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H01L21/3081

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/3081characterised by their composition

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 12,165,923
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuan-Hui Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,166,069
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Zheng-Long Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
GaN vertical-channel junction field-effect transistors with regrown...
- Patent number 12,159,943
- Issue date Dec 3, 2024
- Arizona Board of Regents on behalf of Arizona State University
- Yuji Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures and manufacturing methods thereof
- Patent number 12,148,613
- Issue date Nov 19, 2024
- ENKRIS SEMICONDUCTOR, INC.
- Kai Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods, systems, and apparatus for processing substrates using one...
- Patent number 12,131,913
- Issue date Oct 29, 2024
- Applied Materials, Inc.
- Krishna Nittala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for forming the same prel...
- Patent number 12,125,912
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lin-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming semiconductor structure
- Patent number 12,120,869
- Issue date Oct 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Mengna Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dies and methods for forming bonded structures
- Patent number 12,113,056
- Issue date Oct 8, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Humidity control or aqueous treatment for EUV metallic resist
- Patent number 12,106,961
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- An-Ren Zi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern sheet, semiconductor intermediate product, and hole etching...
- Patent number 12,106,970
- Issue date Oct 1, 2024
- BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Qiushi Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for forming patterned structures including silico...
- Patent number 12,100,597
- Issue date Sep 24, 2024
- ASM IP Holding B.V.
- Eiichiro Shiba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composition for forming silicon-containing resist underlayer film a...
- Patent number 12,085,857
- Issue date Sep 10, 2024
- Shin-Etsu Chemical Co., Ltd.
- Tsutomu Ogihara
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for forming semiconductor structure with fins using a multil...
- Patent number 12,087,641
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ting Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical-resistant protective film-forming composition containing p...
- Patent number 12,077,633
- Issue date Sep 3, 2024
- NISSAN CHEMICAL CORPORATION
- Takafumi Endo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Formation method of semiconductor structure
- Patent number 12,080,589
- Issue date Sep 3, 2024
- Shanghai IC R&D Center Co., Ltd.
- Weijun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried metal for FinFET device and method
- Patent number 12,080,588
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lei-Chun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid scheme for improved performance for P-type and N-type FinFETs
- Patent number 12,074,167
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming fin field-effect transistors
- Patent number 12,068,199
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High etch selectivity, low stress ashable carbon hard mask
- Patent number 12,062,537
- Issue date Aug 13, 2024
- Lam Research Corporation
- Jun Xue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Techniques for achieving multiple transistor fin dimensions on a si...
- Patent number 12,046,600
- Issue date Jul 23, 2024
- Intel Corporation
- Glenn A. Glass
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing semiconductor...
- Patent number 12,046,478
- Issue date Jul 23, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Luguang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet etching chemistry and method of forming semiconductor device us...
- Patent number 12,046,476
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Hsien Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor and method for fabricating the same
- Patent number 12,027,604
- Issue date Jul 2, 2024
- United Microelectronics Corp.
- Chun-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for achieving multiple transistor fin dimensions on a si...
- Patent number 12,021,081
- Issue date Jun 25, 2024
- Intel Corporation
- Glenn A. Glass
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing resist layer, method of forming a pattern and m...
- Patent number 12,013,645
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christine Y Ouyang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor and fabricating method of the same
- Patent number 12,002,681
- Issue date Jun 4, 2024
- United Microelectronics Corp.
- Ming-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical field effect transistor with crosslink fin arrangement
- Patent number 12,002,856
- Issue date Jun 4, 2024
- International Business Machines Corporation
- Indira Seshadri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tip-to-tip graphic preparation method
- Patent number 12,002,682
- Issue date Jun 4, 2024
- Shanghai IC R&D Center Co., Ltd.
- Yanli Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern forming method and method for manufacturing semiconductor d...
- Patent number 11,996,295
- Issue date May 28, 2024
- Kioxia Corporation
- Hironobu Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dose reduction of patterned metal oxide photoresists
- Patent number 11,994,800
- Issue date May 28, 2024
- Applied Materials, Inc.
- Tejinder Singh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESSING SOLUTION FOR SEMICONDUCTOR DEVICE, METHOD FOR PROCESSING...
- Publication number 20240417648
- Publication date Dec 19, 2024
- Tokyo Ohka Kogyo Co., Ltd.
- Kenta Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOLITHOGRAPHY METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR D...
- Publication number 20240411227
- Publication date Dec 12, 2024
- Korea Advanced Institute of Science and Technology
- Sung Gap Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING VERTICAL POWER TRANSISTORS AND VERTICAL POWER...
- Publication number 20240404836
- Publication date Dec 5, 2024
- ROBERT BOSCH GmbH
- Jens Baringhaus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ETCH SELECTIVITY, LOW STRESS ASHABLE CARBON HARD MASK
- Publication number 20240395542
- Publication date Nov 28, 2024
- LAM RESEARCH CORPORATION
- Jun XUE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FINFET DEVICE AND METHOD OF FORMING SAME
- Publication number 20240387237
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Cyuan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE DEVICE
- Publication number 20240387284
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240379852
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lin-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HARDMASK COMPOSITION, HARDMASK LAYER, AND METHOD OF FORMING PATTERNS
- Publication number 20240376342
- Publication date Nov 14, 2024
- Samsung SDI Co., Ltd.
- Seil CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HARDMASK COMPOSITION, HARDMASK LAYER, AND METHOD OF FORMING PATTERNS
- Publication number 20240377746
- Publication date Nov 14, 2024
- Samsung SDI Co., Ltd.
- Seil CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING LOW-STRESS SILICON NITRIDE LAYER THROUGH HYDROGEN TREATMENT
- Publication number 20240379346
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE REGION PATTERNING
- Publication number 20240379675
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20240363436
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ting KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Fin Structures
- Publication number 20240363422
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Buried Metal for FinFET Device and Method
- Publication number 20240363393
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lei-Chun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composition For Forming Organic Film, Method For Forming Organic Fi...
- Publication number 20240355632
- Publication date Oct 24, 2024
- Shin-Etsu Chemical Co., Ltd.
- Yasuyuki YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SUBSTRATE FOR FABRICATION OF BETA GALLIUM OXIDE DEVICES
- Publication number 20240347339
- Publication date Oct 17, 2024
- Syrnatec, Inc.
- Yash Suresh Mirchandani
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE USING WET ETCHING CHEMISTRY
- Publication number 20240339327
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsien Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20240332059
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Youngin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME
- Publication number 20240322008
- Publication date Sep 26, 2024
- UNITED MICROELECTRONICS CORP.
- Chun-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compound For Forming Metal-Containing Film, Composition For Forming...
- Publication number 20240321585
- Publication date Sep 26, 2024
- Shin-Etsu Chemical Co., Ltd.
- Naoki KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Forming Resist Underlayer Film And Patterning Process
- Publication number 20240310732
- Publication date Sep 19, 2024
- Shin-Etsu Chemical Co., Ltd.
- Naoki KOBAYASHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HARDMASK COMPOSITION, HARDMASK LAYER AND METHOD OF FORMING PATTERNS
- Publication number 20240309238
- Publication date Sep 19, 2024
- Samsung SDI Co., Ltd.
- Yunju Chae
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COMPOSITION FOR FORMING SILICON-CONTAINING UNDERLAYER FILM FOR INDU...
- Publication number 20240302744
- Publication date Sep 12, 2024
- NISSAN CHEMICAL CORPORATION
- Shuhei SHIGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NAPHTHALENE UNIT-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION
- Publication number 20240302747
- Publication date Sep 12, 2024
- NISSAN CHEMICAL CORPORATION
- Hiroto OGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING AN ETCHING MASK, METHOD OF ETCHING A STRUCTURE...
- Publication number 20240304446
- Publication date Sep 12, 2024
- JENOPTIK OPTICAL SYSTEMS GMBH
- Meik PANITZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20240297047
- Publication date Sep 5, 2024
- WINBOND ELECTRONICS CORP.
- Kun-Che Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION
- Publication number 20240295815
- Publication date Sep 5, 2024
- NISSAN CHEMICAL CORPORATION
- Wataru SHIBAYAMA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD FOR REMOVING RESIST LAYER, METHOD OF FORMING A PATTERN AND M...
- Publication number 20240288776
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christine Y. Ouyang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
TECHNIQUES FOR ACHIEVING MULTIPLE TRANSISTOR FIN DIMENSIONS ON A SI...
- Publication number 20240290789
- Publication date Aug 29, 2024
- Intel Corporation
- GLENN A. GLASS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTORESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, METHOD...
- Publication number 20240288768
- Publication date Aug 29, 2024
- TOKYO ELECTRON LIMITED
- Seiji NAGAHARA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

characterised by their composition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing a semiconductor device

Semiconductor device and manufacturing method thereof

GaN vertical-channel junction field-effect transistors with regrown...

Semiconductor structures and manufacturing methods thereof

Methods, systems, and apparatus for processing substrates using one...

Semiconductor device structure and method for forming the same prel...

Semiconductor structure and method for forming semiconductor structure

Stacked dies and methods for forming bonded structures

Humidity control or aqueous treatment for EUV metallic resist

Pattern sheet, semiconductor intermediate product, and hole etching...

Method and system for forming patterned structures including silico...

Composition for forming silicon-containing resist underlayer film a...

Method for forming semiconductor structure with fins using a multil...

Chemical-resistant protective film-forming composition containing p...

Formation method of semiconductor structure

Buried metal for FinFET device and method

Hybrid scheme for improved performance for P-type and N-type FinFETs

Methods for forming fin field-effect transistors

High etch selectivity, low stress ashable carbon hard mask

Techniques for achieving multiple transistor fin dimensions on a si...

Semiconductor structure and method for manufacturing semiconductor...

Wet etching chemistry and method of forming semiconductor device us...

High electron mobility transistor and method for fabricating the same

Techniques for achieving multiple transistor fin dimensions on a si...

Method for removing resist layer, method of forming a pattern and m...

High electron mobility transistor and fabricating method of the same

Vertical field effect transistor with crosslink fin arrangement

Tip-to-tip graphic preparation method

Pattern forming method and method for manufacturing semiconductor d...

Dose reduction of patterned metal oxide photoresists

Patents Applicationslast 30 patents

PROCESSING SOLUTION FOR SEMICONDUCTOR DEVICE, METHOD FOR PROCESSING...

PHOTOLITHOGRAPHY METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR D...

METHOD FOR PRODUCING VERTICAL POWER TRANSISTORS AND VERTICAL POWER...

HIGH ETCH SELECTIVITY, LOW STRESS ASHABLE CARBON HARD MASK

FINFET DEVICE AND METHOD OF FORMING SAME

HIGH VOLTAGE DEVICE

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

HARDMASK COMPOSITION, HARDMASK LAYER, AND METHOD OF FORMING PATTERNS

HARDMASK COMPOSITION, HARDMASK LAYER, AND METHOD OF FORMING PATTERNS

FORMING LOW-STRESS SILICON NITRIDE LAYER THROUGH HYDROGEN TREATMENT

ACTIVE REGION PATTERNING

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

Semiconductor Fin Structures

Buried Metal for FinFET Device and Method

Composition For Forming Organic Film, Method For Forming Organic Fi...

COMPOSITE SUBSTRATE FOR FABRICATION OF BETA GALLIUM OXIDE DEVICES

METHOD OF FORMING SEMICONDUCTOR DEVICE USING WET ETCHING CHEMISTRY

METHOD OF FABRICATING SEMICONDUCTOR DEVICE

HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME

Compound For Forming Metal-Containing Film, Composition For Forming...

Method For Forming Resist Underlayer Film And Patterning Process

HARDMASK COMPOSITION, HARDMASK LAYER AND METHOD OF FORMING PATTERNS

COMPOSITION FOR FORMING SILICON-CONTAINING UNDERLAYER FILM FOR INDU...

NAPHTHALENE UNIT-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION

METHOD OF PRODUCING AN ETCHING MASK, METHOD OF ETCHING A STRUCTURE...

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION

METHOD FOR REMOVING RESIST LAYER, METHOD OF FORMING A PATTERN AND M...

TECHNIQUES FOR ACHIEVING MULTIPLE TRANSISTOR FIN DIMENSIONS ON A SI...

PHOTORESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, METHOD...