PLASMA PROCESSING APPARATUS

GLASS BLOCK, METHOD FOR PRODUCING SAME, AND PLASMA-RESISTANT MEMBER

PHYSICAL VAPOR DEPOSITION (PVD) WITH TARGET EROSION PROFILE MONITORING

SEMICONDUCTOR PROCESSING PRECLEAN METHODS AND APPARATUS

PLASMA TREATMENT APPARATUS

SUBSTRATE PROCESSING METHOD

TRANSITION CONTROL IN A BIAS SUPPLY

INCREASED ETCH RATES OF SILICON-CONTAINING MATERIALS

SUBSTRATE PROCESSING APPARATUS HAVING A MIDDLE ELECTRODE

WAFER EDGE RING LIFTING SOLUTION

PLASMA SHIELD ASSEMBLY AND PLASMA PROCESSING APPARATUS INCLUDING TH...

METHOD, SYSTEM, AND APPARATUS FOR DEPOSITION OF TRANSITION METAL FILM

METHODS OF SELECTIVELY ETCHING SILICON NITRIDE

MODIFICATION OF METAL-CONTAINING SURFACES IN HIGH ASPECT RATIO PLAS...

SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL

SEMICONDUCTOR MANUFACTURING PROCESS CHAMBER COOLING FLANGE FOR REMO...

SYSTEM AND METHOD FOR CARBON PLUG FORMATION

EXTREME EDGE FEATURE PROFILE TILT CONTROL BY ALTERING INPUT VOLTAGE...

ROTATING SUBSTRATE SUPPORT

SUBSTRATE SUPPORT

IN-SITU ETCH AND INHIBITION IN PLASMA ENHANCED ATOMIC LAYER DEPOSITION

PLASMA CHAMBER HAVING SWIRL MOTION SIDE GAS FEED

RESISTIVITY-CONTROLLED DIELECTRIC MATERIALS FOR SUBSTRATE SUPPORTS...

PROCESS CHAMBERS HAVING MULTIPLE COOLING PLATES

PLASMA PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

METHOD FOR DRY ETCHING USING PLASMA

APPARATUSES AND SYSTEMS FOR AMMONIA/CHLORINE CHEMISTRY SEMICONDUCTO...

TEMPERATURE ADJUSTING SYSTEM, TEMPERATURE ADJUSTING METHOD, SUBSTRA...

HIGH TEMPERATURE BIASABLE HEATER WITH ADVANCED FAR EDGE ELECTRODE,...