Cold plates transferring heat from heat source to coolant

Industry

CPC
H05K7/20254

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20254Cold plates transferring heat from heat source to coolant

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Cooling device for cooling components of a circuit board
- Patent number 12,274,024
- Issue date Apr 8, 2025
- Nexalus Limited
- Anthony Robinson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Liquid cooling system with liquid leakage detecting module
- Patent number 12,274,028
- Issue date Apr 8, 2025
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Jiang-Jun Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Engineered actuators usable in MEMs active cooling devices
- Patent number 12,274,035
- Issue date Apr 8, 2025
- Frore Systems Inc.
- Vikram Mukundan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems for cooler devices and cooling manifolds
- Patent number 12,274,026
- Issue date Apr 8, 2025
- TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA INC.
- Sougata Hazra
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling device
- Patent number 12,267,986
- Issue date Apr 1, 2025
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Jiang-Jun Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Rack with trays for plug-in automotive control units
- Patent number 12,262,506
- Issue date Mar 25, 2025
- Aptiv Technologies AG
- Jakub Antoni Korta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus providing liquid temperature data from individual direct...
- Patent number 12,259,280
- Issue date Mar 25, 2025
- ZT GROUP INT'L, INC.
- Sruti Chigullapalli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid cooling system for precise temperature control of radiation...
- Patent number 12,262,463
- Issue date Mar 25, 2025
- Radialis Medical, Inc.
- Oleksandr Bubon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro heat transfer arrays, micro cold plates, and thermal manageme...
- Patent number 12,255,123
- Issue date Mar 18, 2025
- Microfabrica Inc.
- Onnik Yaglioglu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Liquid cooling device
- Patent number 12,250,790
- Issue date Mar 11, 2025
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Jiang-Jun Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 12,243,802
- Issue date Mar 4, 2025
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Water-cooled heat dissipation module assembly
- Patent number 12,238,903
- Issue date Feb 25, 2025
- DONG YANG PISTON CO., LTD.
- Kwan Ho Ryu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Power electronic device assemblies having heat spreaders and electr...
- Patent number 12,238,906
- Issue date Feb 25, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink with adaptive curvature to mitigate thermal runaway for a...
- Patent number 12,238,856
- Issue date Feb 25, 2025
- Cisco Technology, Inc.
- Paul Ton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vehicle power module assembly
- Patent number 12,238,908
- Issue date Feb 25, 2025
- Ford Global Technologies, LLC
- Akash Changarankumarath Pradeepkumar
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Nanosecond pulser ADC system
- Patent number 12,230,477
- Issue date Feb 18, 2025
- Eagle Harbor Technologies, Inc.
- Kenneth Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation module
- Patent number 12,228,146
- Issue date Feb 18, 2025
- AURAS TECHNOLOGY CO., LTD.
- Chih-Wei Chen
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Cooling device
- Patent number 12,232,297
- Issue date Feb 18, 2025
- Nidec Corporation
- Yoshihisa Kitamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for modular radar systems
- Patent number 12,222,438
- Issue date Feb 11, 2025
- Raytheon Company
- Derek P. Rocca
- G01 - MEASURING TESTING
Information Patent Grant
Heat sinks for bare die multi-chip packages
- Patent number 12,222,776
- Issue date Feb 11, 2025
- Amazon Technologies, Inc.
- Ali Elashri
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat exchange assembly for an electrical device
- Patent number 12,225,692
- Issue date Feb 11, 2025
- TE CONNECTIVITY SOLUTIONS GmbH
- Alex Michael Sharf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Advanced sealing structure for liquid cooling
- Patent number 12,216,025
- Issue date Feb 4, 2025
- BAIDU USA LLC
- Tianyi Gao
- G01 - MEASURING TESTING
Information Patent Grant
Method for assembling a liquid cooling assembly of a family of liqu...
- Patent number 12,219,733
- Issue date Feb 4, 2025
- OVH
- Hadrien Bauduin
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Cooling device and method for manufacturing the same
- Patent number 12,219,735
- Issue date Feb 4, 2025
- Mitsui Chemicals, Inc.
- Takahiro Tominaga
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Configurable cold-plates of datacenter cooling systems
- Patent number 12,213,281
- Issue date Jan 28, 2025
- NVIDIA Corporation
- Ali Heydari
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Housing comprising a composite wall integrating at least one coolin...
- Patent number 12,207,442
- Issue date Jan 21, 2025
- SAFRAN ELECTRONICS & DEFENSE
- Muriel Sabah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling module and a method of cooling an electronic circuit module...
- Patent number 12,200,902
- Issue date Jan 14, 2025
- Hewlett Packard Enterprise Development LP
- Harvey J. Lunsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation device
- Patent number 12,200,903
- Issue date Jan 14, 2025
- AURAS TECHNOLOGY CO., LTD.
- Ming-Yuan Chiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation system comprising a plurality of liquid cold plate...
- Patent number 12,197,113
- Issue date Jan 14, 2025
- Coretronic Corporation
- Jing-Wei Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method and extraction system for extracting an electronic device fr...
- Patent number 12,200,901
- Issue date Jan 14, 2025
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
TEMPERATURE ADJUSTMENT DEVICE, SINGLE-PHASE LIQUID COOLING SYSTEM A...
- Publication number 20250120047
- Publication date Apr 10, 2025
- SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD.
- Huanlai ZHU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID-COOLING DEVICE AND ELECTRONIC DEVICE
- Publication number 20250107037
- Publication date Mar 27, 2025
- WISTRON CORP.
- Wen Hua Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINGLE PHASE LIQUID IMMERSION COOLING SYSTEM WITH FORCED COOLING CI...
- Publication number 20250107036
- Publication date Mar 27, 2025
- Fang-Shou LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC DEVICES
- Publication number 20250107046
- Publication date Mar 27, 2025
- Microsoft Technology Licensing, LLC
- Kathryn M. OSEEN-SENDA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONDUCTOR MEMBER WITH COOLING STRUCTURE
- Publication number 20250098107
- Publication date Mar 20, 2025
- YAZAKI CORPORATION
- Junya HIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITIES FOR CENTER-PINNED ACTUATOR COOLING SYSTEMS
- Publication number 20250089219
- Publication date Mar 13, 2025
- Frore Systems Inc.
- Suryaprakash Ganti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING PLATE, BATTERY DISCONNECT UNIT, AND A DRIVE SYSTEM
- Publication number 20250081390
- Publication date Mar 6, 2025
- ROBERT BOSCH GmbH
- Markus Schmitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250081389
- Publication date Mar 6, 2025
- DENSO CORPORATION
- TAKUYA YAMAGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLING PLATE ASSEMBLY AND SERVER
- Publication number 20250081391
- Publication date Mar 6, 2025
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Jingnan ZHAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION STRUCTURE AND VEHICLE CHARGING DEVICE
- Publication number 20250071955
- Publication date Feb 27, 2025
- LITE-ON SINGAPORE PTE. LTD.
- Muhammad Azhar Abdul Gafar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROCHANNEL COOLING BLOCK AND COOLING SYSTEM INCLUDING THE SAME
- Publication number 20250071936
- Publication date Feb 27, 2025
- HRL LABORATORIES, LLC
- John H. Martin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT EXCHANGER WITH CONTACT SEALING AND RELATED SYSTEMS AND METHODS
- Publication number 20250071937
- Publication date Feb 27, 2025
- COOLIT SYSTEMS, INC.
- Bradley Zakaib
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COLD PLATE ARCHITECTURE FOR LIQUID COOLING OF DEVICES
- Publication number 20250071938
- Publication date Feb 27, 2025
- Intel Corporation
- Jin YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID-COOLING HEAT DISSIPATION DEVICE
- Publication number 20250071939
- Publication date Feb 27, 2025
- Chien-Hao CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTIMIZED CHIP COOLING INFRASTRUCTURE
- Publication number 20250063688
- Publication date Feb 20, 2025
- Microsoft Technology Licensing, LLC
- Eric C. PETERSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR SUPPORTING A HIGH THERMAL GRADIENT BETWEEN...
- Publication number 20250063650
- Publication date Feb 20, 2025
- Microsoft Technology Licensing, LLC
- Matthew David TURNER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TELECOMMUNICATIONS AND NETWORKING SHELF AND CIRCUIT CARD ASSEMBLIES
- Publication number 20250063679
- Publication date Feb 20, 2025
- CIENA CORPORATION
- Simon Shearman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ALUMINUM HEAT EXCHANGER
- Publication number 20250051591
- Publication date Feb 13, 2025
- Carrier Corporation
- Mark R. Jaworowski
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLING DEVICE FOR CONVENIENT REPLACEMENT OF PUMP
- Publication number 20250048586
- Publication date Feb 6, 2025
- Cooltek Inc.
- Wei-En SYU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEVER ACTUATED COLD PLATE
- Publication number 20250048595
- Publication date Feb 6, 2025
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Harvey J. Lunsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINK FOR COOLING AN ELECTRICAL AND/OR ELECTRONIC ASSEMBLY
- Publication number 20250048604
- Publication date Feb 6, 2025
- ROBERT BOSCH GmbH
- Tim Liewer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250048588
- Publication date Feb 6, 2025
- DENSO CORPORATION
- Hiroki CHITAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COLD PLATE AND METHOD OF MANUFACTURING COLD PLATE
- Publication number 20250048587
- Publication date Feb 6, 2025
- FURUKAWA ELECTRIC CO., LTD.
- Yuki MACHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR REGULATING CURRENT FLOW THROUGH TWO OR MORE...
- Publication number 20250040109
- Publication date Jan 30, 2025
- The ESAB Group, Inc.
- Wilson Alexander Schreiber
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
LIQUID COOLING HEAT DISSIPATION PLATE AND LIQUID COOLING ELECTRONIC...
- Publication number 20250040079
- Publication date Jan 30, 2025
- SHENZHEN MICROBT ELECTRONICS TECHNOLOGY CO., LTD.
- Qian CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BATTERY DISCONNECT UNIT AND DRIVE SYSTEM
- Publication number 20250040110
- Publication date Jan 30, 2025
- ROBERT BOSCH GmbH
- Roman Marx
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR ALL-IN-ONE COMPACT REFRIGERATION USING A LIQU...
- Publication number 20250040084
- Publication date Jan 30, 2025
- DELL PRODUCTS, L.P.
- Yu-Ming Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE
- Publication number 20250040098
- Publication date Jan 30, 2025
- XFUSION DIGITAL TECHNOLOGIES CO., LTD
- Hui Jia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
System And Method For Hybrid Direct-To-Chip Liquid And Immersion Co...
- Publication number 20250040101
- Publication date Jan 30, 2025
- QUANTA COMPUTER INC.
- Chao-Jung CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Internal Recirculation Cooling Module
- Publication number 20250031342
- Publication date Jan 23, 2025
- Jetcool Technologies Inc.
- Ludwig C. HABER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Cold plates transferring heat from heat source to coolant

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Cooling device for cooling components of a circuit board

Liquid cooling system with liquid leakage detecting module

Engineered actuators usable in MEMs active cooling devices

Systems for cooler devices and cooling manifolds

Cooling device

Rack with trays for plug-in automotive control units

Apparatus providing liquid temperature data from individual direct...

Liquid cooling system for precise temperature control of radiation...

Micro heat transfer arrays, micro cold plates, and thermal manageme...

Liquid cooling device

Methods and heat distribution devices for thermal management of chi...

Water-cooled heat dissipation module assembly

Power electronic device assemblies having heat spreaders and electr...

Heat sink with adaptive curvature to mitigate thermal runaway for a...

Vehicle power module assembly

Nanosecond pulser ADC system

Heat dissipation module

Cooling device

Systems and methods for modular radar systems

Heat sinks for bare die multi-chip packages

Heat exchange assembly for an electrical device

Advanced sealing structure for liquid cooling

Method for assembling a liquid cooling assembly of a family of liqu...

Cooling device and method for manufacturing the same

Configurable cold-plates of datacenter cooling systems

Housing comprising a composite wall integrating at least one coolin...

Cooling module and a method of cooling an electronic circuit module...

Heat dissipation device

Heat dissipation system comprising a plurality of liquid cold plate...

Method and extraction system for extracting an electronic device fr...

Patents Applicationslast 30 patents

TEMPERATURE ADJUSTMENT DEVICE, SINGLE-PHASE LIQUID COOLING SYSTEM A...

LIQUID-COOLING DEVICE AND ELECTRONIC DEVICE

SINGLE PHASE LIQUID IMMERSION COOLING SYSTEM WITH FORCED COOLING CI...

SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC DEVICES

CONDUCTOR MEMBER WITH COOLING STRUCTURE

CAVITIES FOR CENTER-PINNED ACTUATOR COOLING SYSTEMS

COOLING PLATE, BATTERY DISCONNECT UNIT, AND A DRIVE SYSTEM

ELECTRONIC DEVICE

LIQUID COOLING PLATE ASSEMBLY AND SERVER

HEAT DISSIPATION STRUCTURE AND VEHICLE CHARGING DEVICE

MICROCHANNEL COOLING BLOCK AND COOLING SYSTEM INCLUDING THE SAME

HEAT EXCHANGER WITH CONTACT SEALING AND RELATED SYSTEMS AND METHODS

COLD PLATE ARCHITECTURE FOR LIQUID COOLING OF DEVICES

LIQUID-COOLING HEAT DISSIPATION DEVICE

OPTIMIZED CHIP COOLING INFRASTRUCTURE

SYSTEMS AND METHODS FOR SUPPORTING A HIGH THERMAL GRADIENT BETWEEN...

TELECOMMUNICATIONS AND NETWORKING SHELF AND CIRCUIT CARD ASSEMBLIES

ALUMINUM HEAT EXCHANGER

LIQUID COOLING DEVICE FOR CONVENIENT REPLACEMENT OF PUMP

LEVER ACTUATED COLD PLATE

HEAT SINK FOR COOLING AN ELECTRICAL AND/OR ELECTRONIC ASSEMBLY

ELECTRONIC DEVICE

COLD PLATE AND METHOD OF MANUFACTURING COLD PLATE

SYSTEMS AND METHODS FOR REGULATING CURRENT FLOW THROUGH TWO OR MORE...

LIQUID COOLING HEAT DISSIPATION PLATE AND LIQUID COOLING ELECTRONIC...

BATTERY DISCONNECT UNIT AND DRIVE SYSTEM

SYSTEM AND METHOD FOR ALL-IN-ONE COMPACT REFRIGERATION USING A LIQU...

HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE

System And Method For Hybrid Direct-To-Chip Liquid And Immersion Co...

Internal Recirculation Cooling Module