Cobalt [Co] as principal constituent

Industry

CPC
H01L2224/13657

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13657Cobalt [Co] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Industrial chip scale package for microelectronic device
- Patent number 11,749,616
- Issue date Sep 5, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,705,379
- Issue date Jul 18, 2023
- Samsung Electronics Co., Ltd.
- Chanho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a heterogeneous solder joint and method f...
- Patent number 11,682,644
- Issue date Jun 20, 2023
- Infineon Technologies AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using core material for reverse reflow
- Patent number 11,646,285
- Issue date May 9, 2023
- MK Electron Co., Ltd.
- Jae Yeol Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core material, electronic component and method for forming bump ele...
- Patent number 11,495,566
- Issue date Nov 8, 2022
- Senju Metal Industry Co., Ltd.
- Shigeki Kondoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bond structure for enhanced electromigration performance
- Patent number 11,450,638
- Issue date Sep 20, 2022
- Texas Instruments Incorporated
- Dibyajat Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip with magnetic interconnect alignment
- Patent number 11,296,050
- Issue date Apr 5, 2022
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect crack arrestor structure and methods
- Patent number 11,257,767
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering material
- Patent number 10,888,957
- Issue date Jan 12, 2021
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding package components through plating
- Patent number 10,840,212
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu column, Cu core column, solder joint, and through-silicon via
- Patent number 10,811,376
- Issue date Oct 20, 2020
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bump bond structure for enhanced electromigration performance
- Patent number 10,763,231
- Issue date Sep 1, 2020
- Texas Instruments Incorporated
- Dibyajat Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu core ball, solder joint, solder paste and formed solder
- Patent number 10,639,749
- Issue date May 5, 2020
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Expanded head pillar for bump bonds
- Patent number 10,636,758
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding package components through plating
- Patent number 10,483,230
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alloy diffusion barrier layer
- Patent number 10,424,552
- Issue date Sep 24, 2019
- Texas Instruments Incorporated
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Advanced through substrate via metallization in three dimensional s...
- Patent number 10,396,013
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced through substrate via metallization in three dimensional s...
- Patent number 10,396,012
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core material, semiconductor package, and forming method of bump el...
- Patent number 10,381,319
- Issue date Aug 13, 2019
- Senju Metal Industry Co., Ltd.
- Tomoaki Nishino
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of manufacturing cu core ball
- Patent number 10,370,771
- Issue date Aug 6, 2019
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Interconnect crack arrestor structure and methods
- Patent number 10,340,226
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test probe head for full wafer testing
- Patent number 10,330,701
- Issue date Jun 25, 2019
- International Business Machines Corporation
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu core ball, solder paste, formed solder, Cu core column, and sold...
- Patent number 10,322,472
- Issue date Jun 18, 2019
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for producing metal ball, joining material, and metal ball
- Patent number 10,150,185
- Issue date Dec 11, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu core ball
- Patent number 10,147,695
- Issue date Dec 4, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming surface protrusions on an article and the article...
- Patent number 10,132,836
- Issue date Nov 20, 2018
- International Business Machines Corporation
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure for semiconductor package and method of manufactu...
- Patent number 9,984,993
- Issue date May 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Min-Fong Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free solder alloy, solder material and joined structure
- Patent number 9,764,430
- Issue date Sep 19, 2017
- KOKI COMPANY LIMITED
- Atsushi Irisawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect structure comprising fine pitch backside metal redistr...
- Patent number 9,716,066
- Issue date Jul 25, 2017
- Intel Corporation
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 9,698,088
- Issue date Jul 4, 2017
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR...
- Publication number 20240213198
- Publication date Jun 27, 2024
- Intel Corporation
- Liang He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE
- Publication number 20240162163
- Publication date May 16, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PILLAR FOR CONDUCTIVE CONNECTION
- Publication number 20240088079
- Publication date Mar 14, 2024
- DUKSAN HI-METAL CO., LTD.
- Eun Dong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING STRUCTURE, PACKAGE STRUCTURE AND MANUFACTURING METHOD TH...
- Publication number 20220336400
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE MATERIAL, ELECTRONIC COMPONENT AND METHOD FOR FORMING BUMP ELE...
- Publication number 20220077093
- Publication date Mar 10, 2022
- SENJU METAL INDUSTRY CO., LTD.
- Shigeki KONDOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A HETEROGENEOUS SOLDER JOINT AND METHOD F...
- Publication number 20220005778
- Publication date Jan 6, 2022
- INFINEON TECHNOLOGIES AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING CORE MATERIAL FOR REVERSE REFLOW
- Publication number 20210366858
- Publication date Nov 25, 2021
- MK ELECTRON CO., LTD.
- Jae Yeol SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP WITH MAGNETIC INTERCONNECT ALIGNMENT
- Publication number 20210066240
- Publication date Mar 4, 2021
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE
- Publication number 20200402938
- Publication date Dec 24, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Dibyajat Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20200258856
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE
- Publication number 20200035633
- Publication date Jan 30, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Dibyajat Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOY DIFFUSION BARRIER LAYER
- Publication number 20200020656
- Publication date Jan 16, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Bonding Package Components Through Plating
- Publication number 20200020662
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Crack Arrestor Structure and Methods
- Publication number 20190326228
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOY DIFFUSION BARRIER LAYER
- Publication number 20190088608
- Publication date Mar 21, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF FORMING SURFACE PROTRUSIONS ON AN ARTICLE AND THE ARTICLE...
- Publication number 20180348259
- Publication date Dec 6, 2018
- International Business Machines Corporation
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cu Column, Cu Core Column, Solder Joint, and Through-Silicon Via
- Publication number 20170287862
- Publication date Oct 5, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- B32 - LAYERED PRODUCTS
Information Patent Application
CORE FOR REVERSE REFLOW, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRI...
- Publication number 20160315040
- Publication date Oct 27, 2016
- MK Electron Co., Ltd.
- Jae Yeol SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP AND FABRICATION METHOD
- Publication number 20150287689
- Publication date Oct 8, 2015
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BAL...
- Publication number 20150217409
- Publication date Aug 6, 2015
- Senju Metal lndustry Co., Ltd.
- Takashi AKAGAWA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CORE BALL, SOLDER PASTE, FORMED-SOLDER, FLUX-COATED CORE BALL AND S...
- Publication number 20150217408
- Publication date Aug 6, 2015
- Senju Metal lndustry Co., Ltd.
- Hiroyoshi KAWASAKI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Cu CORE BALL, SOLDER PASTE AND SOLDER JOINT
- Publication number 20150209912
- Publication date Jul 30, 2015
- Senju Metal lndustry Co., Ltd.
- Hiroyoshi KAWASAKI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER PILLAR BUMP WITH COBALT-CONTAINING SIDEWALL PROTECTION LAYER
- Publication number 20140342546
- Publication date Nov 20, 2014
- Chien Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Package components Through Plating
- Publication number 20130334692
- Publication date Dec 19, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTERCONNECT STRUCTURE COMPRISING FINE PITCH SINGLE DAMASCENE BA...
- Publication number 20130256910
- Publication date Oct 3, 2013
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE LAYER FOR PROTECTING TSV TIPS DURING THERMO-COMPRESSIVE...
- Publication number 20130249098
- Publication date Sep 26, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Crack Arrestor Structure and Methods
- Publication number 20130207239
- Publication date Aug 15, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...
- Publication number 20130200520
- Publication date Aug 8, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20130130496
- Publication date May 23, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chyi-Tsong NI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...
- Publication number 20130113106
- Publication date May 9, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS

Cobalt [Co] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Industrial chip scale package for microelectronic device

Semiconductor packages

Semiconductor device with a heterogeneous solder joint and method f...

Semiconductor package using core material for reverse reflow

Core material, electronic component and method for forming bump ele...

Bump bond structure for enhanced electromigration performance

Chip with magnetic interconnect alignment

Interconnect crack arrestor structure and methods

Soldering material

Bonding package components through plating

Cu column, Cu core column, solder joint, and through-silicon via

Bump bond structure for enhanced electromigration performance

Cu core ball, solder joint, solder paste and formed solder

Expanded head pillar for bump bonds

Bonding package components through plating

Alloy diffusion barrier layer

Advanced through substrate via metallization in three dimensional s...

Advanced through substrate via metallization in three dimensional s...

Core material, semiconductor package, and forming method of bump el...

Method of manufacturing cu core ball

Interconnect crack arrestor structure and methods

Test probe head for full wafer testing

Cu core ball, solder paste, formed solder, Cu core column, and sold...

Method for producing metal ball, joining material, and metal ball

Cu core ball

Method of forming surface protrusions on an article and the article...

Bonding structure for semiconductor package and method of manufactu...

Lead-free solder alloy, solder material and joined structure

Interconnect structure comprising fine pitch backside metal redistr...

Semiconductor packages

Patents Applicationslast 30 patents

UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR...

INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE

METAL PILLAR FOR CONDUCTIVE CONNECTION

CONNECTING STRUCTURE, PACKAGE STRUCTURE AND MANUFACTURING METHOD TH...

CORE MATERIAL, ELECTRONIC COMPONENT AND METHOD FOR FORMING BUMP ELE...

SEMICONDUCTOR DEVICE WITH A HETEROGENEOUS SOLDER JOINT AND METHOD F...

SEMICONDUCTOR PACKAGE USING CORE MATERIAL FOR REVERSE REFLOW

CHIP WITH MAGNETIC INTERCONNECT ALIGNMENT

BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE

EXPANDED HEAD PILLAR FOR BUMP BONDS

BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE

ALLOY DIFFUSION BARRIER LAYER

Bonding Package Components Through Plating

Interconnect Crack Arrestor Structure and Methods

ALLOY DIFFUSION BARRIER LAYER

METHOD OF FORMING SURFACE PROTRUSIONS ON AN ARTICLE AND THE ARTICLE...

Cu Column, Cu Core Column, Solder Joint, and Through-Silicon Via

CORE FOR REVERSE REFLOW, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRI...

INTEGRATED CIRCUIT CHIP AND FABRICATION METHOD

Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BAL...

CORE BALL, SOLDER PASTE, FORMED-SOLDER, FLUX-COATED CORE BALL AND S...

Cu CORE BALL, SOLDER PASTE AND SOLDER JOINT

COPPER PILLAR BUMP WITH COBALT-CONTAINING SIDEWALL PROTECTION LAYER

Bonding Package components Through Plating

3D INTERCONNECT STRUCTURE COMPRISING FINE PITCH SINGLE DAMASCENE BA...

PROTECTIVE LAYER FOR PROTECTING TSV TIPS DURING THERMO-COMPRESSIVE...

Interconnect Crack Arrestor Structure and Methods

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...

SEMICONDUCTOR APPARATUS

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...