Chromium [Cr] as principal constituent

Industry

CPC
H01L2224/29371

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29371Chromium [Cr] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display module and manufacturing method thereof
- Patent number 11,817,414
- Issue date Nov 14, 2023
- Samsung Electronics Co., Ltd.
- Won Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment method, method for connecting electronic component, metho...
- Patent number 11,049,842
- Issue date Jun 29, 2021
- Dexerials Corporation
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic conductive film, method for producing anisotropic condu...
- Patent number 10,373,926
- Issue date Aug 6, 2019
- Dexerials Corporation
- Kouichi Sato
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Connection body and method of manufacturing connection body
- Patent number 10,373,927
- Issue date Aug 6, 2019
- Dexerials Corporation
- Reiji Tsukao
- G02 - OPTICS
Information Patent Grant
Semiconductor packages and methods of fabrication thereof
- Patent number 10,325,834
- Issue date Jun 18, 2019
- Infineon Technologies Dresden GmbH
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection body, method for manufacturing a connection body, connec...
- Patent number 10,175,544
- Issue date Jan 8, 2019
- Dexerials Corporation
- Seiichiro Shinohara
- G02 - OPTICS
Information Patent Grant
Metallic particle paste, cured product using same, and semiconducto...
- Patent number 10,086,478
- Issue date Oct 2, 2018
- Kabushiki Kaisha Toshiba
- Daisuke Hiratsuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Underfill material, laminated sheet and method for producing semico...
- Patent number 10,014,235
- Issue date Jul 3, 2018
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive and light-emitting device
- Patent number 9,994,743
- Issue date Jun 12, 2018
- DEXERIALS CORPORATION
- Masaharu Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film, method for producing anisotropic condu...
- Patent number 9,960,139
- Issue date May 1, 2018
- Dexerials Corporation
- Kouichi Sato
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor packages and methods of fabrication thereof
- Patent number 9,773,719
- Issue date Sep 26, 2017
- Infineon Technologies Dresden GmbH
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,583,413
- Issue date Feb 28, 2017
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging containing sintering die-attach material
- Patent number 9,583,453
- Issue date Feb 28, 2017
- Ormet Circuits, Inc.
- Catherine Shearer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film including conductive adhesive layer and...
- Patent number 9,490,228
- Issue date Nov 8, 2016
- Cheil Industries, Inc.
- Kyoung Soo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device connected by anisotropic conductive film
- Patent number 9,252,117
- Issue date Feb 2, 2016
- Cheil Industries, Inc.
- Kyoung Hun Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection device, method for manufacturing connection structure, m...
- Patent number 9,196,599
- Issue date Nov 24, 2015
- Dexerials Corporation
- Takayuki Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive sheet for manufacturing semiconductor device, manufacturin...
- Patent number 9,153,556
- Issue date Oct 6, 2015
- Nitto Denko Corporation
- Takeshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and electronic device including the same
- Patent number 9,048,240
- Issue date Jun 2, 2015
- Cheil Industries, Inc.
- Young Woo Park
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electrically conductive bonding material, method of bonding with th...
- Patent number 8,840,811
- Issue date Sep 23, 2014
- Hitachi Chemical Company, Ltd.
- Yuusuke Yasuda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Low temperature bonding material comprising coated metal nanopartic...
- Patent number 8,821,676
- Issue date Sep 2, 2014
- Hitachi, Ltd.
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing a semiconductor device
- Patent number 8,592,260
- Issue date Nov 26, 2013
- Nitto Denko Corporation
- Masami Oikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dicing/die bonding film
- Patent number 7,998,552
- Issue date Aug 16, 2011
- Nittok Denko Corporation
- Yasuhiro Amano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Low temperature bonding material comprising metal particles and bon...
- Patent number 7,955,411
- Issue date Jun 7, 2011
- Hitachi, Ltd.
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive sheet for producing a semiconductor device
- Patent number 7,115,989
- Issue date Oct 3, 2006
- Nitto Denko Corporation
- Kazuhito Hosokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for making a Z-axis adhesive and establishing electrical in...
- Patent number 5,685,939
- Issue date Nov 11, 1997
- Minnesota Mining and Manufacturing Company
- Martin B. Wolk
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240347012
- Publication date Oct 17, 2024
- SAMSUNG DISPLAY CO., LTD.
- SUJEONG KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
DISPLAY MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20220013489
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- Won Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT METHOD, METHOD FOR CONNECTING ELECTRONIC COMPONENT, METHO...
- Publication number 20190206831
- Publication date Jul 4, 2019
- DEXERIALS CORPORATION
- Yasushi AKUTSU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDU...
- Publication number 20180218994
- Publication date Aug 2, 2018
- DEXERIALS CORPORATION
- Kouichi SATO
- B32 - LAYERED PRODUCTS
Information Patent Application
Semiconductor Packages and Methods of Fabrication Thereof
- Publication number 20170365539
- Publication date Dec 21, 2017
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION BODY AND METHOD OF MANUFACTURING CONNECTION BODY
- Publication number 20170207190
- Publication date Jul 20, 2017
- DEXERIALS CORPORATION
- Reiji TSUKAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION BODY, METHOD FOR MANUFACTURING A CONNECTION BODY, CONNEC...
- Publication number 20160327826
- Publication date Nov 10, 2016
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- G02 - OPTICS
Information Patent Application
CONNECTION DEVICE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, M...
- Publication number 20140302643
- Publication date Oct 9, 2014
- Takayuki Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM INCLUDING CONDUCTIVE ADHESIVE LAYER AND...
- Publication number 20140291869
- Publication date Oct 2, 2014
- Kyoung Soo PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Semiconductor Modules and Methods of Formation Thereof
- Publication number 20140232015
- Publication date Aug 21, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM
- Publication number 20140159229
- Publication date Jun 12, 2014
- Kyoung Hun SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semicondutor Packages and Methods of Fabrication Thereof
- Publication number 20140145319
- Publication date May 29, 2014
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL
- Publication number 20140131898
- Publication date May 15, 2014
- Catherine Shearer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FILM ADHESIVE
- Publication number 20140120356
- Publication date May 1, 2014
- ORMET CIRCUITS, INC.
- Catherine Shearer
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20130168847
- Publication date Jul 4, 2013
- Young Woo PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20130157415
- Publication date Jun 20, 2013
- Nitto Denko Corporation
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD
- Publication number 20120104618
- Publication date May 3, 2012
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILL ROLL FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20120104134
- Publication date May 3, 2012
- NITTO DENKO CORPORATION
- Sadahilio Misumi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ANISOTROPIC ELECTRICALLY AND THERMALLY CONDUCTIVE ADHESIVE WITH MAG...
- Publication number 20120106111
- Publication date May 3, 2012
- JOSEPH MAZZOCHETTE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD
- Publication number 20110204125
- Publication date Aug 25, 2011
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOSETTING DIE-BONDING FILM
- Publication number 20110084413
- Publication date Apr 14, 2011
- Yuichiro Shishido
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING DIE-BONDING FILM
- Publication number 20110084408
- Publication date Apr 14, 2011
- Yuichiro Shishido
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PROCESS FOR PRODUCING A SEMICONDUCTOR DEVICE
- Publication number 20100330745
- Publication date Dec 30, 2010
- Masami Oikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF MANUFACTURING DICING DIE-BONDING FILM
- Publication number 20100304092
- Publication date Dec 2, 2010
- Yasuhiro Amano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRICALLY CONDUCTIVE BONDING MATERIAL, METHOD OF BONDING WITH TH...
- Publication number 20100270515
- Publication date Oct 28, 2010
- Yuusuke YASUDA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
THERMOSETTING DIE BONDING FILM
- Publication number 20100261314
- Publication date Oct 14, 2010
- Naohide Takamoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100207263
- Publication date Aug 19, 2010
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURIN...
- Publication number 20100197080
- Publication date Aug 5, 2010
- Takeshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING/DIE BONDING FILM
- Publication number 20100093154
- Publication date Apr 15, 2010
- Nitto Denko Corporation
- Yasuhiro Amano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURIN...
- Publication number 20090001611
- Publication date Jan 1, 2009
- Takeshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS

Chromium [Cr] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display module and manufacturing method thereof

Alignment method, method for connecting electronic component, metho...

Anisotropic conductive film, method for producing anisotropic condu...

Connection body and method of manufacturing connection body

Semiconductor packages and methods of fabrication thereof

Connection body, method for manufacturing a connection body, connec...

Metallic particle paste, cured product using same, and semiconducto...

Underfill material, laminated sheet and method for producing semico...

Adhesive and light-emitting device

Anisotropic conductive film, method for producing anisotropic condu...

Semiconductor packages and methods of fabrication thereof

Semiconductor device

Semiconductor packaging containing sintering die-attach material

Anisotropic conductive film including conductive adhesive layer and...

Semiconductor device connected by anisotropic conductive film

Connection device, method for manufacturing connection structure, m...

Adhesive sheet for manufacturing semiconductor device, manufacturin...

Anisotropic conductive film and electronic device including the same

Electrically conductive bonding material, method of bonding with th...

Low temperature bonding material comprising coated metal nanopartic...

Process for producing a semiconductor device

Dicing/die bonding film

Low temperature bonding material comprising metal particles and bon...

Adhesive sheet for producing a semiconductor device

Process for making a Z-axis adhesive and establishing electrical in...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

DISPLAY MODULE AND MANUFACTURING METHOD THEREOF

ALIGNMENT METHOD, METHOD FOR CONNECTING ELECTRONIC COMPONENT, METHO...

ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDU...

Semiconductor Packages and Methods of Fabrication Thereof

CONNECTION BODY AND METHOD OF MANUFACTURING CONNECTION BODY

CONNECTION BODY, METHOD FOR MANUFACTURING A CONNECTION BODY, CONNEC...

CONNECTION DEVICE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, M...

ANISOTROPIC CONDUCTIVE FILM INCLUDING CONDUCTIVE ADHESIVE LAYER AND...

Semiconductor Modules and Methods of Formation Thereof

SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM

Semicondutor Packages and Methods of Fabrication Thereof

SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL

CONDUCTIVE FILM ADHESIVE

ANISOTROPIC CONDUCTIVE FILM AND ELECTRONIC DEVICE INCLUDING THE SAME

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD

FILL ROLL FOR PRODUCING SEMICONDUCTOR DEVICE

ANISOTROPIC ELECTRICALLY AND THERMALLY CONDUCTIVE ADHESIVE WITH MAG...

LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD

THERMOSETTING DIE-BONDING FILM

THERMOSETTING DIE-BONDING FILM

PROCESS FOR PRODUCING A SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING DICING DIE-BONDING FILM

ELECTRICALLY CONDUCTIVE BONDING MATERIAL, METHOD OF BONDING WITH TH...

THERMOSETTING DIE BONDING FILM

SEMICONDUCTOR DEVICE

ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURIN...

DICING/DIE BONDING FILM

ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURIN...