Chemical or electrical treatment

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H01L21/306

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/306Chemical or electrical treatment

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Chemical mechanical polishing pad and preparation thereof
- Patent number 12,220,784
- Issue date Feb 11, 2025
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Grant
Method of separating electronic devices having a back layer and app...
- Patent number 12,224,208
- Issue date Feb 11, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming backside power rails
- Patent number 12,224,324
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing composition and polishing method
- Patent number 12,221,557
- Issue date Feb 11, 2025
- FUJIMI INCORPORATED
- Daiki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,224,209
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Cheng Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process recipe search apparatus, etching recipe search method and s...
- Patent number 12,222,690
- Issue date Feb 11, 2025
- HITACHI HIGH-TECH CORPORATION
- Takashi Dobashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Contact architecture for capacitance reduction and satisfactory con...
- Patent number 12,224,326
- Issue date Feb 11, 2025
- Intel Corporation
- Rishabh Mehandru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature controlled substrate carrier and polishing components
- Patent number 12,217,979
- Issue date Feb 4, 2025
- Axus Technology, LLC
- Daniel Ray Trojan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices with multiple silicid...
- Patent number 12,218,012
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device and method of forming same
- Patent number 12,218,222
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing device
- Patent number 12,215,417
- Issue date Feb 4, 2025
- Tokyo Electron Limited
- Satoshi Toda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Source/drain silicide for multigate device performance and method o...
- Patent number 12,218,214
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon dry etching method
- Patent number 12,217,969
- Issue date Feb 4, 2025
- ULVAC, Inc.
- Kenta Doi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of etching film and plasma processing apparatus
- Patent number 12,217,973
- Issue date Feb 4, 2025
- Tokyo Electron Limited
- Kosuke Ogasawara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus
- Patent number 12,217,983
- Issue date Feb 4, 2025
- J.E.T. CO., LTD.
- Atsuo Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench isolation process
- Patent number 12,217,999
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Lei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing head retaining ring tilting moment control
- Patent number 12,214,469
- Issue date Feb 4, 2025
- Applied Materials, Inc.
- Andrew Nagengast
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etching for smoothing of arbitrary surfaces
- Patent number 12,217,968
- Issue date Feb 4, 2025
- California Institute of Technology
- Harold Frank Greer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-state pulsing for achieving a balance between bow control and...
- Patent number 12,217,972
- Issue date Feb 4, 2025
- Lam Research Corporation
- Nikhil Dole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid channel semiconductor device and method
- Patent number 12,211,900
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing thereof
- Patent number 12,211,919
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and etching apparatus
- Patent number 12,211,695
- Issue date Jan 28, 2025
- Tokyo Electron Limited
- Nobuhiro Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory device
- Patent number 12,213,315
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Byungjin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microreplicated polishing surface with enhanced co-planarity
- Patent number 12,208,483
- Issue date Jan 28, 2025
- 3M Innovative Properties Company
- Kenneth A. P. Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming SOI substrates
- Patent number 12,211,686
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Alex Usenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around transistor with strained channels
- Patent number 12,211,897
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-En Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside ohmic contacts for semiconductor devices
- Patent number 12,211,920
- Issue date Jan 28, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Srinivasa Reddy Yeduru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around integrated circuit structures having oxide sub-fins
- Patent number 12,211,925
- Issue date Jan 28, 2025
- Intel Corporation
- Leonard P. Guler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for treating substrate and method for treating a substrate
- Patent number 12,211,675
- Issue date Jan 28, 2025
- Semes Co., Ltd.
- Ji Hun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device and method of forming same
- Patent number 12,211,752
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONTROLLING FIN-THINNING THROUGH FEEDBACK
- Publication number 20250056823
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsu-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR ION ENERGY ANALYSIS OF PLASMA PROCESSES
- Publication number 20250054740
- Publication date Feb 13, 2025
- Impedans Ltd
- Paul SCULLIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF ETCHING CARBON-CONTAINING FEATURES AT LOW TEMPERATURES
- Publication number 20250054768
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Jiajing Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PREPARING SEMICONDUCTOR CHIP, SEMICONDUCTOR CHIP, AND APP...
- Publication number 20250054813
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Kyungwook HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION BEAM ETCHING APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20250046629
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Geun Young YEOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WAFER-ATTACHED STRUCTURE
- Publication number 20250046657
- Publication date Feb 6, 2025
- ROHM CO., LTD.
- Masatoshi AKETA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PATTERNING A TARGET LAYER, APPARATUS FOR PATTERNING A TAR...
- Publication number 20250046577
- Publication date Feb 6, 2025
- ASML NETHERLANDS B.V.
- Syam Parayil VENUGOPALAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD
- Publication number 20250046615
- Publication date Feb 6, 2025
- TOKYO ELECTRON LIMITED
- Takahiro YOKOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Atomic Layer Deposition of Passivation Layer
- Publication number 20250046603
- Publication date Feb 6, 2025
- TOKYO ELECTRON LIMITED
- Du Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ATOMIC LAYER ETCH OF Si-BASED MATERIALS
- Publication number 20250046614
- Publication date Feb 6, 2025
- TOKYO ELECTRON LIMITED
- Mehrdad Rostami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-GATE FET WITH SELF-ALIGNED TAPERED ACTIVE REGION EDGE
- Publication number 20250048695
- Publication date Feb 6, 2025
- International Business Machines Corporation
- Reinaldo Vega
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046747
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Junyun KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS WITH HEATED FILTER AND OPERATION METHOD OF THE SAME
- Publication number 20250046584
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Lun LU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DOPED DIAMOND-LIKE CARBON
- Publication number 20250046610
- Publication date Feb 6, 2025
- Applied Materials, Inc.
- Jialiang WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR WAFER PROCESSING METHOD
- Publication number 20250038033
- Publication date Jan 30, 2025
- Hitachi High-Tech Corporation
- Nozomu YOSHIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING PAD WITH REDUCED DEFECT AND METHOD OF PREPARING A SEMICON...
- Publication number 20250033160
- Publication date Jan 30, 2025
- SK enpulse Co., Ltd.
- Yujin SHIN
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL-RESISTANT PROTECTIVE FILM-FORMING COMPOSITION HAVING CATEC...
- Publication number 20250034427
- Publication date Jan 30, 2025
- NISSAN CHEMICAL CORPORATION
- Shun KUBODERA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method For Forming Resist Underlayer Film And Patterning Process
- Publication number 20250036029
- Publication date Jan 30, 2025
- Shin-Etsu Chemical Co., Ltd.
- Naoki KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF ANTIREFLECTIVE SURFACES
- Publication number 20250033955
- Publication date Jan 30, 2025
- Brookhaven Science Associates, LLC
- Charles T. Black
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EPITAXIAL GROWTH OF STRAINED Si/SiGe SUPERLATTICE
- Publication number 20250037997
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Ruiying HAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SiC TRENCH BOTTOM CORNER ROUNDING
- Publication number 20250038000
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Qintao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20250031434
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEMS COOLED BY EMBEDDED MICROTUBES
- Publication number 20250029891
- Publication date Jan 23, 2025
- SABANCI UNIVERSITESI
- Murat Kaya YAPICI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR SEPARATING SEMICONDUCTOR DEVICES USING SINGULATION GROO...
- Publication number 20250029878
- Publication date Jan 23, 2025
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ETCHING BETWEEN SILICON-AND-GERMANIUM-CONTAINING MATERIAL...
- Publication number 20250029841
- Publication date Jan 23, 2025
- Applied Materials, Inc.
- Jiayin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION, MANUFACTURING METHOD FOR SEMICONDUCTOR ELEMENT, AND CL...
- Publication number 20250017209
- Publication date Jan 16, 2025
- FUJIFILM CORPORATION
- Tadashi INABA
- B24 - GRINDING POLISHING
Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20250022755
- Publication date Jan 16, 2025
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLASMA ETCHING PROCESSES
- Publication number 20250022715
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Ging Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ADJUSTING LINEWIDTH DUE TO PATTERN LOAD EFFECT IN SADP M...
- Publication number 20250022717
- Publication date Jan 16, 2025
- Shanghai Huali Integrated Circuit Corporation
- Liyuan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS CLUSTER ASSISTED PLASMA PROCESSING
- Publication number 20250022689
- Publication date Jan 16, 2025
- TOKYO ELECTRON LIMITED
- Peter Ventzek
- H01 - BASIC ELECTRIC ELEMENTS

Chemical or electrical treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chemical mechanical polishing pad and preparation thereof

Method of separating electronic devices having a back layer and app...

Method of forming backside power rails

Polishing composition and polishing method

Semiconductor device and manufacturing method thereof

Process recipe search apparatus, etching recipe search method and s...

Contact architecture for capacitance reduction and satisfactory con...

Temperature controlled substrate carrier and polishing components

Method of manufacturing semiconductor devices with multiple silicid...

FinFET device and method of forming same

Substrate processing method and substrate processing device

Source/drain silicide for multigate device performance and method o...

Silicon dry etching method

Method of etching film and plasma processing apparatus

Substrate processing apparatus

Trench isolation process

Polishing head retaining ring tilting moment control

Atomic layer etching for smoothing of arbitrary surfaces

Multi-state pulsing for achieving a balance between bow control and...

Hybrid channel semiconductor device and method

Semiconductor devices and methods of manufacturing thereof

Etching method and etching apparatus

Three-dimensional semiconductor memory device

Microreplicated polishing surface with enhanced co-planarity

Methods of forming SOI substrates

Gate-all-around transistor with strained channels

Backside ohmic contacts for semiconductor devices

Gate-all-around integrated circuit structures having oxide sub-fins

Apparatus for treating substrate and method for treating a substrate

FinFET device and method of forming same

Patents Applicationslast 30 patents

CONTROLLING FIN-THINNING THROUGH FEEDBACK

APPARATUS FOR ION ENERGY ANALYSIS OF PLASMA PROCESSES

METHODS OF ETCHING CARBON-CONTAINING FEATURES AT LOW TEMPERATURES

METHOD OF PREPARING SEMICONDUCTOR CHIP, SEMICONDUCTOR CHIP, AND APP...

ION BEAM ETCHING APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WAFER-ATTACHED STRUCTURE

METHOD OF PATTERNING A TARGET LAYER, APPARATUS FOR PATTERNING A TAR...

ETCHING METHOD

Atomic Layer Deposition of Passivation Layer

SELECTIVE ATOMIC LAYER ETCH OF Si-BASED MATERIALS

MULTI-GATE FET WITH SELF-ALIGNED TAPERED ACTIVE REGION EDGE

SEMICONDUCTOR PACKAGE

APPARATUS WITH HEATED FILTER AND OPERATION METHOD OF THE SAME

DOPED DIAMOND-LIKE CARBON

SEMICONDUCTOR WAFER PROCESSING METHOD

POLISHING PAD WITH REDUCED DEFECT AND METHOD OF PREPARING A SEMICON...

CHEMICAL-RESISTANT PROTECTIVE FILM-FORMING COMPOSITION HAVING CATEC...

Method For Forming Resist Underlayer Film And Patterning Process

FORMATION OF ANTIREFLECTIVE SURFACES

EPITAXIAL GROWTH OF STRAINED Si/SiGe SUPERLATTICE

SiC TRENCH BOTTOM CORNER ROUNDING

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

INTEGRATED CIRCUIT SYSTEMS COOLED BY EMBEDDED MICROTUBES

METHODS FOR SEPARATING SEMICONDUCTOR DEVICES USING SINGULATION GROO...

SELECTIVE ETCHING BETWEEN SILICON-AND-GERMANIUM-CONTAINING MATERIAL...

COMPOSITION, MANUFACTURING METHOD FOR SEMICONDUCTOR ELEMENT, AND CL...

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

PLASMA ETCHING PROCESSES

METHOD FOR ADJUSTING LINEWIDTH DUE TO PATTERN LOAD EFFECT IN SADP M...

GAS CLUSTER ASSISTED PLASMA PROCESSING