Chemical solution deposition [CSD]

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CPC
H01L2224/03426

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/03426Chemical solution deposition [CSD]

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming a semiconductor device comprising top conductive...
- Patent number 10,964,653
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ya-Ping Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming pillar bumps on semiconductor wafers
- Patent number 9,831,201
- Issue date Nov 28, 2017
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanically anchored backside C4 pad
- Patent number 9,478,509
- Issue date Oct 25, 2016
- GLOBALFOUNDRIES, INC.
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents