Cobalt [Co] as principal constituent

Industry

CPC
H01L2224/13157

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13157Cobalt [Co] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Fan-out interconnect integration processes and structures
- Patent number 12,074,106
- Issue date Aug 27, 2024
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tin or tin alloy electroplating bath, and electronic component havi...
- Patent number 11,939,691
- Issue date Mar 26, 2024
- Ishihara Chemical Co., LTD
- Syohei Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 11,901,325
- Issue date Feb 13, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect integration processes and structures
- Patent number 11,699,651
- Issue date Jul 11, 2023
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding element and method for manufacturing the same
- Patent number 11,621,241
- Issue date Apr 4, 2023
- NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- Han-Wen Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having exposed redistribution layer features...
- Patent number 11,600,523
- Issue date Mar 7, 2023
- Microchip Technology Incorporated
- ManKit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming bonding structures by using template layer as templates
- Patent number 11,594,484
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zinc-cobalt barrier for interface in solder bond applications
- Patent number 11,587,858
- Issue date Feb 21, 2023
- Texas Instruments Incorporated
- Nazila Dadvand
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked semiconductor device, and set of onboard-components, body a...
- Patent number 11,462,668
- Issue date Oct 4, 2022
- TOHOKU-MICROTEC CO., LTD.
- Makoto Motoyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with redistribution layers
- Patent number 11,393,797
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme for bumping
- Patent number 11,302,663
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme for bumping
- Patent number 11,164,836
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zinc-cobalt barrier for interface in solder bond applications
- Patent number 11,011,488
- Issue date May 18, 2021
- Texas Instruments Incorporated
- Nazila Dadvand
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Scheme for connector site spacing and resulting structures
- Patent number 10,985,114
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with redistribution layers
- Patent number 10,867,967
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact fabrication to mitigate undercut
- Patent number 10,796,956
- Issue date Oct 6, 2020
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming bonding structures by using template layer as templates
- Patent number 10,700,001
- Issue date Jun 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme for bumping
- Patent number 10,658,318
- Issue date May 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scheme for connector site spacing and resulting structures
- Patent number 10,504,856
- Issue date Dec 10, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of chip package with redistribution...
- Patent number 10,461,060
- Issue date Oct 29, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zinc-cobalt barrier for interface in solder bond applications
- Patent number 10,453,817
- Issue date Oct 22, 2019
- Texas Instruments Incorporated
- Nazila Dadvand
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Core material, semiconductor package, and forming method of bump el...
- Patent number 10,381,319
- Issue date Aug 13, 2019
- Senju Metal Industry Co., Ltd.
- Tomoaki Nishino
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Wafer stacking for integrated circuit manufacturing
- Patent number 10,361,140
- Issue date Jul 23, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Immersion interconnections for semiconductor devices and methods of...
- Patent number 10,229,901
- Issue date Mar 12, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin composition, semiconductor sealing agent, and semicondu...
- Patent number 10,196,513
- Issue date Feb 5, 2019
- Namics Corporation
- Tomoya Yamazawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Multilayer substrate
- Patent number 10,199,358
- Issue date Feb 5, 2019
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material, solder joint, and method of manufacturing the sold...
- Patent number 10,173,287
- Issue date Jan 8, 2019
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for producing metal ball, joining material, and metal ball
- Patent number 10,150,185
- Issue date Dec 11, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure with array of micrometer scale copper pillar ba...
- Patent number 10,128,123
- Issue date Nov 13, 2018
- Imec VZW
- Bivragh Majeed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable device assembly
- Patent number 9,893,030
- Issue date Feb 13, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240145367
- Publication date May 2, 2024
- MEDIATEK SINGAPORE PTE LTD
- Jubao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240096819
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Bong Ken YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK REDISTRIBUTION LAYER FEATURES
- Publication number 20240088074
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Feng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY INTERCONNECTION PILLARS AND ASSOCIATE...
- Publication number 20240038707
- Publication date Feb 1, 2024
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...
- Publication number 20230154885
- Publication date May 18, 2023
- Samsung Electronics Co., LTD
- Jinyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230145304
- Publication date May 11, 2023
- InnoLux Corporation
- Yi-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230111343
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Choong Bin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING ELEMENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230025936
- Publication date Jan 26, 2023
- National Yang Ming Chiao Tung University
- Han-Wen HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D PRINTED INTERCONNECTS AND RESONATORS FOR SEMICONDUCTOR DEVICES
- Publication number 20230005870
- Publication date Jan 5, 2023
- MACOM Technology Solutions Holdings, Inc.
- Rathnait Long
- B22 - CASTING POWDER METALLURGY
Information Patent Application
POROUS FLI BUMPS FOR REDUCING BUMP THICKNESS VARIATION SENSITIVITY...
- Publication number 20220165695
- Publication date May 26, 2022
- Intel Corporation
- Numair AHMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE, AND SET OF ONBOARD-COMPONENTS, BODY A...
- Publication number 20210399184
- Publication date Dec 23, 2021
- TOHOKU-MICROTEC CO., LTD.
- Makoto MOTOYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FABRICATION TO MITIGATE UNDERCUT
- Publication number 20210028060
- Publication date Jan 28, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM SCHEME FOR BUMPING
- Publication number 20200243469
- Publication date Jul 30, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH REDISTRIBUTION LAYERS
- Publication number 20200058620
- Publication date Feb 20, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Design Scheme for Connector Site Spacing and Resulting Structures
- Publication number 20200058601
- Publication date Feb 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FABRICATION TO MITIGATE UNDERCUT
- Publication number 20200006134
- Publication date Jan 2, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTIC TIN OR TIN ALLOY PLATING BATH AND ELECTRONIC COMPONENT...
- Publication number 20190368063
- Publication date Dec 5, 2019
- ISHIHARA CHEMICAL CO., LTD.
- Syohei YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STACKING FOR INTEGRATED CIRCUIT MANUFACTURING
- Publication number 20190326190
- Publication date Oct 24, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20190206841
- Publication date Jul 4, 2019
- SAMSUNG ELECTRONICS CO., LTD.
- Young Lyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE THEREOF
- Publication number 20170373050
- Publication date Dec 28, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STACKING FOR INTEGRATED CIRCUIT MANUFACTURING
- Publication number 20170358554
- Publication date Dec 14, 2017
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Material, Solder Joint, and Method of Manufacturing the Sold...
- Publication number 20170252871
- Publication date Sep 7, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Lead-Free Solder Ball
- Publication number 20160339543
- Publication date Nov 24, 2016
- SENJU METAL INDUSTRY CO., LTD.
- Tsukasa Ohnishi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Semiconductor Package Configured for Connection to a Board
- Publication number 20160329292
- Publication date Nov 10, 2016
- INFINEON TECHNOLOGIES AG
- Carlo Marbella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REACTIVE BONDING OF A FLIP CHIP PACKAGE
- Publication number 20150137366
- Publication date May 21, 2015
- International Business Machines Corporation
- Gregory M. Fritz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150115440
- Publication date Apr 30, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Yuichi HIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE DEVICE ASSEMBLY
- Publication number 20140376200
- Publication date Dec 25, 2014
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP WITH COBALT-CONTAINING SIDEWALL PROTECTION LAYER
- Publication number 20140342546
- Publication date Nov 20, 2014
- Chien Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Design Scheme for Connector Site Spacing and Resulting Structures
- Publication number 20140291838
- Publication date Oct 2, 2014
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including RDL Along Sloped Side Surface of Sem...
- Publication number 20140264786
- Publication date Sep 18, 2014
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS

Cobalt [Co] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fan-out interconnect integration processes and structures

Tin or tin alloy electroplating bath, and electronic component havi...

Multilayer substrate

Fan-out interconnect integration processes and structures

Bonding element and method for manufacturing the same

Semiconductor package having exposed redistribution layer features...

Forming bonding structures by using template layer as templates

Zinc-cobalt barrier for interface in solder bond applications

Stacked semiconductor device, and set of onboard-components, body a...

Chip package with redistribution layers

Film scheme for bumping

Film scheme for bumping

Zinc-cobalt barrier for interface in solder bond applications

Scheme for connector site spacing and resulting structures

Chip package with redistribution layers

Contact fabrication to mitigate undercut

Forming bonding structures by using template layer as templates

Film scheme for bumping

Scheme for connector site spacing and resulting structures

Structure and formation method of chip package with redistribution...

Zinc-cobalt barrier for interface in solder bond applications

Core material, semiconductor package, and forming method of bump el...

Wafer stacking for integrated circuit manufacturing

Immersion interconnections for semiconductor devices and methods of...

Epoxy resin composition, semiconductor sealing agent, and semicondu...

Multilayer substrate

Solder material, solder joint, and method of manufacturing the sold...

Method for producing metal ball, joining material, and metal ball

Substrate structure with array of micrometer scale copper pillar ba...

Reliable device assembly

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

THICK REDISTRIBUTION LAYER FEATURES

SEMICONDUCTOR DEVICE ASSEMBLY INTERCONNECTION PILLARS AND ASSOCIATE...

SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

BONDING ELEMENT AND METHOD FOR MANUFACTURING THE SAME

3D PRINTED INTERCONNECTS AND RESONATORS FOR SEMICONDUCTOR DEVICES

POROUS FLI BUMPS FOR REDUCING BUMP THICKNESS VARIATION SENSITIVITY...

STACKED SEMICONDUCTOR DEVICE, AND SET OF ONBOARD-COMPONENTS, BODY A...

CONTACT FABRICATION TO MITIGATE UNDERCUT

FILM SCHEME FOR BUMPING

CHIP PACKAGE WITH REDISTRIBUTION LAYERS

Design Scheme for Connector Site Spacing and Resulting Structures

CONTACT FABRICATION TO MITIGATE UNDERCUT

ELECTROLYTIC TIN OR TIN ALLOY PLATING BATH AND ELECTRONIC COMPONENT...

WAFER STACKING FOR INTEGRATED CIRCUIT MANUFACTURING

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE THEREOF

WAFER STACKING FOR INTEGRATED CIRCUIT MANUFACTURING

Solder Material, Solder Joint, and Method of Manufacturing the Sold...

Lead-Free Solder Ball

Semiconductor Package Configured for Connection to a Board

REACTIVE BONDING OF A FLIP CHIP PACKAGE

SEMICONDUCTOR DEVICE

RELIABLE DEVICE ASSEMBLY

COPPER PILLAR BUMP WITH COBALT-CONTAINING SIDEWALL PROTECTION LAYER

Design Scheme for Connector Site Spacing and Resulting Structures

Semiconductor Device Including RDL Along Sloped Side Surface of Sem...