Chemical cleaning

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CPC
H01L2224/85011

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85011Chemical cleaning

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,233,023
- Issue date Jan 25, 2022
- Kabushiki Kaisha Toshiba
- Hiroaki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct selective adhesion promotor plating
- Patent number 11,024,565
- Issue date Jun 1, 2021
- Infineon Technologies AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct selective adhesion promotor plating
- Patent number 10,297,536
- Issue date May 21, 2019
- Infineon Technologies AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for treating a bond pad of a package substrate
- Patent number 9,012,263
- Issue date Apr 21, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component built-in substrate and method of manufacturing...
- Patent number 8,355,262
- Issue date Jan 15, 2013
- Shinko Electric Industries Co., Ltd.
- Akinobu Inoue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding on reactive metal surfaces of a metallization of a sem...
- Patent number 8,216,880
- Issue date Jul 10, 2012
- GLOBALFOUNDRIES Inc.
- Matthias Lehr
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wire bonding on reactive metal surfaces of a metallization of a sem...
- Patent number 8,043,956
- Issue date Oct 25, 2011
- GLOBALFOUNDRIES Inc.
- Matthias Lehr
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Leadframe treatment for enhancing adhesion of encapsulant thereto
- Patent number 8,012,886
- Issue date Sep 6, 2011
- ASM Assembly Materials Ltd.
- Yiu Fai Kwan
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor device with front side metallization and method for t...
- Patent number 7,632,759
- Issue date Dec 15, 2009
- Infineon Technologies AG
- Josef Hoeglauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire and solder bond forming methods
- Patent number 7,601,628
- Issue date Oct 13, 2009
- International Business Machines Corporation
- Timothy H. Daubenspeck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire and solder bond forming methods
- Patent number 7,521,287
- Issue date Apr 21, 2009
- International Business Machines Corporation
- Timothy H. Daubenspeck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method extending flip-chip pad structures for wirebon...
- Patent number 7,262,513
- Issue date Aug 28, 2007
- Intel Corporation
- Ranjan J. Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method extending flip-chip pad structures for wirebon...
- Patent number 6,927,156
- Issue date Aug 9, 2005
- Intel Corporation
- Ranjan J. Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for deconstructing an integrated circuit package using lapping
- Patent number 6,813,828
- Issue date Nov 9, 2004
- Gel Pak L.L.C.
- Joseph J. Dlugokecki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preparing copper metallization die for wirebonding
- Patent number 6,693,020
- Issue date Feb 17, 2004
- Motorola, Inc.
- Kok Wai Mui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode pad in semiconductor device and method of producing the same
- Patent number 6,596,628
- Issue date Jul 22, 2003
- Seiko Epson Corporation
- Shinji Magara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing tin-silver alloy plating film, the tin-silver...
- Patent number 6,575,354
- Issue date Jun 10, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hisahiro Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu-pad/bonded/Cu-wire with self-passivating Cu-alloys
- Patent number 6,515,373
- Issue date Feb 4, 2003
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pads for integrated circuits having copper interconnect met...
- Patent number 6,329,722
- Issue date Dec 11, 2001
- Texas Instruments Incorporated
- Wei-Yan Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to improve the adhesion of a molding compound to a semicondu...
- Patent number 6,090,696
- Issue date Jul 18, 2000
- Taiwan Semicondutor Manufacturing Company
- Syun-Ming Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct chip attachment process and apparatus for aluminum wirebondi...
- Patent number 5,632,438
- Issue date May 27, 1997
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming lead frame with strengthened encapsulation adhesion
- Patent number 5,459,103
- Issue date Oct 17, 1995
- Texas Instruments Incorporated
- Harold T. Kelleher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging an integrated circuit using a reconstructed pl...
- Patent number 5,318,926
- Issue date Jun 7, 1994
- Joseph J. Dlugokecki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-cyanide electrode cleaning process
- Patent number 4,968,397
- Issue date Nov 6, 1990
- Reginald K. Asher
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of electroplating a copper lead frame with copper
- Patent number 4,800,178
- Issue date Jan 24, 1989
- National Semiconductor Corporation
- Ranjan J. Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating a semiconductor device
- Patent number 4,430,152
- Issue date Feb 7, 1984
- Fujitsu Limited
- Takashi Okano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210091021
- Publication date Mar 25, 2021
- Kabushiki Kaisha Toshiba
- Hiroaki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct Selective Adhesion Promotor Plating
- Publication number 20190237396
- Publication date Aug 1, 2019
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND REAGENT FOR TREATING BARE COPPER WIRE AND SURFACE-TREATE...
- Publication number 20180142358
- Publication date May 24, 2018
- Samsung Electronics Co., Ltd.
- Peng ZHANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR TREATING A BOND PAD OF A PACKAGE SUBSTRATE
- Publication number 20150118791
- Publication date Apr 30, 2015
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING ON REACTIVE METAL SURFACES OF A METALLIZATION OF A SEM...
- Publication number 20120009780
- Publication date Jan 12, 2012
- GLOBALFOUNDRIES Inc.
- Matthias Lehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Immersion method
- Publication number 20100101962
- Publication date Apr 29, 2010
- Rohm and Haas Electronic Materials LLC
- Danny Lau
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER PAD FOR COPPER WIRE BONDING
- Publication number 20100052174
- Publication date Mar 4, 2010
- Agere Systems Inc.
- Mark Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING ON REACTIVE METAL SURFACES OF A METALLIZATION OF A SEM...
- Publication number 20090243105
- Publication date Oct 1, 2009
- Matthias Lehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME TREATMENT FOR ENHANCING ADHESION OF ENCAPSULANT THERETO
- Publication number 20080216921
- Publication date Sep 11, 2008
- Yiu Fai KWAN
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Electronic component built-in substrate and method of manufacturing...
- Publication number 20080174978
- Publication date Jul 24, 2008
- Shinko Electric Industries Co., Ltd.
- Akinobu Inoue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE AND SOLDER BOND FORMING METHODS
- Publication number 20080119035
- Publication date May 22, 2008
- Timothy H. Daubenspeck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE AND SOLDER BOND FORMING METHODS
- Publication number 20080119036
- Publication date May 22, 2008
- Timothy H. Daubenspeck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device with front side metallization and method for t...
- Publication number 20070080391
- Publication date Apr 12, 2007
- Josef Hoeglauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Immersion method
- Publication number 20060237097
- Publication date Oct 26, 2006
- Rohm and Haas Electronic Materials L.L.C.
- Danny Lau
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and method extending flip-chip pad structures for wirebon...
- Publication number 20050258549
- Publication date Nov 24, 2005
- Intel Corporation
- Ranjan J. Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method extending flip-chip pad structures for wirebon...
- Publication number 20040256704
- Publication date Dec 23, 2004
- Intel Corporation
- Ranjan J. Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for deconstructing an integrated ciruit package using lapping
- Publication number 20030126741
- Publication date Jul 10, 2003
- Joseph J. Dlugokecki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrode pad in semiconductor device and method of producing the same
- Publication number 20020160607
- Publication date Oct 31, 2002
- Shinji Magara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of preparing copper metallization die for wirebonding
- Publication number 20020127825
- Publication date Sep 12, 2002
- MOTOROLA, INC.
- Kok Wai Mui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing tin-silver alloy plating film, the tin-silver...
- Publication number 20020088845
- Publication date Jul 11, 2002
- Hisahiro Tanaka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Cu-pad/bonded/Cu-wire with self-passivating Cu-alloys
- Publication number 20020084311
- Publication date Jul 4, 2002
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having exposed adhesive sheet and method for m...
- Publication number 20020079578
- Publication date Jun 27, 2002
- NEC Corporation
- Yoshihiro Matsuura
- H01 - BASIC ELECTRIC ELEMENTS

Chemical cleaning

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of manufacturing semiconductor device

Direct selective adhesion promotor plating

Direct selective adhesion promotor plating

Method for treating a bond pad of a package substrate

Electronic component built-in substrate and method of manufacturing...

Wire bonding on reactive metal surfaces of a metallization of a sem...

Wire bonding on reactive metal surfaces of a metallization of a sem...

Leadframe treatment for enhancing adhesion of encapsulant thereto

Semiconductor device with front side metallization and method for t...

Wire and solder bond forming methods

Wire and solder bond forming methods

Apparatus and method extending flip-chip pad structures for wirebon...

Apparatus and method extending flip-chip pad structures for wirebon...

Method for deconstructing an integrated circuit package using lapping

Method of preparing copper metallization die for wirebonding

Electrode pad in semiconductor device and method of producing the same

Method for producing tin-silver alloy plating film, the tin-silver...

Cu-pad/bonded/Cu-wire with self-passivating Cu-alloys

Bonding pads for integrated circuits having copper interconnect met...

Method to improve the adhesion of a molding compound to a semicondu...

Direct chip attachment process and apparatus for aluminum wirebondi...

Method of forming lead frame with strengthened encapsulation adhesion

Method for packaging an integrated circuit using a reconstructed pl...

Non-cyanide electrode cleaning process

Method of electroplating a copper lead frame with copper

Process for fabricating a semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Direct Selective Adhesion Promotor Plating

METHOD AND REAGENT FOR TREATING BARE COPPER WIRE AND SURFACE-TREATE...

METHOD FOR TREATING A BOND PAD OF A PACKAGE SUBSTRATE

WIRE BONDING ON REACTIVE METAL SURFACES OF A METALLIZATION OF A SEM...

Immersion method

COPPER PAD FOR COPPER WIRE BONDING

WIRE BONDING ON REACTIVE METAL SURFACES OF A METALLIZATION OF A SEM...

LEADFRAME TREATMENT FOR ENHANCING ADHESION OF ENCAPSULANT THERETO

Electronic component built-in substrate and method of manufacturing...

WIRE AND SOLDER BOND FORMING METHODS

WIRE AND SOLDER BOND FORMING METHODS

Semiconductor device with front side metallization and method for t...

Immersion method

Apparatus and method extending flip-chip pad structures for wirebon...

Apparatus and method extending flip-chip pad structures for wirebon...

Method for deconstructing an integrated ciruit package using lapping

Electrode pad in semiconductor device and method of producing the same

Method of preparing copper metallization die for wirebonding

Method for producing tin-silver alloy plating film, the tin-silver...

Cu-pad/bonded/Cu-wire with self-passivating Cu-alloys

Semiconductor device having exposed adhesive sheet and method for m...