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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with advanced pad structure resistant to plasm...
- Patent number 9,666,545
- Issue date May 30, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION
- Publication number 20240105644
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Hao YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel Protection Diode Structure For Stacked Image Sensor Devices
- Publication number 20230307437
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ADVANCED PAD STRUCTURE RESISTANT TO PLASM...
- Publication number 20160315058
- Publication date Oct 27, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Hung-Chih WANG
- H01 - BASIC ELECTRIC ELEMENTS