Cobalt (Co) as principal constituent

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H01L2224/48657

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48657Cobalt (Co) as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Thin NiB or CoB capping layer for non-noble metallic bonding landin...
- Patent number 10,066,303
- Issue date Sep 4, 2018
- Imec VZW
- Eric Beyne
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device and method for the production thereof
- Publication number 20020070446
- Publication date Jun 13, 2002
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS