Chemical etching

Industry

CPC
H01L21/02019

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02019Chemical etching

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a semiconductor using slurry
- Patent number 12,176,217
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Hung Liao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
SiC wafer and manufacturing method for SiC wafer
- Patent number 12,139,813
- Issue date Nov 12, 2024
- Toyota Tsusho Corporation
- Masatake Nagaya
- C30 - CRYSTAL GROWTH
Information Patent Grant
Integrated method for low-cost wide band gap semiconductor device m...
- Patent number 12,125,697
- Issue date Oct 22, 2024
- ThinSiC Inc.
- Tirunelveli Subramaniam Ravi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide substrate
- Patent number 12,104,278
- Issue date Oct 1, 2024
- Sumitomo Electric Industries, Ltd.
- Tsubasa Honke
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,094,704
- Issue date Sep 17, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Le Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of printing laser mark and method of producing laser-marked...
- Patent number 12,083,624
- Issue date Sep 10, 2024
- Sumco Corporation
- Yoichiro Hirakawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Etching compositions
- Patent number 12,074,020
- Issue date Aug 27, 2024
- Fujifilm Electronic Materials U.S.A., Inc.
- Mick Bjelopavlic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a substrate and system for producing a substrate
- Patent number 12,062,533
- Issue date Aug 13, 2024
- Disco Corporation
- Karl Heinz Priewasser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,016,182
- Issue date Jun 18, 2024
- Kioxia Corporation
- Naomi Fukumaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device, method of manufacturing window, and method of manuf...
- Patent number 12,001,243
- Issue date Jun 4, 2024
- Samsung Display Co., Ltd.
- In-Bae Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnects having spacers for improved top via critical dimensio...
- Patent number 11,961,759
- Issue date Apr 16, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of CMP integration for improved optical uniformity in advanc...
- Patent number 11,908,678
- Issue date Feb 20, 2024
- Applied Materials, Inc.
- Lan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Indium phosphide substrate, semiconductor epitaxial wafer, and meth...
- Patent number 11,901,170
- Issue date Feb 13, 2024
- JX Metals Corporation
- Shunsuke Oka
- C30 - CRYSTAL GROWTH
Information Patent Grant
Indium phosphide substrate, semiconductor epitaxial wafer, and meth...
- Patent number 11,894,225
- Issue date Feb 6, 2024
- JX Metals Corporation
- Shunsuke Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device structure with features a...
- Patent number 11,875,994
- Issue date Jan 16, 2024
- NANYA TECHNOLOGY CORPORATION
- Chih-Tsung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for foreline deposition diagnostics and control
- Patent number 11,860,973
- Issue date Jan 2, 2024
- Applied Materials, Inc.
- Ala Moradian
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 11,862,483
- Issue date Jan 2, 2024
- Tokyo Electron Limited
- Hiroshi Marumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar cell and method of manufacturing the same
- Patent number 11,855,234
- Issue date Dec 26, 2023
- SHANGRAO JINKO SOLAR TECHNOLOGY DEVELOPMENT CO LTD
- Juhwa Cheong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated method for low-cost wide band gap semiconductor device m...
- Patent number 11,848,197
- Issue date Dec 19, 2023
- ThinSiC Inc.
- Tirunelveli Subramaniam Ravi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Splitting of a solid using conversion of material
- Patent number 11,833,617
- Issue date Dec 5, 2023
- Siltectra GmbH
- Jan Richter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Etching compositions
- Patent number 11,820,929
- Issue date Nov 21, 2023
- Fujifilm Electronic Materials U.S.A., Inc.
- Mick Bjelopavlic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of porosifying part of a semiconductor wafer
- Patent number 11,810,779
- Issue date Nov 7, 2023
- Infineon Technologies AG
- Sophia Friedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method of the semicon...
- Patent number 11,812,615
- Issue date Nov 7, 2023
- SK hynix Inc.
- Nam Jae Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Silicon etching solution, silicon etching method, and method of pro...
- Patent number 11,802,240
- Issue date Oct 31, 2023
- Tokyo Ohka Kogyo Co., Ltd.
- Ming-Yen Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure production wet etch method and structure production appar...
- Patent number 11,791,151
- Issue date Oct 17, 2023
- Sumitomo Chemical Company, Limited
- Fumimasa Hirikiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Indium phosphide substrate, semiconductor epitaxial wafer, and meth...
- Patent number 11,788,203
- Issue date Oct 17, 2023
- JX Metals Corporation
- Shunsuke Oka
- C30 - CRYSTAL GROWTH
Information Patent Grant
Methods of forming SOI substrates
- Patent number 11,764,054
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Alex Usenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure manufacturing method and manufacturing device, and light...
- Patent number 11,756,827
- Issue date Sep 12, 2023
- Sumitomo Chemical Company, Limited
- Fumimasa Horikiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry
- Patent number 11,688,607
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Hung Liao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer structure and trimming method thereof
- Patent number 11,682,551
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Ning Chiang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESSING METHOD AND PROCESSING SYSTEM
- Publication number 20240404852
- Publication date Dec 5, 2024
- TOKYO ELECTRON LIMITED
- Yohei YAMASHITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ETCHING COMPOSITIONS
- Publication number 20240376606
- Publication date Nov 14, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Simon Joshua JACOBS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CARRIER SUBSTRATE FOR SEMICONDUCTOR STRUCTURES SUITABLE FOR A TRANS...
- Publication number 20240371669
- Publication date Nov 7, 2024
- X-FAB SEMICONDUCTOR FOUNDRIES GmbH
- Ralf LERNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE, METHOD OF MANUFACTURING WINDOW, AND METHOD OF MANUF...
- Publication number 20240295904
- Publication date Sep 5, 2024
- SAMSUNG DISPLAY CO., LTD.
- IN-BAE KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING SYSTEM AND COMPUT...
- Publication number 20240290607
- Publication date Aug 29, 2024
- TOKYO ELECTRON LIMITED
- Takashi UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICON...
- Publication number 20240234125
- Publication date Jul 11, 2024
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Application
SILICON WAFER MANUFACTURING METHOD
- Publication number 20240203745
- Publication date Jun 20, 2024
- Shin-Etsu Handotai Co., Ltd.
- Tatsuo ABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SUBSTRATE AND METHOD OF MANUFACTURING SILICON CARBI...
- Publication number 20240145229
- Publication date May 2, 2024
- Sumitomo Electric Industries, Ltd.
- Kyoko OKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICON...
- Publication number 20240136173
- Publication date Apr 25, 2024
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Application
STRUCTURE AND METHOD FOR FORMING OHMIC CONTACTS TO N FACE BULK GAN...
- Publication number 20240097072
- Publication date Mar 21, 2024
- Palo Alto Research Center Incorporated
- Max Batres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Method For Low-Cost Wide Band Gap Semiconductor Device M...
- Publication number 20240063013
- Publication date Feb 22, 2024
- ThinSiC Inc.
- Tirunelveli Subramaniam Ravi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Detachment Region in a Solid-state Body
- Publication number 20240058899
- Publication date Feb 22, 2024
- SILTECTRA GMBH
- Jan Richter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DONOR SUBSTRATE FOR THE TRANSFER OF A THIN LAYER AND ASSOCIATED TRA...
- Publication number 20240030061
- Publication date Jan 25, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Larry Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
- Publication number 20240030021
- Publication date Jan 25, 2024
- TOKYO ELECTRON LIMITED
- Yohei YAMASHITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INDIUM PHOSPHIDE SUBSTRATE, METHOD FOR MANUFACTURING INDIUM PHOSPHI...
- Publication number 20230392289
- Publication date Dec 7, 2023
- JX NIPPON MINING & METALS CORPORATION
- Kodai YAMAGISHI
- C30 - CRYSTAL GROWTH
Information Patent Application
INDIUM PHOSPHIDE SUBSTRATE, METHOD FOR MANUFACTURING INDIUM PHOSPHI...
- Publication number 20230378274
- Publication date Nov 23, 2023
- JX NIPPON MINING & METALS CORPORATION
- Kodai YAMAGISHI
- C30 - CRYSTAL GROWTH
Information Patent Application
METHODS OF FORMING SOI SUBSTRATES
- Publication number 20230369038
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alex Usenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PREPARING A SILICON CARBIDE WAFER
- Publication number 20230326735
- Publication date Oct 12, 2023
- Samantha Mazzamuto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER EDGE DEPOSITION FOR WAFER LEVEL PACKAGING
- Publication number 20230317445
- Publication date Oct 5, 2023
- LAM RESEARCH CORPORATION
- Xuefeng Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR USING SLURRY
- Publication number 20230290641
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-HUNG LIAO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER AND METHOD OF PROCESSING WAFER
- Publication number 20230282472
- Publication date Sep 7, 2023
- GLOBALWAFERS CO., LTD.
- Wen-Huai Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING COMPOSITIONS
- Publication number 20230243041
- Publication date Aug 3, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Simon Joshua JACOBS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE WITH FEATURES A...
- Publication number 20230223246
- Publication date Jul 13, 2023
- NANYA TECHNOLOGY CORPORATION
- CHIH-TSUNG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVI...
- Publication number 20230207616
- Publication date Jun 29, 2023
- Kioxia Corporation
- Fuyuma ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE OF A SEMICONDUCTOR COMPONENT AND METHODS FOR...
- Publication number 20230178478
- Publication date Jun 8, 2023
- IMEC vzw
- Gaspard Hiblot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, CONTROL SYSTEM, AND SYSTEM FOR MACHINING A SEMICONDUCTOR WA...
- Publication number 20230170206
- Publication date Jun 1, 2023
- Siltronic AG
- Axel BEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Component Having A SiC Semiconductor Body
- Publication number 20230148156
- Publication date May 11, 2023
- Andreas Peter Meiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING COMPOSITIONS
- Publication number 20230112795
- Publication date Apr 13, 2023
- Fujifilm Electronic Materials U.S.A., Inc.
- Mick Bjelopavlic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230052664
- Publication date Feb 16, 2023
- KIOXIA Corporation
- Naomi FUKUMAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD
- Publication number 20230005735
- Publication date Jan 5, 2023
- STMicroelectronics (Crolles 2) SAS
- Delia RISTOIU
- H01 - BASIC ELECTRIC ELEMENTS

Chemical etching

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing a semiconductor using slurry

SiC wafer and manufacturing method for SiC wafer

Integrated method for low-cost wide band gap semiconductor device m...

Silicon carbide substrate

Semiconductor device and method of fabricating the same

Method of printing laser mark and method of producing laser-marked...

Etching compositions

Method of producing a substrate and system for producing a substrate

Semiconductor device and method of manufacturing the same

Display device, method of manufacturing window, and method of manuf...

Interconnects having spacers for improved top via critical dimensio...

Method of CMP integration for improved optical uniformity in advanc...

Indium phosphide substrate, semiconductor epitaxial wafer, and meth...

Indium phosphide substrate, semiconductor epitaxial wafer, and meth...

Method for preparing semiconductor device structure with features a...

Method and system for foreline deposition diagnostics and control

Substrate processing method and substrate processing apparatus

Solar cell and method of manufacturing the same

Integrated method for low-cost wide band gap semiconductor device m...

Splitting of a solid using conversion of material

Etching compositions

Method of porosifying part of a semiconductor wafer

Semiconductor memory device and manufacturing method of the semicon...

Silicon etching solution, silicon etching method, and method of pro...

Structure production wet etch method and structure production appar...

Indium phosphide substrate, semiconductor epitaxial wafer, and meth...

Methods of forming SOI substrates

Structure manufacturing method and manufacturing device, and light...

Slurry

Wafer structure and trimming method thereof

Patents Applicationslast 30 patents

PROCESSING METHOD AND PROCESSING SYSTEM

ETCHING COMPOSITIONS

CARRIER SUBSTRATE FOR SEMICONDUCTOR STRUCTURES SUITABLE FOR A TRANS...

DISPLAY DEVICE, METHOD OF MANUFACTURING WINDOW, AND METHOD OF MANUF...

SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING SYSTEM AND COMPUT...

METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICON...

SILICON WAFER MANUFACTURING METHOD

SILICON CARBIDE SUBSTRATE AND METHOD OF MANUFACTURING SILICON CARBI...

METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICON...

STRUCTURE AND METHOD FOR FORMING OHMIC CONTACTS TO N FACE BULK GAN...

Integrated Method For Low-Cost Wide Band Gap Semiconductor Device M...

Method for Producing a Detachment Region in a Solid-state Body

DONOR SUBSTRATE FOR THE TRANSFER OF A THIN LAYER AND ASSOCIATED TRA...

LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD

INDIUM PHOSPHIDE SUBSTRATE, METHOD FOR MANUFACTURING INDIUM PHOSPHI...

INDIUM PHOSPHIDE SUBSTRATE, METHOD FOR MANUFACTURING INDIUM PHOSPHI...

METHODS OF FORMING SOI SUBSTRATES

METHOD OF PREPARING A SILICON CARBIDE WAFER

WAFER EDGE DEPOSITION FOR WAFER LEVEL PACKAGING

METHOD FOR MANUFACTURING A SEMICONDUCTOR USING SLURRY

WAFER AND METHOD OF PROCESSING WAFER

ETCHING COMPOSITIONS

METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE WITH FEATURES A...

SEMICONDUCTOR SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVI...

INTERCONNECT STRUCTURE OF A SEMICONDUCTOR COMPONENT AND METHODS FOR...

METHOD, CONTROL SYSTEM, AND SYSTEM FOR MACHINING A SEMICONDUCTOR WA...

Semiconductor Component Having A SiC Semiconductor Body

ETCHING COMPOSITIONS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

ETCHING METHOD