characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated

Industry

CPC
H05K3/242

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/242characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing wiring board
- Patent number 11,903,141
- Issue date Feb 13, 2024
- Toyota Jidosha Kabushiki Kaisha
- Keiji Kuroda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating edge connector pins of printed circuit boards withou...
- Patent number 11,653,455
- Issue date May 16, 2023
- NVIDIA Corporation
- Mingyi Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical transceiver and manufacturing method thereof
- Patent number 11,506,849
- Issue date Nov 22, 2022
- Delta Electronics, Inc.
- Kuang-Yao Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Molded interconnect device
- Patent number 11,357,112
- Issue date Jun 7, 2022
- Molex, LLC
- Tsuey Choo Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for producing wiring substrate
- Patent number 11,272,623
- Issue date Mar 8, 2022
- NGK Spark Plug Co., Ltd.
- Yosuke Sonohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing support structures for lighting devices and...
- Patent number 10,797,211
- Issue date Oct 6, 2020
- Osram GmbH
- Lorenzo Baldo
- F21 - LIGHTING
Information Patent Grant
Micro-fabricated group electroplating technique
- Patent number 10,617,011
- Issue date Apr 7, 2020
- California Institute of Technology
- Yu-Chong Tai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board and electronic device with the same
- Patent number 10,602,610
- Issue date Mar 24, 2020
- Samsung Electronics Co., Ltd.
- Man Ho Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier and method for manufacturing the same
- Patent number 10,424,541
- Issue date Sep 24, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing planar coil
- Patent number 10,354,796
- Issue date Jul 16, 2019
- TDK Corporation
- Yuhei Horikawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal-film forming apparatus and metal-film forming method
- Patent number 10,077,505
- Issue date Sep 18, 2018
- Toyota Jidosha Kabushiki Kaisha
- Motoki Hiraoka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed circuit board and method of fabricating an element
- Patent number 9,991,196
- Issue date Jun 5, 2018
- Silicon Motion, Inc.
- Shu-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating a conductive trace structure and substrate having the s...
- Patent number 9,826,634
- Issue date Nov 21, 2017
- Taiwan Green Point Enterprises, Co., Ltd.
- Sheng-Hung Yi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and multi-piece wiring substrate
- Patent number 9,491,867
- Issue date Nov 8, 2016
- NGK Spark Plug Co., Ltd.
- Takashi Kurauchi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for forming an integrated circuit package
- Patent number 9,368,183
- Issue date Jun 14, 2016
- NVIDIA Corporation
- Leilei Zhang
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of electroplating and depositing metal
- Patent number 9,204,555
- Issue date Dec 1, 2015
- Viking Tech Corporation
- Shih-Long Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate, method of manufacturing the package substrate an...
- Patent number 9,072,188
- Issue date Jun 30, 2015
- Samsung Electronics Co., Ltd.
- Tae-Young Yoon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed wiring board having connector connecting portion
- Patent number 9,066,455
- Issue date Jun 23, 2015
- Canon Kabushiki Kaisha
- Akira Takaura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical components and methods of manufacturing electrical compo...
- Patent number 9,049,779
- Issue date Jun 2, 2015
- Tyco Electronics Corporation
- David Bruce Sarraf
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuit board having tie bar buried therein and method of fabricati...
- Patent number 9,035,195
- Issue date May 19, 2015
- NANYA TECHNOLOGY CORPORATION
- Hsin-Mao Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
8957317
- Patent number 8,957,317
- Issue date Feb 17, 2015
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light-emitting element mounting package, light-emitting element pac...
- Patent number 8,941,139
- Issue date Jan 27, 2015
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatus for three-dimensional microfabricated arrays
- Patent number 8,939,774
- Issue date Jan 27, 2015
- Massachusetts Institute of Technology
- Jorg Scholvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 8,933,342
- Issue date Jan 13, 2015
- NGK Spark Plug Co., Ltd.
- Kenji Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating an interconnect device
- Patent number 8,904,631
- Issue date Dec 9, 2014
- General Electric Company
- Kevin Matthew Durocher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 8,895,870
- Issue date Nov 25, 2014
- Nitto Denko Corporation
- Tetsuya Ohsawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 8,853,546
- Issue date Oct 7, 2014
- Nitto Denko Corporation
- Daisuke Yamauchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Minimizing plating stub reflections in a chip package using capacit...
- Patent number 8,830,690
- Issue date Sep 9, 2014
- International Business Machines Corporation
- Bhyrav M Mutnury
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light-emitting device, method of manufacturing light-emitting devic...
- Patent number 8,816,381
- Issue date Aug 26, 2014
- Toshiba Lighting & Technology Corporation
- Nobuhiko Betsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and chip package structure
- Patent number 8,796,848
- Issue date Aug 5, 2014
- Via Technologies, Inc.
- Wen-Yuan Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTROPLATING EDGE CONNECTOR PINS OF PRINTED CIRCUIT BOARDS WITHOU...
- Publication number 20230276578
- Publication date Aug 31, 2023
- NVIDIA Corporation
- Mingyi YU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING A MOLDED INTERCONNECT DEVICE
- Publication number 20220279656
- Publication date Sep 1, 2022
- Molex, LLC
- Tsuey Choo CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROPLATING EDGE CONNECTOR PINS OF PRINTED CIRCUIT BOARDS WITHOU...
- Publication number 20220279659
- Publication date Sep 1, 2022
- NVIDIA Corporation
- Mingyi YU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL TRANSCEIVER AND MANUFACTURING METHOD THEREOF
- Publication number 20220252801
- Publication date Aug 11, 2022
- Delta Electronics, Inc.
- Kuang-Yao Chen
- G02 - OPTICS
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20220061165
- Publication date Feb 24, 2022
- Toyota Jidosha Kabushiki Kaisha
- Keiji KURODA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR PRODUCING WIRING SUBSTRATE
- Publication number 20200196455
- Publication date Jun 18, 2020
- NGK Spark Plug Co., Ltd.
- Yosuke SONOHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOLDED INTERCONNECT DEVICE AND METHOD OF MAKING SAME
- Publication number 20190166698
- Publication date May 30, 2019
- Molex, LLC
- Tsuey Choo CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing support structures for lighting devices and...
- Publication number 20180062054
- Publication date Mar 1, 2018
- OSRAM GMBH
- Lorenzo Baldo
- F21 - LIGHTING
Information Patent Application
MICRO-FABRICATED GROUP ELECTROPLATING TECHNIQUE
- Publication number 20160105973
- Publication date Apr 14, 2016
- California Institute of Technology
- Yu-Chong Tai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FABRICATING A CONDUCTIVE TRACE STRUCTURE AND SUBSTRATE HAVING THE S...
- Publication number 20140374141
- Publication date Dec 25, 2014
- Sheng-Hung Yi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140338958
- Publication date Nov 20, 2014
- Daisuke YAMAUCHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LIGHT EMITTING ELEMENT MODULE SUBSTRATE, LIGHT EMITTING ELEMENT MOD...
- Publication number 20140322841
- Publication date Oct 30, 2014
- KABUSHIKI KAISHA TOSHIBA
- Akihiko Happoya
- F21 - LIGHTING
Information Patent Application
MINIMIZING PLATING STUB REFLECTIONS IN A CHIP PACKAGE USING CAPACIT...
- Publication number 20140284217
- Publication date Sep 25, 2014
- International Business Machines Corporation
- Bhyrav M. Mutnury
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PACKAGE SUBSTRATE, METHOD OF MANUFACTURING THE PACKAGE SUBSTRATE AN...
- Publication number 20140246771
- Publication date Sep 4, 2014
- Samsung Electronics Co., Ltd.
- Tae-Young YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL COMPONENTS AND METHODS OF MANUFACTURING ELECTRICAL COMPO...
- Publication number 20140144674
- Publication date May 29, 2014
- Tyco Electronics Corporation
- David Bruce Sarraf
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CIRCUIT BOARD HAVING TIE BAR BURIED THEREIN AND METHOD OF FABRICATI...
- Publication number 20140131085
- Publication date May 15, 2014
- Hsin-Mao Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Electroplating and Depositing Metal
- Publication number 20140001051
- Publication date Jan 2, 2014
- VIKING TECH CORPORATION
- Shih-Long WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20130180773
- Publication date Jul 18, 2013
- Cheng-Feng CHIANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LIGHT-EMITTING ELEMENT MOUNTING PACKAGE, LIGHT-EMITTING ELEMENT PAC...
- Publication number 20130153945
- Publication date Jun 20, 2013
- Shinko Electric Industries Co., Ltd.
- Kazutaka KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus for three-dimensional microfabricated arrays
- Publication number 20130157498
- Publication date Jun 20, 2013
- Massachusetts Institute of Technology
- Jorg Scholvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130075141
- Publication date Mar 28, 2013
- NGK SPARK PLUG CO., LTD.
- Kenji SUZUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING ELEMENT MODULE SUBSTRATE, LIGHT EMITTING ELEMENT MOD...
- Publication number 20130037834
- Publication date Feb 14, 2013
- Toshiba Lighting & Technology Corporation
- Akihiko Happoya
- F21 - LIGHTING
Information Patent Application
1-Layer Interposer Substrate With Through-Substrate Posts
- Publication number 20130000968
- Publication date Jan 3, 2013
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
- Publication number 20120320540
- Publication date Dec 20, 2012
- FUJITSU COMPONENT LIMITED
- Osamu Daikuhara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED WIRING BOARD HAVING CONNECTOR CONNECTING PORTION
- Publication number 20120305294
- Publication date Dec 6, 2012
- Canon Kabushiki Kaisha
- Akira Takaura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20120266463
- Publication date Oct 25, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chang Bo LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT DEVICE AND METHOD OF FABRICATING SAME
- Publication number 20120261165
- Publication date Oct 18, 2012
- GENERAL ELECTRIC COMPANY
- Kevin Matthew Durocher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MITIGATION OF PLATING STUB RESONANCE BY CONTROLLING SURFACE ROUGHNESS
- Publication number 20120032330
- Publication date Feb 9, 2012
- International Business Machines Corporation
- Bhyrav M. Mutnury
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wired circuit board and producing method thereof
- Publication number 20120030939
- Publication date Feb 9, 2012
- Nitto Denko Corporation
- Yasunari Ooyabu
- G11 - INFORMATION STORAGE
Information Patent Application
FLEXIBLE CIRCUIT
- Publication number 20110279986
- Publication date Nov 17, 2011
- Company LP
- John A. Doran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing wiring board

Electroplating edge connector pins of printed circuit boards withou...

Optical transceiver and manufacturing method thereof

Molded interconnect device

Wiring substrate and method for producing wiring substrate

Method of manufacturing support structures for lighting devices and...

Micro-fabricated group electroplating technique

Printed circuit board and electronic device with the same

Component carrier and method for manufacturing the same

Method for manufacturing planar coil

Metal-film forming apparatus and metal-film forming method

Printed circuit board and method of fabricating an element

Fabricating a conductive trace structure and substrate having the s...

Wiring substrate and multi-piece wiring substrate

Method for forming an integrated circuit package

Method of electroplating and depositing metal

Package substrate, method of manufacturing the package substrate an...

Flexible printed wiring board having connector connecting portion

Electrical components and methods of manufacturing electrical compo...

Circuit board having tie bar buried therein and method of fabricati...

8957317

Light-emitting element mounting package, light-emitting element pac...

Methods and apparatus for three-dimensional microfabricated arrays

Wiring substrate and method of manufacturing the same

Method of fabricating an interconnect device

Printed circuit board and method of manufacturing the same

Printed circuit board and method of manufacturing the same

Minimizing plating stub reflections in a chip package using capacit...

Light-emitting device, method of manufacturing light-emitting devic...

Circuit board and chip package structure

Patents Applicationslast 30 patents

ELECTROPLATING EDGE CONNECTOR PINS OF PRINTED CIRCUIT BOARDS WITHOU...

METHOD OF MAKING A MOLDED INTERCONNECT DEVICE

ELECTROPLATING EDGE CONNECTOR PINS OF PRINTED CIRCUIT BOARDS WITHOU...

OPTICAL TRANSCEIVER AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING WIRING BOARD

WIRING SUBSTRATE AND METHOD FOR PRODUCING WIRING SUBSTRATE

MOLDED INTERCONNECT DEVICE AND METHOD OF MAKING SAME

Method of manufacturing support structures for lighting devices and...

MICRO-FABRICATED GROUP ELECTROPLATING TECHNIQUE

FABRICATING A CONDUCTIVE TRACE STRUCTURE AND SUBSTRATE HAVING THE S...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

LIGHT EMITTING ELEMENT MODULE SUBSTRATE, LIGHT EMITTING ELEMENT MOD...

MINIMIZING PLATING STUB REFLECTIONS IN A CHIP PACKAGE USING CAPACIT...

PACKAGE SUBSTRATE, METHOD OF MANUFACTURING THE PACKAGE SUBSTRATE AN...

ELECTRICAL COMPONENTS AND METHODS OF MANUFACTURING ELECTRICAL COMPO...

CIRCUIT BOARD HAVING TIE BAR BURIED THEREIN AND METHOD OF FABRICATI...

Method of Electroplating and Depositing Metal

CIRCUIT SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

LIGHT-EMITTING ELEMENT MOUNTING PACKAGE, LIGHT-EMITTING ELEMENT PAC...

Methods and apparatus for three-dimensional microfabricated arrays

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

LIGHT EMITTING ELEMENT MODULE SUBSTRATE, LIGHT EMITTING ELEMENT MOD...

1-Layer Interposer Substrate With Through-Substrate Posts

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR

FLEXIBLE PRINTED WIRING BOARD HAVING CONNECTOR CONNECTING PORTION

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

INTERCONNECT DEVICE AND METHOD OF FABRICATING SAME

MITIGATION OF PLATING STUB RESONANCE BY CONTROLLING SURFACE ROUGHNESS

Wired circuit board and producing method thereof

FLEXIBLE CIRCUIT