Cleaning the bump connector

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H01L2224/8101

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8101Cleaning the bump connector

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 12,136,565
- Issue date Nov 5, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling components implementing a pre-treatment of th...
- Patent number 11,855,038
- Issue date Dec 26, 2023
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Olivier Castany
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,848,346
- Issue date Dec 19, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 11,764,080
- Issue date Sep 19, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device package including a lead frame
- Patent number 11,677,059
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Ji-hoon Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified direct bond interconnect for FPAs
- Patent number 11,670,616
- Issue date Jun 6, 2023
- EPIR, INC.
- Sushant Sonde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor device and method
- Patent number 11,625,940
- Issue date Apr 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Prevention of bridging between solder joints
- Patent number 11,456,269
- Issue date Sep 27, 2022
- International Business Machines Corporation
- Risa Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 11,424,155
- Issue date Aug 23, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding with pre-deoxide process and apparatus for performing the same
- Patent number 11,342,302
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 11,328,937
- Issue date May 10, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for reworking flip chip components
- Patent number 11,330,746
- Issue date May 10, 2022
- Raytheon Company
- James A. Robbins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contoured package-on-package joint
- Patent number 11,270,990
- Issue date Mar 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip on leadframe having partially etched landing sites
- Patent number 11,233,031
- Issue date Jan 25, 2022
- Texas Instruments Incorporated
- Ronaldo Marasigan Arguelles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature hybrid bonding structures and manufacturing method...
- Patent number 11,205,635
- Issue date Dec 21, 2021
- Shun-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds
- Patent number 11,133,450
- Issue date Sep 28, 2021
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packaging with low-force thermocompression bonding of oxidizable...
- Patent number 11,134,598
- Issue date Sep 28, 2021
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds
- Patent number 11,133,451
- Issue date Sep 28, 2021
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures having multiple microelectronic devices...
- Patent number 11,075,166
- Issue date Jul 27, 2021
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prevention of bridging between solder joints
- Patent number 11,004,819
- Issue date May 11, 2021
- International Business Machines Corporation
- Risa Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device package including a lead frame
- Patent number 10,971,668
- Issue date Apr 6, 2021
- Samsung Electronics Co., Ltd.
- Ji-hoon Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging facility and method, and device processing apparat...
- Patent number 10,937,757
- Issue date Mar 2, 2021
- Semigear, Inc.
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,930,695
- Issue date Feb 23, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device package including a lead frame
- Patent number 10,892,391
- Issue date Jan 12, 2021
- Samsung Electronics Co., Ltd.
- Ji-hoon Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming hybrid bonding structures with elongated bumps
- Patent number 10,867,957
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and methods of forming the same
- Patent number 10,867,965
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Ching Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor device and method
- Patent number 10,853,616
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microelectronic structures having multiple microelectronic devices...
- Patent number 10,790,231
- Issue date Sep 29, 2020
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting Method of a semiconductor device using a colored auxiliary...
- Patent number 10,786,876
- Issue date Sep 29, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Teppei Kojio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low cost package warpage solution
- Patent number 10,741,419
- Issue date Aug 11, 2020
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR FLUXLESS THERMOCOMPRESSION BONDING
- Publication number 20240339430
- Publication date Oct 10, 2024
- ASMPT SINGAPORE PTE. LTD
- Zetao MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PROCESSING A SUBSTRATE ON A BONDING SYSTEM, AND RELATED...
- Publication number 20240332244
- Publication date Oct 3, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD AND PACKAGING STRUCTURE OF MULTI-LAYER STACKED HIG...
- Publication number 20240321853
- Publication date Sep 26, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Maohua DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRAFINE-PITCH ALL-COPPER INTERCONNECT STRUCTURE AND FORMING METHO...
- Publication number 20240113068
- Publication date Apr 4, 2024
- Guangdong University of Technology
- Yu ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240071952
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20230369071
- Publication date Nov 16, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20220230892
- Publication date Jul 21, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ASSEMBLING COMPONENTS IMPLEMENTING A PRE-TREATMENT OF TH...
- Publication number 20220173069
- Publication date Jun 2, 2022
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Olivier CASTANY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP-CHIP ON LEADFRAME HAVING PARTIALLY ETCHED LANDING SITES
- Publication number 20220149003
- Publication date May 12, 2022
- TEXAS INSTRUMENTS INCORPORATED
- RONALDO MARASIGAN ARGUELLES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20220102603
- Publication date Mar 31, 2022
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Kwang-Seong CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Modified Direct Bond Interconnect for FPAs
- Publication number 20220052020
- Publication date Feb 17, 2022
- Sushant Sonde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE HYBRID BONDING STRUCTURES AND MANUFACTURING METHOD...
- Publication number 20210242166
- Publication date Aug 5, 2021
- SHUN-PING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING WITH PASSIVATED SILVER-BASED CONTACTING M...
- Publication number 20210227735
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Gold Contacting Metal
- Publication number 20210227734
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210225921
- Publication date Jul 22, 2021
- Sony Semiconductor Solutions Corporation
- Satoru WAKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Tin-Based Contacting Metal
- Publication number 20210227732
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Copper-Based Contacting M...
- Publication number 20210227733
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding Using Metastable Gas Atoms
- Publication number 20210219474
- Publication date Jul 15, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Nickel-Based Contacting M...
- Publication number 20210219475
- Publication date Jul 15, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTION OF BRIDGING BETWEEN SOLDER JOINTS
- Publication number 20210210454
- Publication date Jul 8, 2021
- International Business Machines Corporation
- Risa Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTION OF BRIDGING BETWEEN SOLDER JOINTS
- Publication number 20210098404
- Publication date Apr 1, 2021
- International Business Machines Corporation
- Risa Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210082856
- Publication date Mar 18, 2021
- Kioxia Corporation
- Soichi HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fingerprint Sensor Device and Method
- Publication number 20210081636
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...
- Publication number 20200395301
- Publication date Dec 17, 2020
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20200350181
- Publication date Nov 5, 2020
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contoured Package-on-Package Joint
- Publication number 20200303365
- Publication date Sep 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING APPARATUS AND METHOD FOR CHIP-STACKED STRUCTURE
- Publication number 20200161125
- Publication date May 21, 2020
- GRAND PROCESS TECHNOLOGY CORPORATION
- Fu-Yuan HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fingerprint Sensor Device and Method
- Publication number 20200117874
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LIGHT-EMITTING DEVICE PACKAGE
- Publication number 20200058839
- Publication date Feb 20, 2020
- Samsung Electronics Co., Ltd.
- Ji-hoon Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTING BUMP BONDS
- Publication number 20200006620
- Publication date Jan 2, 2020
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS

Cleaning the bump connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device package and manufacturing method thereof

Method for assembling components implementing a pre-treatment of th...

Semiconductor device and method of manufacturing the same

Low cost package warpage solution

Light-emitting device package including a lead frame

Modified direct bond interconnect for FPAs

Fingerprint sensor device and method

Prevention of bridging between solder joints

Semiconductor device package and manufacturing method thereof

Bonding with pre-deoxide process and apparatus for performing the same

Low cost package warpage solution

Device and method for reworking flip chip components

Contoured package-on-package joint

Flip-chip on leadframe having partially etched landing sites

Low temperature hybrid bonding structures and manufacturing method...

Superconducting bump bonds

3D packaging with low-force thermocompression bonding of oxidizable...

Superconducting bump bonds

Microelectronic structures having multiple microelectronic devices...

Prevention of bridging between solder joints

Light-emitting device package including a lead frame

Device packaging facility and method, and device processing apparat...

Semiconductor device and method of manufacturing the same

Light-emitting device package including a lead frame

Mechanisms for forming hybrid bonding structures with elongated bumps

Package structures and methods of forming the same

Fingerprint sensor device and method

Microelectronic structures having multiple microelectronic devices...

Mounting Method of a semiconductor device using a colored auxiliary...

Low cost package warpage solution

Patents Applicationslast 30 patents

SYSTEM AND METHOD FOR FLUXLESS THERMOCOMPRESSION BONDING

METHODS OF PROCESSING A SUBSTRATE ON A BONDING SYSTEM, AND RELATED...

PACKAGING METHOD AND PACKAGING STRUCTURE OF MULTI-LAYER STACKED HIG...

ULTRAFINE-PITCH ALL-COPPER INTERCONNECT STRUCTURE AND FORMING METHO...

INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME

LOW COST PACKAGE WARPAGE SOLUTION

LOW COST PACKAGE WARPAGE SOLUTION

METHOD FOR ASSEMBLING COMPONENTS IMPLEMENTING A PRE-TREATMENT OF TH...

FLIP-CHIP ON LEADFRAME HAVING PARTIALLY ETCHED LANDING SITES

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

Modified Direct Bond Interconnect for FPAs

LOW TEMPERATURE HYBRID BONDING STRUCTURES AND MANUFACTURING METHOD...

THERMOCOMPRESSION BONDING WITH PASSIVATED SILVER-BASED CONTACTING M...

Thermocompression Bonding with Passivated Gold Contacting Metal

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Thermocompression Bonding with Passivated Tin-Based Contacting Metal

Thermocompression Bonding with Passivated Copper-Based Contacting M...

Thermocompression Bonding Using Metastable Gas Atoms

Thermocompression Bonding with Passivated Nickel-Based Contacting M...

PREVENTION OF BRIDGING BETWEEN SOLDER JOINTS

PREVENTION OF BRIDGING BETWEEN SOLDER JOINTS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Fingerprint Sensor Device and Method

MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...

LOW COST PACKAGE WARPAGE SOLUTION

Contoured Package-on-Package Joint

CLEANING APPARATUS AND METHOD FOR CHIP-STACKED STRUCTURE

Fingerprint Sensor Device and Method

LIGHT-EMITTING DEVICE PACKAGE

SUPERCONDUCTING BUMP BONDS