Cold plates transferring heat from heat source to coolant

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H05K7/20254

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20254Cold plates transferring heat from heat source to coolant

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Cooling apparatus with offset flow paths
- Patent number 12,369,277
- Issue date Jul 22, 2025
- Motivair Corporation
- Rich S Whitmore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Immersed liquid cooling heat dissipation system
- Patent number 12,363,856
- Issue date Jul 15, 2025
- CANAAN CREATIVE CO., LTD.
- Yanbin Zhu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid-cooling devices, and systems, to cool multi-chip modules
- Patent number 12,363,857
- Issue date Jul 15, 2025
- Coolit Systems, Inc.
- Bradley Zakaib
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Turbomachine with e-machine controller having cooled bus bar member
- Patent number 12,352,203
- Issue date Jul 8, 2025
- Garrett Transportation I Inc.
- Valeriy Fedorikhin
- F02 - COMBUSTION ENGINES HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
Information Patent Grant
System, electromagnetic actuator and track for braking
- Patent number 12,355,325
- Issue date Jul 8, 2025
- HYPERLOOP TECHNOLOGIES, INC.
- Yingjie Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon based microchannel fluid and thermoelectric cooler for elec...
- Patent number 12,354,925
- Issue date Jul 8, 2025
- BAIDU USA LLC
- Tianyi Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal pluggable datacenter cooling system
- Patent number 12,356,584
- Issue date Jul 8, 2025
- NVIDIA Corporation
- Ali Heydari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling module for providing enhanced localized cooling of a heatsink
- Patent number 12,356,585
- Issue date Jul 8, 2025
- Abaco Systems, Inc.
- Joo Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiator and graphics processing unit serviceability component
- Patent number 12,349,312
- Issue date Jul 1, 2025
- Dell Products L.P.
- Shih Hsuan Hu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Compact control module for a vehicle with at least one electric mot...
- Patent number 12,342,478
- Issue date Jun 24, 2025
- Vitesco Technologies Germany GmbH
- Alexander Wenk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modular cold plate for electronic control module
- Patent number 12,342,497
- Issue date Jun 24, 2025
- Ford Global Technologies, LLC
- Paul Karayacoubian
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power electrical apparatus comprising two power electronic modules...
- Patent number 12,342,512
- Issue date Jun 24, 2025
- Valeo eAutomotive France SAS
- Aurélien Pouilly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component cooler for a computing device
- Patent number 12,336,147
- Issue date Jun 17, 2025
- Advanced Micro Devices, Inc.
- Christopher M. Helberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Variable flow liquid-cooled cooling module
- Patent number 12,336,138
- Issue date Jun 17, 2025
- Hewlett Packard Enterprise Development LP
- Harvey J. Lunsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cold plate cavity designs for improved thermal performance
- Patent number 12,336,141
- Issue date Jun 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Ron Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid heat spreading and heating of a computing system in an auton...
- Patent number 12,328,843
- Issue date Jun 10, 2025
- GM CRUISE HOLDINGS LLC
- Zoran Stefanoski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Data center cooling system and data center
- Patent number 12,328,850
- Issue date Jun 10, 2025
- BEIJING BYTEDANCE NETWORK TECHNOLOGY CO., LTD.
- Tangbo Jing
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Actively cooled heat-dissipation lids for computer processors and p...
- Patent number 12,324,126
- Issue date Jun 3, 2025
- Jetcool Technologies Inc.
- Bernard Malouin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component cooler with spring mechanism
- Patent number 12,324,130
- Issue date Jun 3, 2025
- Advanced Micro Devices, Inc.
- Robert Edward Radke
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Varying topology heat sinks
- Patent number 12,313,350
- Issue date May 27, 2025
- Hamilton Sundstrand Corporation
- Ram Ranjan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Liquid cooling plate and server
- Patent number 12,317,448
- Issue date May 27, 2025
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Jiang-jun Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipating structure
- Patent number 12,317,452
- Issue date May 27, 2025
- Lenovo (Beijing) Limited
- Xintong Ding
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems for a heat exchanger with a biasing bracket and mounting plate
- Patent number 12,317,457
- Issue date May 27, 2025
- Dana Canada Corporation
- Andrei Catuneanu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Structure for detection and collection of leaked coolant
- Patent number 12,317,449
- Issue date May 27, 2025
- Quanta Computer Inc.
- Yi-Chieh Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Offset network card computing blade
- Patent number 12,309,958
- Issue date May 20, 2025
- Bull S.A.S.
- Sébastien Magnoux
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Receptacle with connectable spring finger for multipoint contact co...
- Patent number 12,309,969
- Issue date May 20, 2025
- Hewlett Packard Enterprise Development LP
- Harvey J. Lunsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally conductive chamber with stiffening structure for thermal...
- Patent number 12,309,966
- Issue date May 20, 2025
- Intel Corporation
- Jin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including accommodation cavity and flow channel i...
- Patent number 12,309,967
- Issue date May 20, 2025
- Lenovo (Beijing) Limited
- Na Lei
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power conversion device
- Patent number 12,309,982
- Issue date May 20, 2025
- Mitsubishi Electric Corporation
- Shingo Kitagawa
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Liquid cooling device mounted on a heat generating electronic compo...
- Patent number 12,309,965
- Issue date May 20, 2025
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
LIQUID COLLECTING DEVICE
- Publication number 20250240919
- Publication date Jul 24, 2025
- SHENZHEN ENVICOOL TECHNOLOGY CO., LTD
- Xiaoxin XU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID LEAKAGE PROTECTION DEVICE
- Publication number 20250240918
- Publication date Jul 24, 2025
- SHENZHEN ENVICOOL TECHNOLOGY CO., LTD
- Xiaoxin XU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SERVER
- Publication number 20250240916
- Publication date Jul 24, 2025
- SHENZHEN ENVICOOL TECHNOLOGY CO., LTD
- Xiaoxin XU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SERVER COOLING SYSTEM
- Publication number 20250240932
- Publication date Jul 24, 2025
- Bitmain Technologies Inc.
- Hangkong HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE-DIMENSIONAL GAS-LIQUID DUAL PHASE HEAT DISSIPATION DEVICE
- Publication number 20250234482
- Publication date Jul 17, 2025
- AURAS Technology Co., Ltd.
- Chie-Sheng LIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Liquid cooling high-density pluggable modules for a network element
- Publication number 20250227887
- Publication date Jul 10, 2025
- CIENA CORPORATION
- Behzad Mohajer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BLOCKING DEVICE AND BLOCKING METHOD THEREOF
- Publication number 20250227886
- Publication date Jul 10, 2025
- FIVEGRAND INTERNATIONAL CO., LTD.
- TING-JUI WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLING PLATE AND MOTOR CONTROLLER
- Publication number 20250227898
- Publication date Jul 10, 2025
- Jing-Jin Electric Technologies Co., Ltd.
- Ding DING
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CPU COOLER CONTACT FRAME AND METHOD FOR INSTALLING A COOLER ONTO A...
- Publication number 20250224783
- Publication date Jul 10, 2025
- ARCTIC (HK) Ltd
- Magnus Huber
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WATER-COOLING PLATE
- Publication number 20250227877
- Publication date Jul 10, 2025
- Delta Electronics, Inc.
- Kuan-Cheng LU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING DEVICE
- Publication number 20250220850
- Publication date Jul 3, 2025
- Mitsubishi Heavy Industries, Ltd.
- Tsutomu KAWAMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HOT-SWAPPABLE LIQUID-COOLED SOLID STATE DRIVE
- Publication number 20250212361
- Publication date Jun 26, 2025
- Microsoft Technology Licensing, LLC
- Kathryn OSEEN-SENDA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COOLING ARRANGEMENT WITH A HEAT SINK FOR AT LEAST ONE MICROCHIP
- Publication number 20250212362
- Publication date Jun 26, 2025
- RITTAL GMBH & CO. KG
- Juan Carlos CACHO ALONSO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CAPACITOR MODULE, POWER CONVERSION DEVICE, AND MOTOR ASSEMBLY INCLU...
- Publication number 20250210254
- Publication date Jun 26, 2025
- Hyundai Motor Company
- Hyong Joon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLD PLATE REMOVAL DEVICE
- Publication number 20250196303
- Publication date Jun 19, 2025
- Dell Products L.P.
- Tung Yu Chien
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
ENGINEERED ACTUATORS USABLE IN MEMS ACTIVE COOLING DEVICES
- Publication number 20250203820
- Publication date Jun 19, 2025
- Frore Systems Inc.
- Vikram Mukundan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DATA CENTER RACK SYSTEM WITH INTEGRATED LIQUID AND DIELECTRIC IMMER...
- Publication number 20250194044
- Publication date Jun 12, 2025
- OVH
- Ali CHEHADE
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Housing Assembly of Capacitor and Electric Drive Assembly
- Publication number 20250194046
- Publication date Jun 12, 2025
- Jing-Jin Electric Technologies Co., Ltd.
- Xiaokai TIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONSTANT-TEMPERATURE HEATING DEVICE AND FLUID HEATING ELECTRIC APPL...
- Publication number 20250180202
- Publication date Jun 5, 2025
- Millplan Electric Appliance (Shen Zhen) Co., Limited
- Ngan Chi CHAN
- D06 - TREATMENT OF TEXTILES OR THE LIKE LAUNDERING FLEXIBLE MATERIALS NOT OTH...
Information Patent Application
COOLING STRUCTURE AND STRUCTURE
- Publication number 20250185206
- Publication date Jun 5, 2025
- Resonac Corporation
- Yuji FUKUKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TWO-STAGE COOLING OF HEAT GENERATING COMPONENTS
- Publication number 20250176131
- Publication date May 29, 2025
- ICEOTOPE GROUP LIMITED
- Oliver HEYES
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING DEVICE
- Publication number 20250176132
- Publication date May 29, 2025
- NIDEC CORPORATION
- Koji HATANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT OF HIGH CAPACITY OPTICS IN DENSE ARRANGEMENTS
- Publication number 20250176145
- Publication date May 29, 2025
- Cisco Technology, Inc.
- M. Baris Dogruoz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
APPARATUS AND SYSTEM FOR COOLING ELECTRONIC DEVICES
- Publication number 20250169030
- Publication date May 22, 2025
- ICEOTOPE GROUP LIMITED
- Neil EDMUNDS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL MODULE COOLING APPARATUS, OPTICAL MODULE SYSTEM, AND OPTICA...
- Publication number 20250169032
- Publication date May 22, 2025
- Suzhou MetaBrain Intelligent Technology Co., Ltd
- Tao WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT EXCHANGER FOR HIGH PERFORMANCE HEAT CHIP SETS
- Publication number 20250169031
- Publication date May 22, 2025
- MIKROS TECHNOLOGIES LLC
- Drew M. Matter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR A HYBRID COOLING SYSTEM
- Publication number 20250169044
- Publication date May 22, 2025
- Microsoft Technology Licensing, LLC
- Brandon Earl GARY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFRIGERANT CIRCULATION DEVICE, COOLING DEVICE, AND PUMP UNIT
- Publication number 20250169036
- Publication date May 22, 2025
- NIDEC CORPORATION
- Toshihiko TOKESHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DETECTING MECHANISM
- Publication number 20250169037
- Publication date May 22, 2025
- SHENZHEN ENVICOOL TECHNOLOGY CO., LTD
- Chengsheng SONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NEGATIVE PRESSURE COOLING DISTRIBUTION UNIT HEAT DISSIPATION SYSTEM
- Publication number 20250169040
- Publication date May 22, 2025
- NEW H3C TECHNOLOGIES CO., LTD.
- Kuiyang WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Cold plates transferring heat from heat source to coolant

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Cooling apparatus with offset flow paths

Immersed liquid cooling heat dissipation system

Liquid-cooling devices, and systems, to cool multi-chip modules

Turbomachine with e-machine controller having cooled bus bar member

System, electromagnetic actuator and track for braking

Silicon based microchannel fluid and thermoelectric cooler for elec...

Universal pluggable datacenter cooling system

Cooling module for providing enhanced localized cooling of a heatsink

Radiator and graphics processing unit serviceability component

Compact control module for a vehicle with at least one electric mot...

Modular cold plate for electronic control module

Power electrical apparatus comprising two power electronic modules...

Component cooler for a computing device

Variable flow liquid-cooled cooling module

Cold plate cavity designs for improved thermal performance

Hybrid heat spreading and heating of a computing system in an auton...

Data center cooling system and data center

Actively cooled heat-dissipation lids for computer processors and p...

Component cooler with spring mechanism

Varying topology heat sinks

Liquid cooling plate and server

Heat dissipating structure

Systems for a heat exchanger with a biasing bracket and mounting plate

Structure for detection and collection of leaked coolant

Offset network card computing blade

Receptacle with connectable spring finger for multipoint contact co...

Thermally conductive chamber with stiffening structure for thermal...

Electronic device including accommodation cavity and flow channel i...

Power conversion device

Liquid cooling device mounted on a heat generating electronic compo...

Patents Applicationslast 30 patents

LIQUID COLLECTING DEVICE

LIQUID LEAKAGE PROTECTION DEVICE

SERVER

SERVER COOLING SYSTEM

THREE-DIMENSIONAL GAS-LIQUID DUAL PHASE HEAT DISSIPATION DEVICE

Liquid cooling high-density pluggable modules for a network element

BLOCKING DEVICE AND BLOCKING METHOD THEREOF

LIQUID COOLING PLATE AND MOTOR CONTROLLER

CPU COOLER CONTACT FRAME AND METHOD FOR INSTALLING A COOLER ONTO A...

WATER-COOLING PLATE

COOLING DEVICE

HOT-SWAPPABLE LIQUID-COOLED SOLID STATE DRIVE

COOLING ARRANGEMENT WITH A HEAT SINK FOR AT LEAST ONE MICROCHIP

CAPACITOR MODULE, POWER CONVERSION DEVICE, AND MOTOR ASSEMBLY INCLU...

COLD PLATE REMOVAL DEVICE

ENGINEERED ACTUATORS USABLE IN MEMS ACTIVE COOLING DEVICES

DATA CENTER RACK SYSTEM WITH INTEGRATED LIQUID AND DIELECTRIC IMMER...

Housing Assembly of Capacitor and Electric Drive Assembly

CONSTANT-TEMPERATURE HEATING DEVICE AND FLUID HEATING ELECTRIC APPL...

COOLING STRUCTURE AND STRUCTURE

TWO-STAGE COOLING OF HEAT GENERATING COMPONENTS

COOLING DEVICE

THERMAL MANAGEMENT OF HIGH CAPACITY OPTICS IN DENSE ARRANGEMENTS

APPARATUS AND SYSTEM FOR COOLING ELECTRONIC DEVICES

OPTICAL MODULE COOLING APPARATUS, OPTICAL MODULE SYSTEM, AND OPTICA...

HEAT EXCHANGER FOR HIGH PERFORMANCE HEAT CHIP SETS

DEVICES, SYSTEMS, AND METHODS FOR A HYBRID COOLING SYSTEM

REFRIGERANT CIRCULATION DEVICE, COOLING DEVICE, AND PUMP UNIT

DETECTING MECHANISM

NEGATIVE PRESSURE COOLING DISTRIBUTION UNIT HEAT DISSIPATION SYSTEM