Cobalt (Co) as principal constituent

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H01L2224/85457

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/85457Cobalt (Co) as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Electronic component, semiconductor package, and electronic device...
- Patent number 10,083,136
- Issue date Sep 25, 2018
- Samsung Electronics Co., Ltd.
- Nam-ho Song
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thin NiB or CoB capping layer for non-noble metallic bonding landin...
- Patent number 10,066,303
- Issue date Sep 4, 2018
- Imec VZW
- Eric Beyne
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Structure for multi-row lead frame and semiconductor package capabl...
- Patent number 8,659,131
- Issue date Feb 25, 2014
- LG Innotek Co., Ltd
- Ji Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device having die bonded to the polymer side of...
- Patent number 8,456,021
- Issue date Jun 4, 2013
- Texas Instruments Incorporated
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding inner leads to bond pads without bumps and struc...
- Patent number 6,656,772
- Issue date Dec 2, 2003
- Industrial Technology Research Institute
- Yuan-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICE HAVING DIE BONDED TO THE POLYMER SIDE OF...
- Publication number 20120126418
- Publication date May 24, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Manufacture Method For Multi-Row Lead Frame and Semic...
- Publication number 20110227208
- Publication date Sep 22, 2011
- Ji Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for bonding inner leads to bond pads without bumps and struc...
- Publication number 20030098513
- Publication date May 29, 2003
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Yuan-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS