Coating high aspect ratio workpieces

Industry

CPC
H01J2237/3327

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Parent Industries

HELECTRICITY H01Electric elements H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS H01J2237/00Discharge tubes exposing object to beam

Current Industry

H01J2237/3327Coating high aspect ratio workpieces

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods for depositing dielectric material
- Patent number 11,631,591
- Issue date Apr 18, 2023
- Applied Materials, Inc.
- Bhargav S. Citla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for depositing dielectric material
- Patent number 11,114,306
- Issue date Sep 7, 2021
- Applied Materials, Inc.
- Bhargav Citla
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Processing method and plasma processing apparatus
- Patent number 10,916,420
- Issue date Feb 9, 2021
- Tokyo Electron Limited
- Masahiro Tabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method and plasma processing apparatus
- Patent number 10,651,044
- Issue date May 12, 2020
- Tokyo Electron Limited
- Michiko Nakaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma beam penetration of millimeter scale holes with high aspect...
- Patent number 10,475,628
- Issue date Nov 12, 2019
- Main Law Cafe
- Yuri Glukhoy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Patent number 10,047,430
- Issue date Aug 14, 2018
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma etching method, plasma etching device, and method for produc...
- Patent number 8,986,558
- Issue date Mar 24, 2015
- Japan Science and Technology Agency
- Susumu Noda
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Methods for depositing metal in high aspect ratio features
- Patent number 8,846,451
- Issue date Sep 30, 2014
- Applied Materials, Inc.
- Alan Ritchie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Patent number 8,696,875
- Issue date Apr 15, 2014
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Patent number 8,668,816
- Issue date Mar 11, 2014
- Applied Materials Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dielectric film formation using inert gas excitation
- Patent number 8,329,262
- Issue date Dec 11, 2012
- Applied Materials, Inc.
- Matthew L. Miller
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ionized physical vapor deposition (iPVD) process
- Patent number 7,901,545
- Issue date Mar 8, 2011
- Tokyo Electron Limited
- Frank M. Cerio, Jr.
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma sputtering film deposition method and equipment
- Patent number 7,790,626
- Issue date Sep 7, 2010
- Tokyo Electron Limited
- Taro Ikeda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Shields usable with an inductively coupled plasma reactor
- Patent number 7,569,125
- Issue date Aug 4, 2009
- Applied Materials, Inc.
- Tza-Jing Gung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Highly ionized PVD with moving magnetic field envelope for uniform...
- Patent number 7,556,718
- Issue date Jul 7, 2009
- Tokyo Electron Limited
- Jozef Brcka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition process for high aspect ratio trenches
- Patent number 7,097,886
- Issue date Aug 29, 2006
- Applied Materials, Inc.
- Farhad K. Moghadam
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gas chemistry cycling to achieve high aspect ratio gapfill with HDP...
- Patent number 7,052,552
- Issue date May 30, 2006
- Applied Materials
- Michael Kwan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sidewall magnet improving uniformity of inductively coupled plasma...
- Patent number 7,041,201
- Issue date May 9, 2006
- Applied Materials, Inc.
- Tza-Jing Gung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for depositing films
- Patent number 7,011,733
- Issue date Mar 14, 2006
- Micron Technology, Inc.
- Gurtej S. Sandhu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for improving sidewall coverage during sputter...
- Patent number 6,899,799
- Issue date May 31, 2005
- Applied Materials, Inc.
- Kenny King-Tai Ngan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-step process for depositing copper seed layer in a via
- Patent number 6,893,541
- Issue date May 17, 2005
- Applied Materials, Inc.
- Tony P. Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Auxiliary magnet array in conjunction with magnetron sputtering
- Patent number 6,875,321
- Issue date Apr 5, 2005
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High-density plasma process for filling high aspect ratio structures
- Patent number 6,846,745
- Issue date Jan 25, 2005
- Novellus Systems, Inc.
- George D. Papasouliotis
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Enhanced collimated deposition
- Patent number 6,827,824
- Issue date Dec 7, 2004
- Micron Technology, Inc.
- Guy Blalock
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Resputtering to achieve better step coverage
- Patent number 6,800,180
- Issue date Oct 5, 2004
- Micron Technology, Inc.
- Shane P. Leiphart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gap fill for high aspect ratio structures
- Patent number 6,787,483
- Issue date Sep 7, 2004
- Novellus Systems, Inc.
- Atiye Bayman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Laser selection of ions for sputter deposition of titanium containi...
- Patent number 6,752,912
- Issue date Jun 22, 2004
- Micron Technology, Inc.
- Gurtej S. Sandhu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Magnet array in conjunction with rotating magnetron for plasma sput...
- Patent number 6,610,184
- Issue date Aug 26, 2003
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gap fill for high aspect ratio structures
- Patent number 6,596,654
- Issue date Jul 22, 2003
- Novellus Systems, Inc.
- Atiye Bayman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for sputtering copper in a self ionized plasma
- Patent number 6,582,569
- Issue date Jun 24, 2003
- Applied Materials, Inc.
- Tony P. Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ADJUSTABLE DE-CHUCKING VOLTAGE
- Publication number 20240363315
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Andrew NGUYEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO ETCH WITH INFINITE SELECTIVITY
- Publication number 20230081817
- Publication date Mar 16, 2023
- LAM RESEARCH CORPORATION
- Leonid Belau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY (RF) POWER IMBALANCING IN A MULTI-STATION INTEGRATE...
- Publication number 20220375721
- Publication date Nov 24, 2022
- LAM RESEARCH CORPORATION
- Jeremy David Fields
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR DEPOSITING DIELECTRIC MATERIAL
- Publication number 20210384040
- Publication date Dec 9, 2021
- Bhargav S. CITLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20200312625
- Publication date Oct 1, 2020
- Kokusai Electric Corporation
- Teruo YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO DEPOSITION
- Publication number 20200216959
- Publication date Jul 9, 2020
- Applied Materials, Inc.
- Shaunak MUKHERJEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20190393031
- Publication date Dec 26, 2019
- TOKYO ELECTRON LIMITED
- Masahiro TABATA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA BEAM PENETRATION OF MILLIMETER SCALE HOLES WITH HIGH ASPECT...
- Publication number 20190221402
- Publication date Jul 18, 2019
- Nanocoating Plasma Systems Inc.
- Yuri Glukhoy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20180327893
- Publication date Nov 15, 2018
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20180247826
- Publication date Aug 30, 2018
- TOKYO ELECTRON LIMITED
- Michiko NAKAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR VOID-FREE COBALT GAP FILL
- Publication number 20160056077
- Publication date Feb 25, 2016
- LAM RESEARCH CORPORATION
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-LINE MANUFACTURE OF CARBON NANOTUBES
- Publication number 20150210548
- Publication date Jul 30, 2015
- FASTCAP SYSTEMS CORPORATION
- Nicolò Michele Brambilla
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20140305802
- Publication date Oct 16, 2014
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Feedback Via an Input Device and Scribble Recognition
- Publication number 20140049521
- Publication date Feb 20, 2014
- Microsoft Corporation
- Erez Kikin Gil
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METHODS FOR DEPOSITING METAL IN HIGH ASPECT RATIO FEATURES
- Publication number 20120028461
- Publication date Feb 2, 2012
- Applied Materials, Inc.
- Alan Ritchie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DIELECTRIC FILM FORMATION USING INERT GAS EXCITATION
- Publication number 20110165347
- Publication date Jul 7, 2011
- Applied Materials, Inc.
- Matthew L. Miller
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA ETCHING METHOD, PLASMA ETCHING DEVICE, AND METHOD FOR PRODUC...
- Publication number 20110151673
- Publication date Jun 23, 2011
- Japan Science and Technology Agency
- Susumu Noda
- G02 - OPTICS
Information Patent Application
IONIZED PHYSICAL VAPOR DEPOSITION (iPVD) PROCESS
- Publication number 20090321247
- Publication date Dec 31, 2009
- TOKYO ELECTRON LIMITED
- Frank M. Cerio, JR.
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20090233438
- Publication date Sep 17, 2009
- Applied Materials, Inc.
- Peijun DING
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20080110747
- Publication date May 15, 2008
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA SPUTTERING FILM DEPOSITION METHOD AND EQUIPMENT
- Publication number 20080038919
- Publication date Feb 14, 2008
- TOKYO ELECTRON LIMITED
- Taro IKEDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
High throughput ILD fill process for high aspect ratio gap fill
- Publication number 20060029745
- Publication date Feb 9, 2006
- Gurtej S. Sandhu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Highly ionized PVD with moving magnetic field envelope for uniform...
- Publication number 20050279624
- Publication date Dec 22, 2005
- Jozef Brcka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Publication number 20050255691
- Publication date Nov 17, 2005
- APPLIED MATERIALS, INC.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Pulsed magnetron for sputter deposition
- Publication number 20050247554
- Publication date Nov 10, 2005
- APPLIED MATERIALS, INC.
- Dinesh Saigal
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Ionized physical vapor deposition (iPVD) process
- Publication number 20050211545
- Publication date Sep 29, 2005
- Frank M. Cerio
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for improving sidewall coverage during sputter...
- Publication number 20050205414
- Publication date Sep 22, 2005
- APPLIED MATERIALS, INC.
- Kenny King-tai Ngan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Shields usable with an inductively coupled plasma reactor
- Publication number 20050199491
- Publication date Sep 15, 2005
- Tza-Jing Gung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Publication number 20050006222
- Publication date Jan 13, 2005
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Laser selection of ions for sputter deposition of titanium containi...
- Publication number 20040216993
- Publication date Nov 4, 2004
- Gurtej S. Sandhu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Coating high aspect ratio workpieces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods for depositing dielectric material

Methods for depositing dielectric material

Processing method and plasma processing apparatus

Processing method and plasma processing apparatus

Plasma beam penetration of millimeter scale holes with high aspect...

Self-ionized and inductively-coupled plasma for sputtering and resp...

Plasma etching method, plasma etching device, and method for produc...

Methods for depositing metal in high aspect ratio features

Self-ionized and inductively-coupled plasma for sputtering and resp...

Self-ionized and inductively-coupled plasma for sputtering and resp...

Dielectric film formation using inert gas excitation

Ionized physical vapor deposition (iPVD) process

Plasma sputtering film deposition method and equipment

Shields usable with an inductively coupled plasma reactor

Highly ionized PVD with moving magnetic field envelope for uniform...

Deposition process for high aspect ratio trenches

Gas chemistry cycling to achieve high aspect ratio gapfill with HDP...

Sidewall magnet improving uniformity of inductively coupled plasma...

Method and apparatus for depositing films

Method and apparatus for improving sidewall coverage during sputter...

Multi-step process for depositing copper seed layer in a via

Auxiliary magnet array in conjunction with magnetron sputtering

High-density plasma process for filling high aspect ratio structures

Enhanced collimated deposition

Resputtering to achieve better step coverage

Gap fill for high aspect ratio structures

Laser selection of ions for sputter deposition of titanium containi...

Magnet array in conjunction with rotating magnetron for plasma sput...

Gap fill for high aspect ratio structures

Process for sputtering copper in a self ionized plasma

Patents Applicationslast 30 patents

ADJUSTABLE DE-CHUCKING VOLTAGE

HIGH ASPECT RATIO ETCH WITH INFINITE SELECTIVITY

RADIO FREQUENCY (RF) POWER IMBALANCING IN A MULTI-STATION INTEGRATE...

METHODS FOR DEPOSITING DIELECTRIC MATERIAL

SUBSTRATE PROCESSING APPARATUS

HIGH ASPECT RATIO DEPOSITION

PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

PLASMA BEAM PENETRATION OF MILLIMETER SCALE HOLES WITH HIGH ASPECT...

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

METHOD FOR VOID-FREE COBALT GAP FILL

IN-LINE MANUFACTURE OF CARBON NANOTUBES

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

Feedback Via an Input Device and Scribble Recognition

METHODS FOR DEPOSITING METAL IN HIGH ASPECT RATIO FEATURES

DIELECTRIC FILM FORMATION USING INERT GAS EXCITATION

PLASMA ETCHING METHOD, PLASMA ETCHING DEVICE, AND METHOD FOR PRODUC...

IONIZED PHYSICAL VAPOR DEPOSITION (iPVD) PROCESS

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

PLASMA SPUTTERING FILM DEPOSITION METHOD AND EQUIPMENT

High throughput ILD fill process for high aspect ratio gap fill

Highly ionized PVD with moving magnetic field envelope for uniform...

Self-ionized and inductively-coupled plasma for sputtering and resp...

Pulsed magnetron for sputter deposition

Ionized physical vapor deposition (iPVD) process

Method and apparatus for improving sidewall coverage during sputter...

Shields usable with an inductively coupled plasma reactor

Self-ionized and inductively-coupled plasma for sputtering and resp...

Laser selection of ions for sputter deposition of titanium containi...