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ELECTRICITY
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Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/02019
Chemical etching
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last 30 patents
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Patent Grant
Interconnects having spacers for improved top via critical dimensio...
Patent number
11,961,759
Issue date
Apr 16, 2024
International Business Machines Corporation
Brent A. Anderson
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of CMP integration for improved optical uniformity in advanc...
Patent number
11,908,678
Issue date
Feb 20, 2024
Applied Materials, Inc.
Lan Yu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Indium phosphide substrate, semiconductor epitaxial wafer, and meth...
Patent number
11,901,170
Issue date
Feb 13, 2024
JX Metals Corporation
Shunsuke Oka
C30 - CRYSTAL GROWTH
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Patent Grant
Indium phosphide substrate, semiconductor epitaxial wafer, and meth...
Patent number
11,894,225
Issue date
Feb 6, 2024
JX Metals Corporation
Shunsuke Oka
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for preparing semiconductor device structure with features a...
Patent number
11,875,994
Issue date
Jan 16, 2024
NANYA TECHNOLOGY CORPORATION
Chih-Tsung Wu
H01 - BASIC ELECTRIC ELEMENTS
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Method and system for foreline deposition diagnostics and control
Patent number
11,860,973
Issue date
Jan 2, 2024
Applied Materials, Inc.
Ala Moradian
G06 - COMPUTING CALCULATING COUNTING
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Substrate processing method and substrate processing apparatus
Patent number
11,862,483
Issue date
Jan 2, 2024
Tokyo Electron Limited
Hiroshi Marumoto
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Solar cell and method of manufacturing the same
Patent number
11,855,234
Issue date
Dec 26, 2023
SHANGRAO JINKO SOLAR TECHNOLOGY DEVELOPMENT CO LTD
Juhwa Cheong
H01 - BASIC ELECTRIC ELEMENTS
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Integrated method for low-cost wide band gap semiconductor device m...
Patent number
11,848,197
Issue date
Dec 19, 2023
ThinSiC Inc.
Tirunelveli Subramaniam Ravi
H01 - BASIC ELECTRIC ELEMENTS
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Splitting of a solid using conversion of material
Patent number
11,833,617
Issue date
Dec 5, 2023
Siltectra GmbH
Jan Richter
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Patent Grant
Etching compositions
Patent number
11,820,929
Issue date
Nov 21, 2023
Fujifilm Electronic Materials U.S.A., Inc.
Mick Bjelopavlic
H01 - BASIC ELECTRIC ELEMENTS
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Method of porosifying part of a semiconductor wafer
Patent number
11,810,779
Issue date
Nov 7, 2023
Infineon Technologies AG
Sophia Friedler
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor memory device and manufacturing method of the semicon...
Patent number
11,812,615
Issue date
Nov 7, 2023
SK hynix Inc.
Nam Jae Lee
G11 - INFORMATION STORAGE
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Silicon etching solution, silicon etching method, and method of pro...
Patent number
11,802,240
Issue date
Oct 31, 2023
Tokyo Ohka Kogyo Co., Ltd.
Ming-Yen Chung
H01 - BASIC ELECTRIC ELEMENTS
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Structure production wet etch method and structure production appar...
Patent number
11,791,151
Issue date
Oct 17, 2023
Sumitomo Chemical Company, Limited
Fumimasa Hirikiri
H01 - BASIC ELECTRIC ELEMENTS
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Indium phosphide substrate, semiconductor epitaxial wafer, and meth...
Patent number
11,788,203
Issue date
Oct 17, 2023
JX Metals Corporation
Shunsuke Oka
C30 - CRYSTAL GROWTH
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Methods of forming SOI substrates
Patent number
11,764,054
Issue date
Sep 19, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Alex Usenko
H01 - BASIC ELECTRIC ELEMENTS
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Structure manufacturing method and manufacturing device, and light...
Patent number
11,756,827
Issue date
Sep 12, 2023
Sumitomo Chemical Company, Limited
Fumimasa Horikiri
H01 - BASIC ELECTRIC ELEMENTS
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Slurry
Patent number
11,688,607
Issue date
Jun 27, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Chun-Hung Liao
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Wafer structure and trimming method thereof
Patent number
11,682,551
Issue date
Jun 20, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Hao-Ning Chiang
H01 - BASIC ELECTRIC ELEMENTS
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Method and device for etching patterns inside objects
Patent number
11,682,550
Issue date
Jun 20, 2023
Tech Met, Inc.
Michael Vidra
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Patent Grant
Method, control system, and system for machining a semiconductor wa...
Patent number
11,658,022
Issue date
May 23, 2023
Siltronic AG
Axel Beyer
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device and method for fabricating the same
Patent number
11,626,501
Issue date
Apr 11, 2023
Samsung Electronics Co., Ltd.
In Yeal Lee
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor substrate, method of manufacturing semiconductor devi...
Patent number
11,616,120
Issue date
Mar 28, 2023
Kioxia Corporation
Fuyuma Ito
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor wafer with low defect count and method for manufactur...
Patent number
11,610,808
Issue date
Mar 21, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Yu-Hung Cheng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor component having a SiC semiconductor body
Patent number
11,600,701
Issue date
Mar 7, 2023
Infineon Technologies AG
Andreas Peter Meiser
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method of manufacturing the same
Patent number
11,515,323
Issue date
Nov 29, 2022
Kioxia Corporation
Naomi Fukumaki
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of producing laser-marked silicon wafer and laser-marked sil...
Patent number
11,515,263
Issue date
Nov 29, 2022
Sumco Corporation
Yoichiro Hirakawa
H01 - BASIC ELECTRIC ELEMENTS
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Etching method
Patent number
11,469,095
Issue date
Oct 11, 2022
STMicroelectronics (Crolles 2) SAS
Delia Ristoiu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Wafer structure and trimming method thereof
Patent number
11,456,169
Issue date
Sep 27, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Hao-Ning Chiang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
SILICON CARBIDE SUBSTRATE AND METHOD OF MANUFACTURING SILICON CARBI...
Publication number
20240145229
Publication date
May 2, 2024
Sumitomo Electric Industries, Ltd.
Kyoko OKITA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICON...
Publication number
20240136173
Publication date
Apr 25, 2024
Siltronic AG
Georg Pietsch
B24 - GRINDING POLISHING
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Patent Application
STRUCTURE AND METHOD FOR FORMING OHMIC CONTACTS TO N FACE BULK GAN...
Publication number
20240097072
Publication date
Mar 21, 2024
Palo Alto Research Center Incorporated
Max Batres
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Integrated Method For Low-Cost Wide Band Gap Semiconductor Device M...
Publication number
20240063013
Publication date
Feb 22, 2024
ThinSiC Inc.
Tirunelveli Subramaniam Ravi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Producing a Detachment Region in a Solid-state Body
Publication number
20240058899
Publication date
Feb 22, 2024
SILTECTRA GMBH
Jan Richter
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
DONOR SUBSTRATE FOR THE TRANSFER OF A THIN LAYER AND ASSOCIATED TRA...
Publication number
20240030061
Publication date
Jan 25, 2024
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Larry Vincent
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
Publication number
20240030021
Publication date
Jan 25, 2024
TOKYO ELECTRON LIMITED
Yohei YAMASHITA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
INDIUM PHOSPHIDE SUBSTRATE, METHOD FOR MANUFACTURING INDIUM PHOSPHI...
Publication number
20230392289
Publication date
Dec 7, 2023
JX NIPPON MINING & METALS CORPORATION
Kodai YAMAGISHI
C30 - CRYSTAL GROWTH
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Patent Application
INDIUM PHOSPHIDE SUBSTRATE, METHOD FOR MANUFACTURING INDIUM PHOSPHI...
Publication number
20230378274
Publication date
Nov 23, 2023
JX NIPPON MINING & METALS CORPORATION
Kodai YAMAGISHI
C30 - CRYSTAL GROWTH
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Patent Application
METHODS OF FORMING SOI SUBSTRATES
Publication number
20230369038
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Alex Usenko
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD OF PREPARING A SILICON CARBIDE WAFER
Publication number
20230326735
Publication date
Oct 12, 2023
Samantha Mazzamuto
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
WAFER EDGE DEPOSITION FOR WAFER LEVEL PACKAGING
Publication number
20230317445
Publication date
Oct 5, 2023
LAM RESEARCH CORPORATION
Xuefeng Hua
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR USING SLURRY
Publication number
20230290641
Publication date
Sep 14, 2023
Taiwan Semiconductor Manufacturing company Ltd.
CHUN-HUNG LIAO
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
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Patent Application
WAFER AND METHOD OF PROCESSING WAFER
Publication number
20230282472
Publication date
Sep 7, 2023
GLOBALWAFERS CO., LTD.
Wen-Huai Yu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ETCHING COMPOSITIONS
Publication number
20230243041
Publication date
Aug 3, 2023
TEXAS INSTRUMENTS INCORPORATED
Simon Joshua JACOBS
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Application
METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE WITH FEATURES A...
Publication number
20230223246
Publication date
Jul 13, 2023
NANYA TECHNOLOGY CORPORATION
CHIH-TSUNG WU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVI...
Publication number
20230207616
Publication date
Jun 29, 2023
Kioxia Corporation
Fuyuma ITO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
INTERCONNECT STRUCTURE OF A SEMICONDUCTOR COMPONENT AND METHODS FOR...
Publication number
20230178478
Publication date
Jun 8, 2023
IMEC vzw
Gaspard Hiblot
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD, CONTROL SYSTEM, AND SYSTEM FOR MACHINING A SEMICONDUCTOR WA...
Publication number
20230170206
Publication date
Jun 1, 2023
Siltronic AG
Axel BEYER
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Semiconductor Component Having A SiC Semiconductor Body
Publication number
20230148156
Publication date
May 11, 2023
Andreas Peter Meiser
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ETCHING COMPOSITIONS
Publication number
20230112795
Publication date
Apr 13, 2023
Fujifilm Electronic Materials U.S.A., Inc.
Mick Bjelopavlic
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230052664
Publication date
Feb 16, 2023
KIOXIA Corporation
Naomi FUKUMAKI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ETCHING METHOD
Publication number
20230005735
Publication date
Jan 5, 2023
STMicroelectronics (Crolles 2) SAS
Delia RISTOIU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD FOR MANUFACTURING A COMPONENT ARRANGEMENT FOR A PACKAGE, MET...
Publication number
20220415645
Publication date
Dec 29, 2022
MSG Lithoglas GmbH
Simon Maus
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
Publication number
20220415644
Publication date
Dec 29, 2022
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
Le LI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SILICON CARBIDE SUBSTRATE AND METHOD FOR MANUFACTURING SILICON CARB...
Publication number
20220403550
Publication date
Dec 22, 2022
Sumitomo Electric Industries, Ltd.
Kyoko OKITA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ELEMENT CHIP MANUFACTURING METHOD AND SUBSTRATE PROCESSING METHOD
Publication number
20220384177
Publication date
Dec 1, 2022
Panasonic Intellectual Property Management Co., Ltd.
Hidehiko KARASAKI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ETCHING METHOD AND ETCHING APPARATUS
Publication number
20220384178
Publication date
Dec 1, 2022
TOKYO ELECTRON LIMITED
Naoki SHINDO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Publication number
20220375743
Publication date
Nov 24, 2022
SCREEN Holdings Co., Ltd.
Takaaki ISHIZU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
WAFER STRUCTURE AND TRIMMING METHOD THEREOF
Publication number
20220367172
Publication date
Nov 17, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Hao-Ning Chiang
H01 - BASIC ELECTRIC ELEMENTS