TREA

Cobalt [Co] as principal constituent

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Industry

  • CPC
  • H01L2224/13857
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13857Cobalt [Co] as principal constituent
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Doping minor elements into metal bumps
    • Patent number 8,227,334
    • Issue date Jul 24, 2012
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Ming-Da Cheng
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Doping Minor Elements into Metal Bumps
    • Publication number 20120286423
    • Publication date Nov 15, 2012
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Ming-Da Cheng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Doping Minor Elements into Metal Bumps
    • Publication number 20120018878
    • Publication date Jan 26, 2012
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Ming-Da Cheng
    • H01 - BASIC ELECTRIC ELEMENTS