Cobalt (Co) as principal constituent

Industry

CPC
H01L2224/45157

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45157Cobalt (Co) as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and inspection device
- Patent number 12,040,303
- Issue date Jul 16, 2024
- Kabushiki Kaisha Toshiba
- Mitsuaki Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including cobalt alloys and fabrication metho...
- Patent number 11,380,619
- Issue date Jul 5, 2022
- Tohoku University
- Junichi Koike
- G11 - INFORMATION STORAGE
Information Patent Grant
Copper-based alloy wire and methods for manufaturing the same
- Patent number 9,997,488
- Issue date Jun 12, 2018
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Segmented bond pads and methods of fabrication thereof
- Patent number 9,543,260
- Issue date Jan 10, 2017
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack-type semiconductor package
- Patent number 9,299,631
- Issue date Mar 29, 2016
- Samsung Electronics Co., Ltd.
- Ae-Nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable wire method
- Patent number 9,245,670
- Issue date Jan 26, 2016
- Tessera, Inc.
- Cyprian Uzoh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Stack type semiconductor package
- Patent number 9,171,827
- Issue date Oct 27, 2015
- Samsung Electronics Co., Ltd.
- Jin-Ho Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus with a multi-layer coating and method of forming the same
- Patent number 9,055,700
- Issue date Jun 9, 2015
- Semblant Limited
- Mark Robson Humphries
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reliable wire structure and method
- Patent number 8,692,118
- Issue date Apr 8, 2014
- Tessera, Inc.
- Cyprian Uzoh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor package apparatus
- Patent number 8,653,640
- Issue date Feb 18, 2014
- Samsung Electronics Co., Ltd.
- Tae-hun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level integrated circuit package with top and bottom side ele...
- Patent number 8,018,065
- Issue date Sep 13, 2011
- Atmel Corporation
- Ken Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Iridium oxide nanowires and method for forming same
- Patent number 7,255,745
- Issue date Aug 14, 2007
- Sharp Laboratories of America, Inc.
- Fengyan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component of a high frequency current suppression type a...
- Patent number 6,903,440
- Issue date Jun 7, 2005
- NEC Tokin Corp.
- Shigeyoshi Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component of a high frequency current suppression type a...
- Patent number 6,635,961
- Issue date Oct 21, 2003
- NEC Tokin Corp.
- Shigeyoshi Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring boards, semiconductor devices and their production processes
- Patent number 6,469,260
- Issue date Oct 22, 2002
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND INSPECTION DEVICE
- Publication number 20210296279
- Publication date Sep 23, 2021
- Kabushiki Kaisha Toshiba
- Mitsuaki KATO
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING COBALT ALLOYS AND FABRICATION METHO...
- Publication number 20200365192
- Publication date Nov 19, 2020
- TOHOKU UNIVERSITY
- Junichi KOIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK TYPE SEMICONDUCTOR PACKAGE
- Publication number 20140291868
- Publication date Oct 2, 2014
- JIN-HO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER-BASED ALLOY WIRE AND METHODS FOR MANUFATURING THE SAME
- Publication number 20140209215
- Publication date Jul 31, 2014
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE WIRE STRUCTURE AND METHOD
- Publication number 20140157592
- Publication date Jun 12, 2014
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE WIRE STRUCTURE AND METHOD
- Publication number 20120325517
- Publication date Dec 27, 2012
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE APPARATUS
- Publication number 20120306075
- Publication date Dec 6, 2012
- TAE-HUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus with a Multi-Layer Coating and Method of Forming the Same
- Publication number 20110253429
- Publication date Oct 20, 2011
- Semblant Global Limited
- Mark Robson Humphries
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer-Level Integrated Circuit Package with Top and Bottom Side Ele...
- Publication number 20090218698
- Publication date Sep 3, 2009
- ATMEL CORPORATION
- Ken LAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Iridium oxide nanowires and method for forming same
- Publication number 20060086314
- Publication date Apr 27, 2006
- Sharp Laboratories of America, Inc.
- Fengyan Zhang
- C30 - CRYSTAL GROWTH
Information Patent Application
Electronic component of a high frequency current suppression type a...
- Publication number 20040188833
- Publication date Sep 30, 2004
- Shigeyoshi Yoshida
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Electronic component of a high frequency current suppression type a...
- Publication number 20010026016
- Publication date Oct 4, 2001
- Shigeyoshi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring boards, semiconductor devices and their production processes
- Publication number 20010017221
- Publication date Aug 30, 2001
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS

Cobalt (Co) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and inspection device

Semiconductor devices including cobalt alloys and fabrication metho...

Copper-based alloy wire and methods for manufaturing the same

Segmented bond pads and methods of fabrication thereof

Stack-type semiconductor package

Reliable wire method

Stack type semiconductor package

Apparatus with a multi-layer coating and method of forming the same

Reliable wire structure and method

Semiconductor package apparatus

Wafer-level integrated circuit package with top and bottom side ele...

Iridium oxide nanowires and method for forming same

Electronic component of a high frequency current suppression type a...

Electronic component of a high frequency current suppression type a...

Wiring boards, semiconductor devices and their production processes

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND INSPECTION DEVICE

SEMICONDUCTOR DEVICES INCLUDING COBALT ALLOYS AND FABRICATION METHO...

STACK TYPE SEMICONDUCTOR PACKAGE

COPPER-BASED ALLOY WIRE AND METHODS FOR MANUFATURING THE SAME

RELIABLE WIRE STRUCTURE AND METHOD

RELIABLE WIRE STRUCTURE AND METHOD

SEMICONDUCTOR PACKAGE APPARATUS

Apparatus with a Multi-Layer Coating and Method of Forming the Same

Wafer-Level Integrated Circuit Package with Top and Bottom Side Ele...

Iridium oxide nanowires and method for forming same

Electronic component of a high frequency current suppression type a...

Electronic component of a high frequency current suppression type a...

Wiring boards, semiconductor devices and their production processes