characterised by the type of processing

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CPC
H01J2237/33

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Parent Industries

HELECTRICITY H01Electric elements H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS H01J2237/00Discharge tubes exposing object to beam

Current Industry

H01J2237/33characterised by the type of processing

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Workpiece processing apparatus with outer gas channel insert
- Patent number 12,340,981
- Issue date Jun 24, 2025
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Maolin Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ring carrier and substrate treating system
- Patent number 12,340,988
- Issue date Jun 24, 2025
- Semes Co., Ltd.
- Mun Gi Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition tool and method for filling deep trenches
- Patent number 12,341,065
- Issue date Jun 24, 2025
- Intel Corporation
- Elijah V. Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus
- Patent number 12,340,975
- Issue date Jun 24, 2025
- Tokyo Electron Limited
- Takehisa Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance matching circuit and plasma supply system and operating m...
- Patent number 12,341,478
- Issue date Jun 24, 2025
- TRUMPF Huettinger GmbH + Co. KG
- Birger Nordmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for plasma-assisted and multi-step continuous preparation of...
- Patent number 12,340,982
- Issue date Jun 24, 2025
- Anhui University of Technology
- Yang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for treating substrate and method for treating substrate
- Patent number 12,340,983
- Issue date Jun 24, 2025
- Semes Co., Ltd.
- Dong-Hun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shutter disk for physical vapor deposition (PVD) chamber
- Patent number 12,338,527
- Issue date Jun 24, 2025
- Applied Materials, Inc.
- Zhiyong Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Member for semiconductor manufacturing apparatus
- Patent number 12,340,990
- Issue date Jun 24, 2025
- NGK Insulators, Ltd.
- Hiroshi Takebayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 12,341,020
- Issue date Jun 24, 2025
- Tokyo Electron Limited
- Ryutaro Suda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and plasma processing method
- Patent number 12,340,986
- Issue date Jun 24, 2025
- Tokyo Electron Limited
- Hiroyuki Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate fixing device
- Patent number 12,340,991
- Issue date Jun 24, 2025
- Shinko Electric Industries Co., Ltd.
- Aya Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning method and plasma processing apparatus
- Patent number 12,341,001
- Issue date Jun 24, 2025
- Tokyo Electron Limited
- Wakako Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing method and plasma processing apparatus
- Patent number 12,338,532
- Issue date Jun 24, 2025
- Tokyo Electron Limited
- Taro Ikeda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tunable plasma exclusion zone in semiconductor fabrication
- Patent number 12,340,987
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Che Wei Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ruthenium-based sputtering target and method for manufacturing same
- Patent number 12,340,995
- Issue date Jun 24, 2025
- Furuya Metal Co., Ltd.
- Tomohiro Maruko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support gap pumping to prevent glow discharge and light-up
- Patent number 12,334,383
- Issue date Jun 17, 2025
- Applied Materials, Inc.
- James David Carducci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method
- Patent number 12,336,436
- Issue date Jun 17, 2025
- Tokyo Electron Limited
- Takuya Kubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch-type apparatus for atomic layer etching (ALE), and ALE method...
- Patent number 12,334,308
- Issue date Jun 17, 2025
- Samsung Electronics Co., Ltd.
- Hanjin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remote plasma ultraviolet enhanced deposition
- Patent number 12,334,317
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hai-Dang Trinh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing method and plasma processing apparatus
- Patent number 12,334,331
- Issue date Jun 17, 2025
- Tokyo Electron Limited
- Takayuki Katsunuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing device
- Patent number 12,331,403
- Issue date Jun 17, 2025
- Tokyo Electron Limited
- Munehito Kagaya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cryogenic micro-zone electrostatic chuck connector assembly
- Patent number 12,331,984
- Issue date Jun 17, 2025
- Applied Materials, Inc.
- Vijay D. Parkhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration processes utilizing boron-doped silicon materials
- Patent number 12,334,358
- Issue date Jun 17, 2025
- Applied Materials, Inc.
- Takehito Koshizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuits for edge ring control in shaped dc pulsed plasma process d...
- Patent number 12,334,311
- Issue date Jun 17, 2025
- Applied Materials, Inc.
- Linying Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etcher uniformity control by tuning edge zone plasma sheath
- Patent number 12,334,314
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Lung Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and plasma processing method
- Patent number 12,334,316
- Issue date Jun 17, 2025
- HITACHI HIGH-TECH CORPORATION
- Takamasa Ichino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Physical vapor deposition (PVD) with target erosion profile monitoring
- Patent number 12,334,319
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hsi Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated showerhead with thermal control for delivering radical a...
- Patent number 12,331,402
- Issue date Jun 17, 2025
- Lam Research Corporation
- Rachel E. Batzer
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
RF impedance matching network
- Patent number 12,334,306
- Issue date Jun 17, 2025
- ASM America, Inc.
- Imran Ahmed Bhutta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING APPARATUS USING MICROWAVES
- Publication number 20250210316
- Publication date Jun 26, 2025
- SEMES CO., LTD.
- Yoon Seok CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple State Pulsing for High Aspect Ratio Etch
- Publication number 20250210364
- Publication date Jun 26, 2025
- LAM RESEARCH CORPORATION
- Aniruddha Joi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20250210370
- Publication date Jun 26, 2025
- TOKYO ELECTRON LIMITED
- Fumiya TAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT TRANSFER MEMBER, METHOD FOR MANUFACTURING HEAT TRANSFER MEMBER...
- Publication number 20250210318
- Publication date Jun 26, 2025
- MITSUBISHI MATERIALS CORPORATION
- Miho Shoji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20250210322
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- HYUNJAE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20250210328
- Publication date Jun 26, 2025
- TOKYO ELECTRON LIMITED
- Sho KUMAKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20250210330
- Publication date Jun 26, 2025
- TOKYO ELECTRON LIMITED
- Naoki MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20250210331
- Publication date Jun 26, 2025
- TOKYO ELECTRON LIMITED
- Takumi IMAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS INCLUDING SUBSTRATE SUPPORT UNIT
- Publication number 20250210395
- Publication date Jun 26, 2025
- SEMES CO., LTD.
- Kuk Saeng KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FORMING METHOD AND FILM FORMING SYSTEM
- Publication number 20250207261
- Publication date Jun 26, 2025
- TOKYO ELECTRON LIMITED
- Ryota IFUKU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrode and Coil Configurations For Processing Chambers and Relat...
- Publication number 20250210304
- Publication date Jun 26, 2025
- Applied Materials, Inc.
- Ala MORADIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR PROCESSING CHAMBERS AND RELATED HEATING CONFIGURATIONS, MET...
- Publication number 20250210315
- Publication date Jun 26, 2025
- Applied Materials, Inc.
- Ala MORADIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF TREATING A SEMICONDUCTOR SUBSTRATE AND APPARATUS
- Publication number 20250210362
- Publication date Jun 26, 2025
- SPTS TECHNOLOGIES LIMITED
- Eloise BOND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20250210307
- Publication date Jun 26, 2025
- TOKYO ELECTRON LIMITED
- Sho SAITOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA INJECTION CONFIGURATIONS FOR PROCESSING CHAMBERS, AND RELATE...
- Publication number 20250210314
- Publication date Jun 26, 2025
- Applied Materials, Inc.
- Ala MORADIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE CONFIGURATIONS AND MAGNET CONFIGURATIONS FOR PROCESSING C...
- Publication number 20250210319
- Publication date Jun 26, 2025
- Applied Materials, Inc.
- Ala MORADIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-FORMING DEVICE
- Publication number 20250210320
- Publication date Jun 26, 2025
- National University Corporation TOYOHASHI UNIVERSITY OF TECHNOLOGY
- Hirofumi TAKIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHUTTER SYSTEM FOR GAP-FREE SHIELDING OF A COATING SOURCE, AND ASSO...
- Publication number 20250210332
- Publication date Jun 26, 2025
- FHR Anlagenbau GmbH
- Sven HAEBERLEIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAST ATOMIC LAYER ETCH
- Publication number 20250210363
- Publication date Jun 26, 2025
- LAM RESEARCH CORPORATION
- Wenbing YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD, PROCESS MODULE MATCHING METHOD, AND SUBSTRATE...
- Publication number 20250210310
- Publication date Jun 26, 2025
- SEMES CO., LTD.
- Sang Moon YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20250210313
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Sunwoo BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20250210321
- Publication date Jun 26, 2025
- SEMES CO., LTD.
- Hyoung Kyu SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20250210327
- Publication date Jun 26, 2025
- TOKYO ELECTRON LIMITED
- Takahiro YONEZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING OF SILICON OXIDE AT CRYOGENIC TEMPERATURE
- Publication number 20250210367
- Publication date Jun 26, 2025
- Applied Materials, Inc.
- Sonam Dorje SHERPA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250210371
- Publication date Jun 26, 2025
- TOKYO ELECTRON LIMITED
- Akihiro ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Treating the Dielectric Films Under the Bottoms of Source/Drain Reg...
- Publication number 20250203969
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Hsiang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR REDUCING PHOTORESIST AND CARBON ETCH RATES IN AN ICP PR...
- Publication number 20250201573
- Publication date Jun 19, 2025
- Applied Materials, Inc.
- Sonam Dorje SHERPA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Plasma Source Array
- Publication number 20250201517
- Publication date Jun 19, 2025
- Beijing E-Town Semiconductor Technology Co., LTD
- Maolin Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR DEPOSITING A LAYER
- Publication number 20250201526
- Publication date Jun 19, 2025
- ASM IP HOLDING B.V.
- Daniele Piumi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING SYSTEM
- Publication number 20250201536
- Publication date Jun 19, 2025
- TOKYO ELECTRON LIMITED
- Mitsuhiro IWANO
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the type of processing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Workpiece processing apparatus with outer gas channel insert

Ring carrier and substrate treating system

Deposition tool and method for filling deep trenches

Plasma processing apparatus

Impedance matching circuit and plasma supply system and operating m...

Method for plasma-assisted and multi-step continuous preparation of...

Apparatus for treating substrate and method for treating substrate

Shutter disk for physical vapor deposition (PVD) chamber

Member for semiconductor manufacturing apparatus

Substrate processing method and substrate processing apparatus

Plasma processing apparatus and plasma processing method

Substrate fixing device

Cleaning method and plasma processing apparatus

Plasma processing method and plasma processing apparatus

Tunable plasma exclusion zone in semiconductor fabrication

Ruthenium-based sputtering target and method for manufacturing same

Substrate support gap pumping to prevent glow discharge and light-up

Etching method

Batch-type apparatus for atomic layer etching (ALE), and ALE method...

Remote plasma ultraviolet enhanced deposition

Substrate processing method and plasma processing apparatus

Substrate processing method and substrate processing device

Cryogenic micro-zone electrostatic chuck connector assembly

Integration processes utilizing boron-doped silicon materials

Circuits for edge ring control in shaped dc pulsed plasma process d...

Dry etcher uniformity control by tuning edge zone plasma sheath

Plasma processing apparatus and plasma processing method

Physical vapor deposition (PVD) with target erosion profile monitoring

Integrated showerhead with thermal control for delivering radical a...

RF impedance matching network

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING APPARATUS USING MICROWAVES

Multiple State Pulsing for High Aspect Ratio Etch

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

HEAT TRANSFER MEMBER, METHOD FOR MANUFACTURING HEAT TRANSFER MEMBER...

SUBSTRATE PROCESSING APPARATUS

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM

PLASMA PROCESSING APPARATUS AND SUBSTRATE PROCESSING SYSTEM

PLASMA PROCESSING APPARATUS

SUBSTRATE PROCESSING APPARATUS INCLUDING SUBSTRATE SUPPORT UNIT

FILM FORMING METHOD AND FILM FORMING SYSTEM

Electrode and Coil Configurations For Processing Chambers and Relat...

MODULAR PROCESSING CHAMBERS AND RELATED HEATING CONFIGURATIONS, MET...

METHODS OF TREATING A SEMICONDUCTOR SUBSTRATE AND APPARATUS

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

PLASMA INJECTION CONFIGURATIONS FOR PROCESSING CHAMBERS, AND RELATE...

ELECTRODE CONFIGURATIONS AND MAGNET CONFIGURATIONS FOR PROCESSING C...

FILM-FORMING DEVICE

SHUTTER SYSTEM FOR GAP-FREE SHIELDING OF A COATING SOURCE, AND ASSO...

FAST ATOMIC LAYER ETCH

MANUFACTURING METHOD, PROCESS MODULE MATCHING METHOD, AND SUBSTRATE...

APPARATUS FOR PROCESSING A SUBSTRATE

SUBSTRATE PROCESSING APPARATUS

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

ATOMIC LAYER ETCHING OF SILICON OXIDE AT CRYOGENIC TEMPERATURE

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

Treating the Dielectric Films Under the Bottoms of Source/Drain Reg...

METHODS FOR REDUCING PHOTORESIST AND CARBON ETCH RATES IN AN ICP PR...

Hybrid Plasma Source Array

METHODS AND SYSTEMS FOR DEPOSITING A LAYER

PLASMA PROCESSING METHOD AND PLASMA PROCESSING SYSTEM