Chromium [Cr] as principal constituent

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H01L2224/29271

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29271Chromium [Cr] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Metal paste for joints, assembly, production method for assembly, s...
- Patent number 11,462,502
- Issue date Oct 4, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Preform structure for soldering a semiconductor chip arrangement, a...
- Patent number 9,536,851
- Issue date Jan 3, 2017
- Infineon Technologies AG
- Friedrich Kroener
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...
- Publication number 20200075528
- Publication date Mar 5, 2020
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CONDUCTIVE JOINING MATERIAL AND CONDUCTIVE JOINING STRUCTURE WHICH...
- Publication number 20180033760
- Publication date Feb 1, 2018
- NIPPON STEEL & SUMITOMO METAL CORPORATION
- Shinji ISHIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREFORM STRUCTURE FOR SOLDERING A SEMICONDUCTOR CHIP ARRANGEMENT, A...
- Publication number 20170084567
- Publication date Mar 23, 2017
- INFINEON TECHNOLOGIES AG
- Friedrich Kroener
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR