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Cobalt [Co] as principal constituent
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CPC
H01L2224/13457
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/13457
Cobalt [Co] as principal constituent
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last 30 patents
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Patent Grant
Cu core ball, solder paste, formed solder, Cu core column, and sold...
Patent number
10,322,472
Issue date
Jun 18, 2019
Senju Metal Industry Co., Ltd.
Takahiro Hattori
B22 - CASTING POWDER METALLURGY