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  • CPC
  • H01L2224/4381
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/4381Cleaning
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Patents Grantslast 30 patents

  • Information Patent Grant

    Core-jacket bonding wire
    • Patent number 9,236,166
    • Issue date Jan 12, 2016
    • Heraeus Deutschland GmbH & Co. KG
    • Eugen Milke
    • B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
  • Information Patent Grant

    Connecting wire and method for manufacturing same
    • Patent number 8,450,611
    • Issue date May 28, 2013
    • Heraeus Materials Technology GmbH & Co. KG
    • Rainer Dohle
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents