Cleaning the bonding area

Industry

CPC
H01L2224/83022

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83022Cleaning the bonding area

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Flexible integrated display module, manufacturing method thereof, a...
- Patent number 11,442,565
- Issue date Sep 13, 2022
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Jinrong Zhao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Soldering a conductor to an aluminum layer
- Patent number 11,424,217
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,201,134
- Issue date Dec 14, 2021
- United Microelectronics Corp.
- Yonghui Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding semiconductor substrates
- Patent number 10,886,252
- Issue date Jan 5, 2021
- Imec VZW
- Lan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer to wafer bonding method and wafer to wafer bonding system
- Patent number 10,811,381
- Issue date Oct 20, 2020
- Samsung Electronics Co., Ltd.
- Joon-Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound and method...
- Patent number 10,550,299
- Issue date Feb 4, 2020
- FRAIVILLIG TECHNOGIES COMPANY
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound containing...
- Patent number 10,435,603
- Issue date Oct 8, 2019
- Fravillig Technologies Company
- James B. Fraivillig
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for applying a bonding layer
- Patent number 10,438,925
- Issue date Oct 8, 2019
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for permanently bonding wafers by a connecting layer by mean...
- Patent number 10,163,681
- Issue date Dec 25, 2018
- EV Group E. Thallner GmbH
- Klaus Martinschitz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dicing-tape integrated film for backside of semiconductor and metho...
- Patent number 10,141,217
- Issue date Nov 27, 2018
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound and method...
- Patent number 10,035,936
- Issue date Jul 31, 2018
- James B. Fraivillig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strong, heat stable junction
- Patent number 10,026,708
- Issue date Jul 17, 2018
- The United States of America as represented by the Secretary of the Army
- Patrick J Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device, heat insulating load...
- Patent number 10,020,282
- Issue date Jul 10, 2018
- Nissan Motor Co., Ltd.
- Satoshi Tanimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding substrates
- Patent number 9,929,124
- Issue date Mar 27, 2018
- EV Group E. Thallner GmbH
- Jurgen Burggraf
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for applying a bonding layer
- Patent number 9,911,713
- Issue date Mar 6, 2018
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Au-based solder die attachment semiconductor device and method for...
- Patent number 9,698,082
- Issue date Jul 4, 2017
- Nissan Motor Co., Ltd.
- Satoshi Tanimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded processed semiconductor structures and carriers
- Patent number 9,553,014
- Issue date Jan 24, 2017
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded processed semiconductor structures and carriers
- Patent number 9,041,214
- Issue date May 26, 2015
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and substrate bonding method
- Patent number 8,916,449
- Issue date Dec 23, 2014
- Asia Pacific Microsystems, Inc.
- Hung-Lin Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Film for flip chip type semiconductor back surface containing therm...
- Patent number 8,513,816
- Issue date Aug 20, 2013
- Nitto Denko Corporation
- Naohide Takamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Methods of forming bonded semiconductor structures using a temporar...
- Patent number 8,461,017
- Issue date Jun 11, 2013
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH SOLDER MASK
- Publication number 20240170438
- Publication date May 23, 2024
- NXP USA, Inc.
- Aznita Abdul Aziz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20230207517
- Publication date Jun 29, 2023
- Fuji Electric Co., Ltd.
- Tsunehiro NAKAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE INTEGRATED DISPLAY MODULE, MANUFACTURING METHOD THEREOF, A...
- Publication number 20210405790
- Publication date Dec 30, 2021
- Wuhan China Star Optoelectronics Semeiconductor Diplay Technology Co., LTD.
- Jinrong Zhao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210327849
- Publication date Oct 21, 2021
- UNITED MICROELECTRONICS CORP.
- YONGHUI GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing...
- Publication number 20190048238
- Publication date Feb 14, 2019
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...
- Publication number 20180346777
- Publication date Dec 6, 2018
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD OF BONDING SEMICONDUCTOR SUBSTRATES
- Publication number 20180247914
- Publication date Aug 30, 2018
- IMEC vzw
- Lan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR APPLYING A BONDING LAYER
- Publication number 20180145048
- Publication date May 24, 2018
- EV GROUP E. THALLNER GMBH
- Markus WIMPLINGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR APPLYING A BONDING LAYER
- Publication number 20170162538
- Publication date Jun 8, 2017
- EV GROUP E. THALLNER GMBH
- Markus WIMPLINGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR BONDING SUBSTRATES
- Publication number 20170117247
- Publication date Apr 27, 2017
- EV GROUP E. THALLNER GMBH
- Jurgen Burggraf
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HYBRID BONDING SYSTEM AND CLEANING METHOD THEREOF
- Publication number 20160293567
- Publication date Oct 6, 2016
- Taiwan Semiconductor Manufacturing company Ltd.
- Ping-Yin LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENTLY BONDING WAFERS BY A CONNECTING LAYER BY MEAN...
- Publication number 20140154867
- Publication date Jun 5, 2014
- EV Group E. Thallner GmbH
- Klaus Martinschitz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRONG, HEAT STABLE JUNCTION
- Publication number 20140110848
- Publication date Apr 24, 2014
- U.S. ARMY RESEARCH LABORATORY ATTN: RDRL-LOC-I
- Patrick J. Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure and Substrate Bonding Method
- Publication number 20130285248
- Publication date Oct 31, 2013
- ASIA PACIFIC MICROSYSTEMS, INC.
- Hung-Lin Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDED PROCESSED SEMICONDUCTOR STRUCTURES AND CARRIERS
- Publication number 20130256907
- Publication date Oct 3, 2013
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Joining Members for Downhole and High Temp...
- Publication number 20120292009
- Publication date Nov 22, 2012
- BAKER HUGHES INCORPORATED
- Julian Kähler
- E21 - EARTH DRILLING MINING
Information Patent Application
FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE, AND ITS USE
- Publication number 20120025399
- Publication date Feb 2, 2012
- Nitto Denko Corporation
- Naohide TAKAMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
TEMPORARY SEMICONDUCTOR STRUCTURE BONDING METHODS AND RELATED BONDE...
- Publication number 20120013013
- Publication date Jan 19, 2012
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS

Cleaning the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Flexible integrated display module, manufacturing method thereof, a...

Soldering a conductor to an aluminum layer

Method of manufacturing semiconductor device

Method of bonding semiconductor substrates

Wafer to wafer bonding method and wafer to wafer bonding system

A-staged thermoplastic-polyimide (TPI) adhesive compound and method...

A-staged thermoplastic-polyimide (TPI) adhesive compound containing...

Method for applying a bonding layer

Method for permanently bonding wafers by a connecting layer by mean...

Dicing-tape integrated film for backside of semiconductor and metho...

A-staged thermoplastic-polyimide (TPI) adhesive compound and method...

Strong, heat stable junction

Method for manufacturing semiconductor device, heat insulating load...

Method for bonding substrates

Method for applying a bonding layer

Au-based solder die attachment semiconductor device and method for...

Bonded processed semiconductor structures and carriers

Bonded processed semiconductor structures and carriers

Package structure and substrate bonding method

Film for flip chip type semiconductor back surface containing therm...

Methods of forming bonded semiconductor structures using a temporar...

Patents Applicationslast 30 patents

PACKAGE WITH SOLDER MASK

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

FLEXIBLE INTEGRATED DISPLAY MODULE, MANUFACTURING METHOD THEREOF, A...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing...

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...

METHOD OF BONDING SEMICONDUCTOR SUBSTRATES

METHOD FOR APPLYING A BONDING LAYER

METHOD FOR APPLYING A BONDING LAYER

METHOD FOR BONDING SUBSTRATES

HYBRID BONDING SYSTEM AND CLEANING METHOD THEREOF

METHOD FOR PERMANENTLY BONDING WAFERS BY A CONNECTING LAYER BY MEAN...

STRONG, HEAT STABLE JUNCTION

Package Structure and Substrate Bonding Method

BONDED PROCESSED SEMICONDUCTOR STRUCTURES AND CARRIERS

Method and Apparatus for Joining Members for Downhole and High Temp...

FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE, AND ITS USE

TEMPORARY SEMICONDUCTOR STRUCTURE BONDING METHODS AND RELATED BONDE...