Cobalt (Co) as principal constituent

Industry

CPC
H01L2224/48757

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48757Cobalt (Co) as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and inspection device
- Patent number 12,040,303
- Issue date Jul 16, 2024
- Kabushiki Kaisha Toshiba
- Mitsuaki Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin NiB or CoB capping layer for non-noble metallic bonding landin...
- Patent number 10,066,303
- Issue date Sep 4, 2018
- Imec VZW
- Eric Beyne
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bonding connection between a bonding wire and a power semiconductor...
- Patent number 8,541,892
- Issue date Sep 24, 2013
- Infineon Technologies AG
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a power device with first metal laye...
- Patent number 7,851,913
- Issue date Dec 14, 2010
- Infineon Technologies AG
- Thomas Gutt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnection with conductive polymer layer and method of...
- Patent number 7,538,434
- Issue date May 26, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND INSPECTION DEVICE
- Publication number 20210296279
- Publication date Sep 23, 2021
- Kabushiki Kaisha Toshiba
- Mitsuaki KATO
- G01 - MEASURING TESTING
Information Patent Application
Bonding Connection Between a Bonding Wire and a Power Semiconductor...
- Publication number 20110121458
- Publication date May 26, 2011
- INFINEON TECHNOLOGIES AG
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for producing a semiconductor device
- Publication number 20080122091
- Publication date May 29, 2008
- Thomas Gutt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20070262468
- Publication date Nov 15, 2007
- Hayato Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper interconnection with conductive polymer layer and method of...
- Publication number 20060202346
- Publication date Sep 14, 2006
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method to produce the same
- Publication number 20020113322
- Publication date Aug 22, 2002
- Shinichi Terashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for the production thereof
- Publication number 20020070446
- Publication date Jun 13, 2002
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS

Cobalt (Co) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and inspection device

Thin NiB or CoB capping layer for non-noble metallic bonding landin...

Bonding connection between a bonding wire and a power semiconductor...

Semiconductor device including a power device with first metal laye...

Copper interconnection with conductive polymer layer and method of...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND INSPECTION DEVICE

Bonding Connection Between a Bonding Wire and a Power Semiconductor...

Semiconductor device and method for producing a semiconductor device

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Copper interconnection with conductive polymer layer and method of...

Semiconductor device and method to produce the same

Semiconductor device and method for the production thereof