TREA

Chemical solution deposition [CSD]

Follow

Industry

  • CPC
  • H01L2224/11824
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11824Chemical solution deposition [CSD]
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Treating Copper Surfaces for Packaging
    • Publication number 20150104903
    • Publication date Apr 16, 2015
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Horng Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Treating Copper Surfaces for Packaging
    • Publication number 20140252600
    • Publication date Sep 11, 2014
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Horng Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR ASSEMBLIES, STRUCTURES, AND METHODS OF FABRICATION
    • Publication number 20130299965
    • Publication date Nov 14, 2013
    • Micron Technology, Inc.
    • Jaspreet S. Gandhi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FORMING METAL PILLAR
    • Publication number 20120178251
    • Publication date Jul 12, 2012
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Zheng-Yi LIM
    • H01 - BASIC ELECTRIC ELEMENTS