Circular array

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CPC
H01L2224/0914

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0914Circular array

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multi-layer pad ring for integrated circuit
- Patent number 9,379,073
- Issue date Jun 28, 2016
- HGST Technologies Santa Ana, Inc.
- Tsan Lin Chen
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
MULTI-LAYER PAD RING FOR INTEGRATED CIRCUIT
- Publication number 20150187712
- Publication date Jul 2, 2015
- STEC, Inc.
- Tsan Lin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER INPUT/OUTPUT PAD RING FOR SOLID STATE DEVICE CONTROLLER
- Publication number 20130191581
- Publication date Jul 25, 2013
- STEC, Inc.
- Tsan Lin CHEN
- G06 - COMPUTING CALCULATING COUNTING