characterized by laminating a prefabricated metal foil pattern

Industry

CPC
H05K3/4658

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4658characterized by laminating a prefabricated metal foil pattern

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for producing laminate having patterned metal foil, and lami...
- Patent number 11,664,240
- Issue date May 30, 2023
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin copper foil, ultra-thin copper foil with carrier, and me...
- Patent number 11,576,267
- Issue date Feb 7, 2023
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component embedded in component carrier and having an exposed side...
- Patent number 11,570,897
- Issue date Jan 31, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Bettina Schuster
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reel-to-reel lamination methods and devices in FPC fabrication
- Patent number 11,516,921
- Issue date Nov 29, 2022
- MANAFLEX, LLC
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reel-to-reel laser ablation methods and devices in FPC fabrication
- Patent number 11,490,523
- Issue date Nov 1, 2022
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board having a differential pair routing topology w...
- Patent number 11,234,325
- Issue date Jan 25, 2022
- Infinera Corporation
- Aneesh Kachroo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic circuit device and method of manufacturing electronic ci...
- Patent number 11,189,571
- Issue date Nov 30, 2021
- RISING TECHNOLOGIES CO., LTD.
- Shuzo Akejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with high passive intermodulation performance
- Patent number 11,140,768
- Issue date Oct 5, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Kevin Pöltl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reel-to-reel laser sintering methods and devices in FPC fabrication
- Patent number 11,026,333
- Issue date Jun 1, 2021
- MANAFLEX, LLC
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reel-to-reel flexible printed circuit fabrication methods and devices
- Patent number 11,026,332
- Issue date Jun 1, 2021
- MANAFLEX, LLC
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-uniform magnetic foil embedded in component carrier
- Patent number 10,993,313
- Issue date Apr 27, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-speed interconnects for printed circuit boards
- Patent number 10,993,331
- Issue date Apr 27, 2021
- Amphenol Corporation
- Arthur E. Harkness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for laser welding layers of circuitry pattern in the reel-t...
- Patent number 10,993,334
- Issue date Apr 27, 2021
- MANAFLEX, LLC
- Robert Clinton Lane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Board level shields and systems and methods of applying board level...
- Patent number 10,477,738
- Issue date Nov 12, 2019
- Laird Technologies, Inc.
- Jason L. Strader
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-speed interconnects for printed circuit boards
- Patent number 10,051,746
- Issue date Aug 14, 2018
- Amphenol Corporation
- Arthur E. Harkness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board having wiring structure for mounting multip...
- Patent number 9,893,016
- Issue date Feb 13, 2018
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for component incorporated substrate and compo...
- Patent number 9,596,765
- Issue date Mar 14, 2017
- MEIKO ELECTRONICS CO., LTD.
- Akira Yamaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Manufacturing method of multilayer printed wiring board
- Patent number 9,585,261
- Issue date Feb 28, 2017
- Mitsui Mining & Smelting Co., Ltd.
- Ayumu Tateoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of inkjet head
- Patent number 9,272,518
- Issue date Mar 1, 2016
- Toshiba Tec Kabushiki Kaisha
- Masashi Shimosato
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Manufacturing method of multilayer printed wiring board
- Patent number 9,066,459
- Issue date Jun 23, 2015
- Mitsui Mining & Smelting Co., Ltd.
- Ayumu Tateoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,066,435
- Issue date Jun 23, 2015
- Ibiden Co., Ltd.
- Makoto Terui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure and method of making interconnect element having metal tr...
- Patent number 8,736,064
- Issue date May 27, 2014
- Invensas Corporation
- Hideki Kotake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ferroelectric component and manufacturing the same
- Patent number 8,704,106
- Issue date Apr 22, 2014
- Fujitsu Limited
- Masataka Mizukoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed circuit board
- Patent number 8,499,441
- Issue date Aug 6, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Jung-Hwan Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 8,497,434
- Issue date Jul 30, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Jae-Seok Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer wiring substrate
- Patent number 8,419,884
- Issue date Apr 16, 2013
- Murata Manufacturing Co., Ltd.
- Yasuyuki Sekimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of embedded circuit substrate
- Patent number 8,387,239
- Issue date Mar 5, 2013
- Advanced Semiconductor Engineering, Inc.
- Chien-Hao Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal etch stop fabrication method and structure
- Patent number 8,383,950
- Issue date Feb 26, 2013
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 8,334,463
- Issue date Dec 18, 2012
- Ibiden Co., Ltd.
- Nobuyuki Naganuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multi-layer circuit board
- Patent number 8,227,173
- Issue date Jul 24, 2012
- Samsung Techwin Co., Ltd.
- Jae-chul Ryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Flexible Printed Wiring Board and Method for Manufacturing Same
- Publication number 20240155763
- Publication date May 9, 2024
- Nippon Mektron, Ltd.
- Yoshihiko Narisawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230199957
- Publication date Jun 22, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STUD BUMPED PRINTED CIRCUIT ASSEMBLY
- Publication number 20230041747
- Publication date Feb 9, 2023
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEMPORARY CARRIER PLATE AND MANUFACTURING METHOD THEREOF, AND MANUF...
- Publication number 20220287184
- Publication date Sep 8, 2022
- Nantong ACCESS Semiconductor CO.,LTD.
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board and Vehicle Having the Same
- Publication number 20210360798
- Publication date Nov 18, 2021
- Hyundai Motor Company
- SeungWoo Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRA-THIN COPPER FOIL, ULTRA-THIN COPPER FOIL WITH CARRIER, AND ME...
- Publication number 20210127503
- Publication date Apr 29, 2021
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reel-to-Reel Laser Welding Methods and Devices in FPC Fabrication
- Publication number 20210092854
- Publication date Mar 25, 2021
- Manaflex, LLC
- Robert Clinton Lane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CIRCUIT DEVICE AND METHOD OF MANUFACTURING ELECTRONIC CI...
- Publication number 20210005555
- Publication date Jan 7, 2021
- RISING TECHNOLOGIES CO., LTD.
- Shuzo AKEJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD HAVING A DIFFERENTIAL PAIR ROUTING TOPOLOGY W...
- Publication number 20200404774
- Publication date Dec 24, 2020
- INFINERA CORPORATION
- Aneesh Kachroo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With High Passive Intermodulation Performance
- Publication number 20200329552
- Publication date Oct 15, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Kevin Pöltl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Non-Uniform Magnetic Foil Embedded in Component Carrier
- Publication number 20190045624
- Publication date Feb 7, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Embedded in Component Carrier and Having an Exposed Side...
- Publication number 20190045636
- Publication date Feb 7, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Bettina Schuster
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-SPEED INTERCONNECTS FOR PRINTED CIRCUIT BOARDS
- Publication number 20180332720
- Publication date Nov 15, 2018
- Amphenol Corporation
- Arthur E. Harkness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD LEVEL SHIELDS AND SYSTEMS AND METHODS OF APPLYING BOARD LEVEL...
- Publication number 20180255666
- Publication date Sep 6, 2018
- Laird Technologies, Inc.
- Jason L. STRADER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER FOIL WITH CARRIER, LAMINATE, METHOD OF PRODUCING PRINTED WIR...
- Publication number 20160374205
- Publication date Dec 22, 2016
- JX NIPPON MINING & METALS CORPORATION
- TERUMASA MORIYAMA
- B32 - LAYERED PRODUCTS
Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARDS WITH DIMENSIONAL STABILITY
- Publication number 20160128180
- Publication date May 5, 2016
- Elite Material Co., Ltd.
- Ya-Wen KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR ELECTRONICS MANUFACTURING USING D...
- Publication number 20160014900
- Publication date Jan 14, 2016
- United Technologies Corporation
- Wayde R. Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD FOR COMPONENT INCORPORATED SUBSTRATE AND COMPO...
- Publication number 20150223343
- Publication date Aug 6, 2015
- Meiko Electronics Co., Ltd.
- Akira Yamaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
RIGID-FLEXIBLE PRINTED CIRCUIT BOARD,METHOD FOR MANUFACTURING SAME,...
- Publication number 20150101847
- Publication date Apr 16, 2015
- ZHEN DING TECHNOLOGY CO., LTD.
- HSIEN-MING TSAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20140101935
- Publication date Apr 17, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Oh Hi Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILA...
- Publication number 20140096381
- Publication date Apr 10, 2014
- Mitsui Mining and Smelting Co., Ltd.
- Ayumu Tateoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILA...
- Publication number 20140054259
- Publication date Feb 27, 2014
- Mitsui Mining and Smelting Co., Ltd.
- Ayumu Tateoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRIC-TYPE MULTILAYER PRINTED CIRCUIT BOARD AND MANUFACTURING METH...
- Publication number 20130319730
- Publication date Dec 5, 2013
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Yong Ki SON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20130312901
- Publication date Nov 28, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Jae-Seok LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130258625
- Publication date Oct 3, 2013
- IBIDEN CO., LTD.
- Makoto Terui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Board and Method of Manufacturing the Same
- Publication number 20130062106
- Publication date Mar 14, 2013
- LG Innotek Co., Ltd.
- Jin Su Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20120255764
- Publication date Oct 11, 2012
- LG Innotek Co., Ltd.
- Jin Su Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120210576
- Publication date Aug 23, 2012
- Jin Yong AN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF INKJET HEAD
- Publication number 20120180276
- Publication date Jul 19, 2012
- Toshiba Tec Kabushiki Kaisha
- Masashi Shimosato
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CARRIER MEMBER FOR TRANSMITTING CIRCUITS, CORELESS PRINTED CIRCUIT...
- Publication number 20120073865
- Publication date Mar 29, 2012
- Samsung Electro-Mechanics CO., LTD.
- Myung Sam Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

characterized by laminating a prefabricated metal foil pattern

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for producing laminate having patterned metal foil, and lami...

Ultra-thin copper foil, ultra-thin copper foil with carrier, and me...

Component embedded in component carrier and having an exposed side...

Reel-to-reel lamination methods and devices in FPC fabrication

Reel-to-reel laser ablation methods and devices in FPC fabrication

Printed circuit board having a differential pair routing topology w...

Electronic circuit device and method of manufacturing electronic ci...

Component carrier with high passive intermodulation performance

Reel-to-reel laser sintering methods and devices in FPC fabrication

Reel-to-reel flexible printed circuit fabrication methods and devices

Non-uniform magnetic foil embedded in component carrier

High-speed interconnects for printed circuit boards

Methods for laser welding layers of circuitry pattern in the reel-t...

Board level shields and systems and methods of applying board level...

High-speed interconnects for printed circuit boards

Multilayer wiring board having wiring structure for mounting multip...

Manufacturing method for component incorporated substrate and compo...

Manufacturing method of multilayer printed wiring board

Manufacturing method of inkjet head

Manufacturing method of multilayer printed wiring board

Wiring board and method for manufacturing the same

Structure and method of making interconnect element having metal tr...

Ferroelectric component and manufacturing the same

Method of manufacturing a printed circuit board

Printed circuit board and manufacturing method thereof

Method for manufacturing multilayer wiring substrate

Manufacturing method of embedded circuit substrate

Metal etch stop fabrication method and structure

Wiring board and method for manufacturing the same

Method of manufacturing multi-layer circuit board

Patents Applicationslast 30 patents

Flexible Printed Wiring Board and Method for Manufacturing Same

MULTILAYER SUBSTRATE AND MANUFACTURING METHOD THEREFOR

STUD BUMPED PRINTED CIRCUIT ASSEMBLY

TEMPORARY CARRIER PLATE AND MANUFACTURING METHOD THEREOF, AND MANUF...

Printed Circuit Board and Vehicle Having the Same

ULTRA-THIN COPPER FOIL, ULTRA-THIN COPPER FOIL WITH CARRIER, AND ME...

Reel-to-Reel Laser Welding Methods and Devices in FPC Fabrication

ELECTRONIC CIRCUIT DEVICE AND METHOD OF MANUFACTURING ELECTRONIC CI...

PRINTED CIRCUIT BOARD HAVING A DIFFERENTIAL PAIR ROUTING TOPOLOGY W...

Component Carrier With High Passive Intermodulation Performance

Non-Uniform Magnetic Foil Embedded in Component Carrier

Component Embedded in Component Carrier and Having an Exposed Side...

HIGH-SPEED INTERCONNECTS FOR PRINTED CIRCUIT BOARDS

BOARD LEVEL SHIELDS AND SYSTEMS AND METHODS OF APPLYING BOARD LEVEL...

COPPER FOIL WITH CARRIER, LAMINATE, METHOD OF PRODUCING PRINTED WIR...

MULTI-LAYER PRINTED CIRCUIT BOARDS WITH DIMENSIONAL STABILITY

APPARATUS, SYSTEM, AND METHOD FOR ELECTRONICS MANUFACTURING USING D...

MANUFACTURING METHOD FOR COMPONENT INCORPORATED SUBSTRATE AND COMPO...

RIGID-FLEXIBLE PRINTED CIRCUIT BOARD,METHOD FOR MANUFACTURING SAME,...

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILA...

MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILA...

FABRIC-TYPE MULTILAYER PRINTED CIRCUIT BOARD AND MANUFACTURING METH...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

Printed Circuit Board and Method of Manufacturing the Same

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

MANUFACTURING METHOD OF INKJET HEAD

CARRIER MEMBER FOR TRANSMITTING CIRCUITS, CORELESS PRINTED CIRCUIT...