Cobalt [Co] as principal constituent

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H01L2224/83657

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83657Cobalt [Co] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for forming contacts on an integrated circuit...
- Patent number 10,685,931
- Issue date Jun 16, 2020
- CATLAM LLC
- Kenneth S. Bahl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuit wafer integration with catalytic laminate or adh...
- Patent number 9,922,951
- Issue date Mar 20, 2018
- Sierra Circuits, Inc.
- Kenneth S. Bahl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method and Apparatus for forming Contacts on an Integrated Circuit...
- Publication number 20180158793
- Publication date Jun 7, 2018
- SIERRA CIRCUITS, INC.
- Kenneth S. Bahl
- H01 - BASIC ELECTRIC ELEMENTS