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  • CPC
  • H01L2224/1714
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/1714Circular array
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Honeycomb Pattern for Conductive Features
    • Publication number 20240186276
    • Publication date Jun 6, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Shenggao Li
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Honeycomb Pattern for Conductive Features
    • Publication number 20230253357
    • Publication date Aug 10, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Shenggao Li
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR CHIP
    • Publication number 20230057061
    • Publication date Feb 23, 2023
    • Samsung Electronics Co., Ltd.
    • Seyeong SEOK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Honeycomb Pattern for Conductive Features
    • Publication number 20220367400
    • Publication date Nov 17, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Shenggao Li
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ANISOTROPIC CONDUCTIVE FILM
    • Publication number 20190096843
    • Publication date Mar 28, 2019
    • DEXERIALS CORPORATION
    • Yasushi AKUTSU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BUMPED LAND GRID ARRAY
    • Publication number 20180005971
    • Publication date Jan 4, 2018
    • Avago Technologies General IP(Singapore) Pte. Ltd.
    • Ah Ron Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
    • Publication number 20170098628
    • Publication date Apr 6, 2017
    • MEDIATEK INC.
    • Nai-Wei LIU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MEMORY AND LAYOUT METHOD OF MEMORY BALL PADS
    • Publication number 20150214172
    • Publication date Jul 30, 2015
    • EOREX CORPORATION
    • CHENG-LUNG LIN
    • H01 - BASIC ELECTRIC ELEMENTS