Cobalt [Co] as principal constituent

Industry

CPC
H01L2224/13357

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13357Cobalt [Co] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Conductive connecting member and manufacturing method of same
- Patent number 10,177,079
- Issue date Jan 8, 2019
- Furukawa Electric Co., Ltd.
- Hideo Nishikubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing metal ball, joining material, and metal ball
- Patent number 10,150,185
- Issue date Dec 11, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic intermetallic compound interconnect
- Patent number 9,847,308
- Issue date Dec 19, 2017
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic contacts
- Patent number 9,601,468
- Issue date Mar 21, 2017
- Intel Corporation
- Michael P. Skinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component-mounted structure, IC card and COF package
- Patent number 9,516,749
- Issue date Dec 6, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshiyuki Wada
- G02 - OPTICS
Information Patent Grant
Magnetic contacts
- Patent number 9,343,389
- Issue date May 17, 2016
- Intel Corporation
- Michael P. Skinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic intermetallic compound interconnect
- Patent number 8,939,347
- Issue date Jan 27, 2015
- Intel Corporation
- Rajasekaran Swaminathan
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device, mounting circuit board, method of producing t...
- Patent number 6,909,180
- Issue date Jun 21, 2005
- Matsushita Electric Industrial Co., Ltd.
- Masahiro Ono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for forming contacts on a semiconductor component by alignin...
- Patent number 6,283,358
- Issue date Sep 4, 2001
- Micron Technology, Inc.
- Michael Ball
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for forming contacts on a semiconductor component...
- Patent number 6,186,392
- Issue date Feb 13, 2001
- Micron Technology, Inc.
- Michael Ball
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME
- Publication number 20130001775
- Publication date Jan 3, 2013
- Hideo Nishikubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC INTERMETALLIC COMPOUND INTERCONNECT
- Publication number 20110266030
- Publication date Nov 3, 2011
- Rajasekaran Swaminathan
- B82 - NANO-TECHNOLOGY
Information Patent Application
Circuit substrate for packaging semiconductor device, method for pr...
- Publication number 20050163982
- Publication date Jul 28, 2005
- Masahiro Ono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, mounting circuit board, method of producing t...
- Publication number 20030049425
- Publication date Mar 13, 2003
- Masahiro Ono
- H01 - BASIC ELECTRIC ELEMENTS

Cobalt [Co] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Conductive connecting member and manufacturing method of same

Method for producing metal ball, joining material, and metal ball

Magnetic intermetallic compound interconnect

Magnetic contacts

Electronic component-mounted structure, IC card and COF package

Magnetic contacts

Magnetic intermetallic compound interconnect

Semiconductor device, mounting circuit board, method of producing t...

System for forming contacts on a semiconductor component by alignin...

Method and system for forming contacts on a semiconductor component...

Patents Applicationslast 30 patents

CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME

MAGNETIC INTERMETALLIC COMPOUND INTERCONNECT

Circuit substrate for packaging semiconductor device, method for pr...

Semiconductor device, mounting circuit board, method of producing t...