Chromium (Cr) as principal constituent

Industry

CPC
H01L2224/45171

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45171Chromium (Cr) as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Stack-type semiconductor package
- Patent number 9,299,631
- Issue date Mar 29, 2016
- Samsung Electronics Co., Ltd.
- Ae-Nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack type semiconductor package
- Patent number 9,171,827
- Issue date Oct 27, 2015
- Samsung Electronics Co., Ltd.
- Jin-Ho Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus with a multi-layer coating and method of forming the same
- Patent number 9,055,700
- Issue date Jun 9, 2015
- Semblant Limited
- Mark Robson Humphries
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package apparatus
- Patent number 8,653,640
- Issue date Feb 18, 2014
- Samsung Electronics Co., Ltd.
- Tae-hun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-locking wire bond structure and method of making the same
- Patent number 7,073,702
- Issue date Jul 11, 2006
- International Business Machines Corporation
- John A Fitzsimmons
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and methods for making simultaneous electrical connections
- Patent number 5,193,732
- Issue date Mar 16, 1993
- International Business Machines Corporation
- Mario J. Interrante
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240347499
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Hongjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240023346
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- Younghun CHEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AL BONDING WIRE
- Publication number 20230142531
- Publication date May 11, 2023
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Reliability Copper Alloy Bonding Wire for Electronic Packaging...
- Publication number 20200373272
- Publication date Nov 26, 2020
- SOUTH CHINA UNIVERSITY OF TECHNOLOGY
- Bin Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK TYPE SEMICONDUCTOR PACKAGE
- Publication number 20140291868
- Publication date Oct 2, 2014
- JIN-HO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE APPARATUS
- Publication number 20120306075
- Publication date Dec 6, 2012
- TAE-HUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus with a Multi-Layer Coating and Method of Forming the Same
- Publication number 20110253429
- Publication date Oct 20, 2011
- Semblant Global Limited
- Mark Robson Humphries
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Self-locking wire bond structure and method of making the same
- Publication number 20050082347
- Publication date Apr 21, 2005
- International Business Machines Corporation
- John A Fitzsimmons
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Chromium (Cr) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stack-type semiconductor package

Stack type semiconductor package

Apparatus with a multi-layer coating and method of forming the same

Semiconductor package apparatus

Self-locking wire bond structure and method of making the same

Apparatus and methods for making simultaneous electrical connections

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

AL BONDING WIRE

High-Reliability Copper Alloy Bonding Wire for Electronic Packaging...

STACK TYPE SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE APPARATUS

Apparatus with a Multi-Layer Coating and Method of Forming the Same

Self-locking wire bond structure and method of making the same