TREA

Cobalt [Co] as principal constituent

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  • CPC
  • H01L2224/29257
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29257Cobalt [Co] as principal constituent
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230130647
    • Publication date Apr 27, 2023
    • DENSO CORPORATION
    • Tetsuto YAMAGISHI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20220093719
    • Publication date Mar 24, 2022
    • SAMSUNG DISPLAY CO., LTD.
    • Joo-nyung JANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20200403054
    • Publication date Dec 24, 2020
    • SAMSUNG DISPLAY CO., LTD.
    • Joo-nyung JANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...
    • Publication number 20200075528
    • Publication date Mar 5, 2020
    • Hitachi Chemical Company, Ltd.
    • Yuki KAWANA
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Application

    MOUNT STRUCTURE
    • Publication number 20180166411
    • Publication date Jun 14, 2018
    • Panasonic Intellectual Property Management Co., Lt
    • KIYOHIRO HINE
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...