Chemical cleaning

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CPC
H01L2224/83911

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83911Chemical cleaning

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,869,870
- Issue date Jan 9, 2024
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,776,932
- Issue date Oct 3, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,626,383
- Issue date Apr 11, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Soldering device and a method for producing a solder connection of...
- Patent number 11,491,567
- Issue date Nov 8, 2022
- Pink GmbH Thermosysteme
- Aaron Hutzler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,488,930
- Issue date Nov 1, 2022
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 10,910,341
- Issue date Feb 2, 2021
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component device
- Patent number 10,818,580
- Issue date Oct 27, 2020
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic interconnect, a method of manufacturing a metallic interco...
- Patent number 10,734,352
- Issue date Aug 4, 2020
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 10,541,224
- Issue date Jan 21, 2020
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 10,192,850
- Issue date Jan 29, 2019
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for chip-to-wafer integration
- Patent number 9,613,928
- Issue date Apr 4, 2017
- Agency for Science, Technology and Research
- Sunil Wickramanayaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CLEANING LIQUID AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240124799
- Publication date Apr 18, 2024
- Kabushiki Kaisha Toshiba
- Masato YASUI
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
SEMICONDUCTOR DEVICE AND BUMP ARRANGEMENT METHOD
- Publication number 20240021557
- Publication date Jan 18, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuo SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING
- Publication number 20210104488
- Publication date Apr 8, 2021
- DANFOSS SILICON POWER GMBH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Metallic Interconnect, a Method of Manufacturing a Metallic Interco...
- Publication number 20190103378
- Publication date Apr 4, 2019
- INFINEON TECHNOLOGIES AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Chip-To-Wafer Integration
- Publication number 20160155720
- Publication date Jun 2, 2016
- Agency for Science, Technology and Research
- Sunil Wickramanayaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TERNARY WAFER BONDING AND STRUCTURE THEREOF
- Publication number 20150294950
- Publication date Oct 15, 2015
- National Central University
- CHENG-YI LIU
- H01 - BASIC ELECTRIC ELEMENTS

Chemical cleaning

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding process with inhibited oxide formation

Process and device for low-temperature pressure sintering

Process and device for low-temperature pressure sintering

Soldering device and a method for producing a solder connection of...

Bonding process with inhibited oxide formation

Bonding process with inhibited oxide formation

Electronic component device

Metallic interconnect, a method of manufacturing a metallic interco...

Bonding process with inhibited oxide formation

Bonding process with inhibited oxide formation

Method and apparatus for chip-to-wafer integration

Patents Applicationslast 30 patents

CLEANING LIQUID AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND BUMP ARRANGEMENT METHOD

PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING

Metallic Interconnect, a Method of Manufacturing a Metallic Interco...

Method and Apparatus for Chip-To-Wafer Integration

METHOD FOR TERNARY WAFER BONDING AND STRUCTURE THEREOF