characterised by their behaviour during the process

Industry

CPC
H01L21/3085

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/3085characterised by their behaviour during the process

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Vertical device having a protrusion source
- Patent number 12,349,435
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- De-Fang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-color self-aligned double patterning (SADP) to yield static ran...
- Patent number 12,327,730
- Issue date Jun 10, 2025
- Adeia Semiconductor Solutions LLC
- Fee Li Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternating hardmasks for tight-pitch line formation
- Patent number 12,322,601
- Issue date Jun 3, 2025
- Adeia Semiconductor Solutions LLC
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure etching solution and method for fabricating...
- Patent number 12,308,239
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chung-Chieh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of cutting a fine pattern, methods of forming active patter...
- Patent number 12,293,921
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Sanggyo Chung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Edge fin trim process
- Patent number 12,283,526
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Chun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing memory device with first and second isolati...
- Patent number 12,278,138
- Issue date Apr 15, 2025
- NANYA TECHNOLOGY CORPORATION
- Cheng-Ling Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mid-processing removal of semiconductor fins during fabrication of...
- Patent number 12,266,536
- Issue date Apr 1, 2025
- Intel Corporation
- Mehmet O. Baykan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor and fabricating method of the same
- Patent number 12,261,052
- Issue date Mar 25, 2025
- United Microelectronics Corp.
- Ming-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Managing trench depth in integrated systems
- Patent number 12,249,540
- Issue date Mar 11, 2025
- Ciena Corporation
- Benoît Filion
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing memory device having active area in elongat...
- Patent number 12,237,209
- Issue date Feb 25, 2025
- NANYA TECHNOLOGY CORPORATION
- Cheng-Ling Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon dry etching method
- Patent number 12,217,969
- Issue date Feb 4, 2025
- ULVAC, Inc.
- Kenta Doi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage system, query system and storage method for reticles, and c...
- Patent number 12,191,177
- Issue date Jan 7, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xueyu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and etching apparatus
- Patent number 12,142,495
- Issue date Nov 12, 2024
- Tokyo Electron Limited
- Toshiki Kanaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced etching technologies for straight, tall and uniform fins a...
- Patent number 12,131,912
- Issue date Oct 29, 2024
- Intel Corporation
- Muralidhar S. Ambati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of patterning a substrate using a sidewall spacer etch mask
- Patent number 12,099,299
- Issue date Sep 24, 2024
- Tokyo Electron Limited
- Jodi Grzeskowiak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin-based antifuse structure having gate stacks biased at different...
- Patent number 12,094,818
- Issue date Sep 17, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xiong LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processed stacked dies
- Patent number 12,068,278
- Issue date Aug 20, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned double patterning
- Patent number 12,068,167
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,068,394
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having planar transistor and FinFET
- Patent number 12,009,262
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Barn Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor and fabricating method of the same
- Patent number 12,002,681
- Issue date Jun 4, 2024
- United Microelectronics Corp.
- Ming-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-color self-aligned double patterning (SADP) to yield static ran...
- Patent number 11,978,639
- Issue date May 7, 2024
- TESSERA LLC
- Fee Li Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing semiconductor structures and methods for for...
- Patent number 11,978,636
- Issue date May 7, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ning Xi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical device having a protrusion source
- Patent number 11,916,131
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- De-Fang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improved critical dimension uniformity in a semiconducto...
- Patent number 11,901,188
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Cheng Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 11,894,446
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ling-Yen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mid-processing removal of semiconductor fins during fabrication of...
- Patent number 11,887,860
- Issue date Jan 30, 2024
- Intel Corporation
- Mehmet O. Baykan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial fin structures of finFET having an epitaxial buffer regio...
- Patent number 11,888,046
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsueh-Chang Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of cutting fin
- Patent number 11,881,409
- Issue date Jan 23, 2024
- United Microelectronics Corp.
- Wei-Hao Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MID-PROCESSING REMOVAL OF SEMICONDUCTOR FINS DURING FABRICATION OF...
- Publication number 20250218787
- Publication date Jul 3, 2025
- Intel Corporation
- Mehmet O. Baykan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICES HAVING LINERS
- Publication number 20250159944
- Publication date May 15, 2025
- Micron Technology, Inc.
- Christopher J. Larsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structures and Methods of Forming Them
- Publication number 20250006503
- Publication date Jan 2, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ting LIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE WET CHANNELS FOR WATER DRAINAGE PPLICATIONS
- Publication number 20240421104
- Publication date Dec 19, 2024
- SAUDI ARABIANOIL COMPANY
- Dong Kyu Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSED STACKED DIES
- Publication number 20240404990
- Publication date Dec 5, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING VERTICAL POWER TRANSISTORS AND VERTICAL POWER...
- Publication number 20240404836
- Publication date Dec 5, 2024
- ROBERT BOSCH GmbH
- Jens Baringhaus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240363730
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING PLANAR TRANSISTOR AND FINFET
- Publication number 20240297079
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Barn CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-COLOR SELF-ALIGNED DOUBLE PATTERNING (SADP) TO YIELD STATIC RAN...
- Publication number 20240258113
- Publication date Aug 1, 2024
- Adeia Semiconductor Solutions LLC
- Fee Li Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR AND FABRICATING METHOD OF THE SAME
- Publication number 20240222133
- Publication date Jul 4, 2024
- UNITED MICROELECTRONICS CORP.
- Ming-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Vertical Device
- Publication number 20240186400
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- DE-FANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20240145582
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ling-Yen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED ETCHING TECHNOLOGIES FOR STRAIGHT, TALL AND UNIFORM FINS A...
- Publication number 20240120206
- Publication date Apr 11, 2024
- Intel Corporation
- Muralidhar S. AMBATI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL FIN STRUCTURES OF FINFET HAVING AN EPITAXIAL BUFFER REGIO...
- Publication number 20240088266
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsueh-Chang Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-COLOR SELF-ALIGNED DOUBLE PATTERNING (SADP) TO YIELD STATIC RAN...
- Publication number 20240079247
- Publication date Mar 7, 2024
- TESSERA LLC
- Fee Li Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF CUTTING A FINE PATTERN, METHODS OF FORMING ACTIVE PATTER...
- Publication number 20240063024
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Sanggyo Chung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ALTERNATING HARDMASKS FOR TIGHT-PITCH LINE FORMATION
- Publication number 20240030036
- Publication date Jan 25, 2024
- TESSERA LLC
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIST COMPOUND AND UNDERLAYER COMPOUND FOR PHOTOLITHOGRAPHY, MULTI...
- Publication number 20230375932
- Publication date Nov 23, 2023
- Inha University Research and Business Foundation
- Jinkyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERLAYER COMPOUND FOR PHOTOLITHOGRAPHY, MULTILAYERED STRUCTURE FO...
- Publication number 20230375927
- Publication date Nov 23, 2023
- Inha University Research and Business Foundation
- Jinkyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE ETCHING SOLUTION AND METHOD FOR FABRICATING...
- Publication number 20230369058
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUNG-CHIEH LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERNING A SUBSTRATE USING A SIDEWALL SPACER ETCH MASK
- Publication number 20230367217
- Publication date Nov 16, 2023
- TOKYO ELECTRON LIMITED
- Jodi GRZESKOWIAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF FINS USING VARIABLE SPACERS
- Publication number 20230360923
- Publication date Nov 9, 2023
- Adeia Semiconductor Solutions LLC
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MEMORY DEVICE HAVING ACTIVE AREA IN ELONGAT...
- Publication number 20230360958
- Publication date Nov 9, 2023
- NANYA TECHNOLOGY CORPORATION
- CHENG-LING YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MEMORY DEVICE HAVING ACTIVE AREA IN ELONGAT...
- Publication number 20230360959
- Publication date Nov 9, 2023
- NANYA TECHNOLOGY CORPORATION
- CHENG-LING YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MID-PROCESSING REMOVAL OF SEMICONDUCTOR FINS DURING FABRICATION OF...
- Publication number 20230343599
- Publication date Oct 26, 2023
- Intel Corporation
- Mehmet O. Baykan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Masking Layer with Post Treatment
- Publication number 20230335406
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSED STACKED DIES
- Publication number 20230282610
- Publication date Sep 7, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Aligned Double Patterning
- Publication number 20230282488
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20230238245
- Publication date Jul 27, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Bo SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ETCHED SILICON CARBIDE
- Publication number 20230215732
- Publication date Jul 6, 2023
- SPTS TECHNOLOGIES LIMITED
- Alex CROOT
- H01 - BASIC ELECTRIC ELEMENTS

characterised by their behaviour during the process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Vertical device having a protrusion source

Two-color self-aligned double patterning (SADP) to yield static ran...

Alternating hardmasks for tight-pitch line formation

Semiconductor structure etching solution and method for fabricating...

Methods of cutting a fine pattern, methods of forming active patter...

Edge fin trim process

Method of manufacturing memory device with first and second isolati...

Mid-processing removal of semiconductor fins during fabrication of...

High electron mobility transistor and fabricating method of the same

Managing trench depth in integrated systems

Method of manufacturing memory device having active area in elongat...

Silicon dry etching method

Storage system, query system and storage method for reticles, and c...

Etching method and etching apparatus

Advanced etching technologies for straight, tall and uniform fins a...

Method of patterning a substrate using a sidewall spacer etch mask

Fin-based antifuse structure having gate stacks biased at different...

Processed stacked dies

Self-aligned double patterning

Semiconductor device and manufacturing method thereof

Semiconductor device having planar transistor and FinFET

High electron mobility transistor and fabricating method of the same

Two-color self-aligned double patterning (SADP) to yield static ran...

Methods for processing semiconductor structures and methods for for...

Vertical device having a protrusion source

Method for improved critical dimension uniformity in a semiconducto...

Method of manufacturing a semiconductor device

Mid-processing removal of semiconductor fins during fabrication of...

Epitaxial fin structures of finFET having an epitaxial buffer regio...

Method of cutting fin

Patents Applicationslast 30 patents

MID-PROCESSING REMOVAL OF SEMICONDUCTOR FINS DURING FABRICATION OF...

METHODS OF FORMING SEMICONDUCTOR DEVICES HAVING LINERS

Semiconductor Structures and Methods of Forming Them

SELECTIVE WET CHANNELS FOR WATER DRAINAGE PPLICATIONS

PROCESSED STACKED DIES

METHOD FOR PRODUCING VERTICAL POWER TRANSISTORS AND VERTICAL POWER...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE HAVING PLANAR TRANSISTOR AND FINFET

TWO-COLOR SELF-ALIGNED DOUBLE PATTERNING (SADP) TO YIELD STATIC RAN...

HIGH ELECTRON MOBILITY TRANSISTOR AND FABRICATING METHOD OF THE SAME

Method of Forming a Vertical Device

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

ADVANCED ETCHING TECHNOLOGIES FOR STRAIGHT, TALL AND UNIFORM FINS A...

EPITAXIAL FIN STRUCTURES OF FINFET HAVING AN EPITAXIAL BUFFER REGIO...

TWO-COLOR SELF-ALIGNED DOUBLE PATTERNING (SADP) TO YIELD STATIC RAN...

METHODS OF CUTTING A FINE PATTERN, METHODS OF FORMING ACTIVE PATTER...

ALTERNATING HARDMASKS FOR TIGHT-PITCH LINE FORMATION

RESIST COMPOUND AND UNDERLAYER COMPOUND FOR PHOTOLITHOGRAPHY, MULTI...

UNDERLAYER COMPOUND FOR PHOTOLITHOGRAPHY, MULTILAYERED STRUCTURE FO...

SEMICONDUCTOR STRUCTURE ETCHING SOLUTION AND METHOD FOR FABRICATING...

METHOD OF PATTERNING A SUBSTRATE USING A SIDEWALL SPACER ETCH MASK

FABRICATION OF FINS USING VARIABLE SPACERS

METHOD OF MANUFACTURING MEMORY DEVICE HAVING ACTIVE AREA IN ELONGAT...

METHOD OF MANUFACTURING MEMORY DEVICE HAVING ACTIVE AREA IN ELONGAT...

MID-PROCESSING REMOVAL OF SEMICONDUCTOR FINS DURING FABRICATION OF...

Masking Layer with Post Treatment

PROCESSED STACKED DIES

Self-Aligned Double Patterning

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

PLASMA ETCHED SILICON CARBIDE