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Masking Layer with Post Treatment
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Publication number 20230335406
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Publication date Oct 19, 2023
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Wen-Ju Chen
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H01 - BASIC ELECTRIC ELEMENTS
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PROCESSED STACKED DIES
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Publication number 20230282610
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Publication date Sep 7, 2023
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ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
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Cyprian Emeka Uzoh
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H01 - BASIC ELECTRIC ELEMENTS
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Self-Aligned Double Patterning
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Publication number 20230282488
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Publication date Sep 7, 2023
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Kuan-Wei Huang
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H01 - BASIC ELECTRIC ELEMENTS
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PLASMA ETCHED SILICON CARBIDE
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Publication number 20230215732
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Publication date Jul 6, 2023
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SPTS TECHNOLOGIES LIMITED
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Alex CROOT
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H01 - BASIC ELECTRIC ELEMENTS
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METHOD OF CUTTING FIN
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Publication number 20220384200
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Publication date Dec 1, 2022
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UNITED MICROELECTRONICS CORP.
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Wei-Hao Huang
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H01 - BASIC ELECTRIC ELEMENTS
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Self-Aligned Double Patterning
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Publication number 20220384201
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Publication date Dec 1, 2022
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Kuan-Wei Huang
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H01 - BASIC ELECTRIC ELEMENTS
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Germanium Hump Reduction
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Publication number 20220375756
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Publication date Nov 24, 2022
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Shih-Hao Fu
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H01 - BASIC ELECTRIC ELEMENTS
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EDGE FIN TRIM PROCESS
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Publication number 20220301937
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Publication date Sep 22, 2022
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Jen-Chun Chou
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H01 - BASIC ELECTRIC ELEMENTS