Chemical mechanical polishing [CMP]

Industry

CPC
H01L2224/27845

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/27845Chemical mechanical polishing [CMP]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Die on die bonding structure
- Patent number 12,125,819
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,842,992
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer on wafer bonding structure
- Patent number 11,715,723
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of manufacturing the same
- Patent number 11,532,589
- Issue date Dec 20, 2022
- Kioxia Corporation
- Jun Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,342,322
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 11,201,138
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 10,727,218
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 10,453,832
- Issue date Oct 22, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and process for in situ byproduct removal and platen cooling...
- Patent number 10,350,728
- Issue date Jul 16, 2019
- Applied Materials, Inc.
- Jie Diao
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor devices and methods of forming thereof
- Patent number 10,262,959
- Issue date Apr 16, 2019
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing a structure by assembling at least two elemen...
- Patent number 9,922,953
- Issue date Mar 20, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Paul Gondcharton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for performing direct bonding between two structures
- Patent number 9,922,954
- Issue date Mar 20, 2018
- Commisariat A l'Energie Atomique et Aux Energies Alternatives
- Hubert Moriceau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding metallic contact areas with solution of a sacrif...
- Patent number 9,640,510
- Issue date May 2, 2017
- EV Group E. Thallner GmbH
- Bernhard Rebhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of forming thereof
- Patent number 9,484,316
- Issue date Nov 1, 2016
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming semiconductor device packages
- Patent number 9,202,714
- Issue date Dec 1, 2015
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-wafer bonding method and bonding device, and structure comp...
- Patent number 9,142,532
- Issue date Sep 22, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, method for manufacturing semiconductor device...
- Patent number 8,610,269
- Issue date Dec 17, 2013
- NEC Corporation
- Kenji Nanba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor circuit substrate
- Patent number 8,471,377
- Issue date Jun 25, 2013
- Mitsubishi Electric Corporation
- Naoki Kosaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated (multilayer) circuits and process of producing the same
- Patent number 8,138,019
- Issue date Mar 20, 2012
- Toyota Motor Engineering & Manufactruing North America, Inc.
- Sang Won Yoon
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
BONDING LAYERS IN SEMICONDCUTOR PACKAGES AND METHODS OF FORMING
- Publication number 20250046744
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION IN SEMICONDUCTOR DEVICES
- Publication number 20250006687
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zheng-Yong Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240413037
- Publication date Dec 12, 2024
- Jin-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ON DIE BONDING STRUCTURE
- Publication number 20240387452
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE
- Publication number 20240128227
- Publication date Apr 18, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Perceval COUDRAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND FORMATION METHOD THEREOF
- Publication number 20220278075
- Publication date Sep 1, 2022
- NANTONG TONGFU MICROELECTRONICS CO., LTD
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...
- Publication number 20200126951
- Publication date Apr 23, 2020
- International Business Machines Corporation
- Bing DANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING STRUCTURES AND METHODS OF FORMING SAME
- Publication number 20190109125
- Publication date Apr 11, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERFORMING DIRECT BONDING BETWEEN TWO STRUCTURES
- Publication number 20170179073
- Publication date Jun 22, 2017
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Hubert MORICEAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PLANARIZATION METHOD
- Publication number 20170040285
- Publication date Feb 9, 2017
- STMicroelectronics (Crolles 2) SAS
- Francois Guyader
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR PRODUCING A STRUCTURE BY ASSEMBLING AT LEAST TWO ELEMEN...
- Publication number 20170025377
- Publication date Jan 26, 2017
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Paul GONDCHARTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20130280861
- Publication date Oct 24, 2013
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20120104602
- Publication date May 3, 2012
- Kenji Nanba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR CIRCUIT SUBSTRATE, AND METHOD O...
- Publication number 20120032296
- Publication date Feb 9, 2012
- Mitsubishi Electric Corporation
- Naoki Kosaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FLIP CHIP MOUNTING AND MET...
- Publication number 20110309481
- Publication date Dec 22, 2011
- Rui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED (MULTILAYER) CIRCUITS AND PROCESS OF PRODUCING THE SAME
- Publication number 20110101533
- Publication date May 5, 2011
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Sang Won Yoon
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Chemical mechanical polishing [CMP]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Die on die bonding structure

Seal ring structures and methods of forming same

Wafer on wafer bonding structure

Semiconductor wafer and method of manufacturing the same

Seal ring structures and methods of forming same

Wafer level integration including design/co-design, structure proce...

Seal ring structures and methods of forming same

Seal ring structures and methods of forming same

System and process for in situ byproduct removal and platen cooling...

Semiconductor devices and methods of forming thereof

Process for producing a structure by assembling at least two elemen...

Method for performing direct bonding between two structures

Method for bonding metallic contact areas with solution of a sacrif...

Semiconductor devices and methods of forming thereof

Methods for forming semiconductor device packages

Chip-on-wafer bonding method and bonding device, and structure comp...

Semiconductor device, method for manufacturing semiconductor device...

Semiconductor device and semiconductor circuit substrate

Integrated (multilayer) circuits and process of producing the same

Patents Applicationslast 30 patents

BONDING LAYERS IN SEMICONDCUTOR PACKAGES AND METHODS OF FORMING

HEAT DISSIPATION IN SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGE

DIE ON DIE BONDING STRUCTURE

SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE

PACKAGING STRUCTURE AND FORMATION METHOD THEREOF

WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...

SEAL RING STRUCTURES AND METHODS OF FORMING SAME

METHOD FOR PERFORMING DIRECT BONDING BETWEEN TWO STRUCTURES

WAFER PLANARIZATION METHOD

PROCESS FOR PRODUCING A STRUCTURE BY ASSEMBLING AT LEAST TWO ELEMEN...

METHODS FOR FORMING SEMICONDUCTOR DEVICE PACKAGES

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR CIRCUIT SUBSTRATE, AND METHOD O...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FLIP CHIP MOUNTING AND MET...

INTEGRATED (MULTILAYER) CIRCUITS AND PROCESS OF PRODUCING THE SAME