Cobalt (Co) as principal constituent

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H01L2224/48857

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48857Cobalt (Co) as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and inspection device
- Patent number 12,040,303
- Issue date Jul 16, 2024
- Kabushiki Kaisha Toshiba
- Mitsuaki Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin NiB or CoB capping layer for non-noble metallic bonding landin...
- Patent number 10,066,303
- Issue date Sep 4, 2018
- Imec VZW
- Eric Beyne
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device including a power device with first metal laye...
- Patent number 7,851,913
- Issue date Dec 14, 2010
- Infineon Technologies AG
- Thomas Gutt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnection with conductive polymer layer and method of...
- Patent number 7,538,434
- Issue date May 26, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND INSPECTION DEVICE
- Publication number 20210296279
- Publication date Sep 23, 2021
- Kabushiki Kaisha Toshiba
- Mitsuaki KATO
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor device and method for producing a semiconductor device
- Publication number 20080122091
- Publication date May 29, 2008
- Thomas Gutt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20070262468
- Publication date Nov 15, 2007
- Hayato Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper interconnection with conductive polymer layer and method of...
- Publication number 20060202346
- Publication date Sep 14, 2006
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method to produce the same
- Publication number 20020113322
- Publication date Aug 22, 2002
- Shinichi Terashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for the production thereof
- Publication number 20020070446
- Publication date Jun 13, 2002
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS