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THREE-DIMENSIONAL MEMORY DEVICES
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Publication date Dec 19, 2024
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Yangtze Memory Technologies Co., Ltd.
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ELECTROSTATIC SUBSTRATE SUPPORT
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Publication date Dec 19, 2024
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Applied Materials, Inc.
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Andrew Nguyen
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H01 - BASIC ELECTRIC ELEMENTS
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METHOD FOR DRY ETCHING USING PLASMA
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Publication number 20240412979
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Publication date Dec 12, 2024
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Research & Business Foundation Sungkyunkwan University
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Geun Young YEOM
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H01 - BASIC ELECTRIC ELEMENTS
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HIGH PERFORMANCE FETS
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Publication number 20240413232
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Publication date Dec 12, 2024
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Samsung Electronics Co., Ltd.
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Mehdi Saremi
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H01 - BASIC ELECTRIC ELEMENTS
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PROCESSED STACKED DIES
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Publication number 20240404990
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Publication date Dec 5, 2024
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ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
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Cyprian Emeka Uzoh
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H01 - BASIC ELECTRIC ELEMENTS
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ETCHING METHODS USING SILICON-CONTAINING HYDROFLUOROCARBONS
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Publication number 20240404833
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Publication date Dec 5, 2024
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L'Air Liquide, Societe Anonyme pour I'Etude et I'Exploitation des procedes Ge...
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Nicolas GOSSET
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C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
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