Cold plates transferring heat from heat source to coolant

Industry

CPC
H05K7/20254

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20254Cold plates transferring heat from heat source to coolant

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Hybrid heat spreading and heating of a computing system in an auton...
- Patent number 12,328,843
- Issue date Jun 10, 2025
- GM CRUISE HOLDINGS LLC
- Zoran Stefanoski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Data center cooling system and data center
- Patent number 12,328,850
- Issue date Jun 10, 2025
- BEIJING BYTEDANCE NETWORK TECHNOLOGY CO., LTD.
- Tangbo Jing
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Actively cooled heat-dissipation lids for computer processors and p...
- Patent number 12,324,126
- Issue date Jun 3, 2025
- Jetcool Technologies Inc.
- Bernard Malouin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component cooler with spring mechanism
- Patent number 12,324,130
- Issue date Jun 3, 2025
- Advanced Micro Devices, Inc.
- Robert Edward Radke
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Varying topology heat sinks
- Patent number 12,313,350
- Issue date May 27, 2025
- Hamilton Sundstrand Corporation
- Ram Ranjan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Liquid cooling plate and server
- Patent number 12,317,448
- Issue date May 27, 2025
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Jiang-jun Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipating structure
- Patent number 12,317,452
- Issue date May 27, 2025
- Lenovo (Beijing) Limited
- Xintong Ding
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems for a heat exchanger with a biasing bracket and mounting plate
- Patent number 12,317,457
- Issue date May 27, 2025
- Dana Canada Corporation
- Andrei Catuneanu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Structure for detection and collection of leaked coolant
- Patent number 12,317,449
- Issue date May 27, 2025
- Quanta Computer Inc.
- Yi-Chieh Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Offset network card computing blade
- Patent number 12,309,958
- Issue date May 20, 2025
- Bull S.A.S.
- Sébastien Magnoux
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Receptacle with connectable spring finger for multipoint contact co...
- Patent number 12,309,969
- Issue date May 20, 2025
- Hewlett Packard Enterprise Development LP
- Harvey J. Lunsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally conductive chamber with stiffening structure for thermal...
- Patent number 12,309,966
- Issue date May 20, 2025
- Intel Corporation
- Jin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including accommodation cavity and flow channel i...
- Patent number 12,309,967
- Issue date May 20, 2025
- Lenovo (Beijing) Limited
- Na Lei
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power conversion device
- Patent number 12,309,982
- Issue date May 20, 2025
- Mitsubishi Electric Corporation
- Shingo Kitagawa
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Liquid cooling device mounted on a heat generating electronic compo...
- Patent number 12,309,965
- Issue date May 20, 2025
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cold plate module
- Patent number 12,309,968
- Issue date May 20, 2025
- Accton Technology Corporation
- Yu Ting Tseng
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Extruded heat pipe
- Patent number 12,303,957
- Issue date May 20, 2025
- Intel Corporation
- Christopher Michael Moore
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Capacitor module, power conversion device, and motor assembly inclu...
- Patent number 12,300,435
- Issue date May 13, 2025
- Hyundai Motor Company
- Hyong Joon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid cooling plate assembly and server
- Patent number 12,295,123
- Issue date May 6, 2025
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Jiang-jun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid-in-liquid cooling system for electronic components
- Patent number 12,289,861
- Issue date Apr 29, 2025
- Jetcool Technologies Inc.
- Bernard Malouin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Disinfecting device
- Patent number 12,280,165
- Issue date Apr 22, 2025
- JC Technologies LLC
- John Edgar Curry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power electronics assemblies having power electronics devices embed...
- Patent number 12,284,792
- Issue date Apr 22, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cold plate
- Patent number 12,279,397
- Issue date Apr 15, 2025
- AURAS TECHNOLOGY CO., LTD.
- Yi-Wun Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 12,278,160
- Issue date Apr 15, 2025
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid cooled server chassis
- Patent number 12,279,400
- Issue date Apr 15, 2025
- Cooler Master Co., Ltd.
- Shui-Fa Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management of high capacity optics in dense arrangements
- Patent number 12,279,399
- Issue date Apr 15, 2025
- Cisco Technology, Inc.
- M. Baris Dogruoz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling device for cooling components of a circuit board
- Patent number 12,274,024
- Issue date Apr 8, 2025
- Nexalus Limited
- Anthony Robinson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Liquid cooling system with liquid leakage detecting module
- Patent number 12,274,028
- Issue date Apr 8, 2025
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Jiang-Jun Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Engineered actuators usable in MEMs active cooling devices
- Patent number 12,274,035
- Issue date Apr 8, 2025
- Frore Systems Inc.
- Vikram Mukundan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems for cooler devices and cooling manifolds
- Patent number 12,274,026
- Issue date Apr 8, 2025
- TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA INC.
- Sougata Hazra
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
CONSTANT-TEMPERATURE HEATING DEVICE AND FLUID HEATING ELECTRIC APPL...
- Publication number 20250180202
- Publication date Jun 5, 2025
- Millplan Electric Appliance (Shen Zhen) Co., Limited
- Ngan Chi CHAN
- D06 - TREATMENT OF TEXTILES OR THE LIKE LAUNDERING FLEXIBLE MATERIALS NOT OTH...
Information Patent Application
COOLING STRUCTURE AND STRUCTURE
- Publication number 20250185206
- Publication date Jun 5, 2025
- Resonac Corporation
- Yuji FUKUKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TWO-STAGE COOLING OF HEAT GENERATING COMPONENTS
- Publication number 20250176131
- Publication date May 29, 2025
- ICEOTOPE GROUP LIMITED
- Oliver HEYES
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING DEVICE
- Publication number 20250176132
- Publication date May 29, 2025
- NIDEC CORPORATION
- Koji HATANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT OF HIGH CAPACITY OPTICS IN DENSE ARRANGEMENTS
- Publication number 20250176145
- Publication date May 29, 2025
- Cisco Technology, Inc.
- M. Baris Dogruoz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
APPARATUS AND SYSTEM FOR COOLING ELECTRONIC DEVICES
- Publication number 20250169030
- Publication date May 22, 2025
- ICEOTOPE GROUP LIMITED
- Neil EDMUNDS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL MODULE COOLING APPARATUS, OPTICAL MODULE SYSTEM, AND OPTICA...
- Publication number 20250169032
- Publication date May 22, 2025
- Suzhou MetaBrain Intelligent Technology Co., Ltd
- Tao WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT EXCHANGER FOR HIGH PERFORMANCE HEAT CHIP SETS
- Publication number 20250169031
- Publication date May 22, 2025
- MIKROS TECHNOLOGIES LLC
- Drew M. Matter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR A HYBRID COOLING SYSTEM
- Publication number 20250169044
- Publication date May 22, 2025
- Microsoft Technology Licensing, LLC
- Brandon Earl GARY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFRIGERANT CIRCULATION DEVICE, COOLING DEVICE, AND PUMP UNIT
- Publication number 20250169036
- Publication date May 22, 2025
- NIDEC CORPORATION
- Toshihiko TOKESHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DETECTING MECHANISM
- Publication number 20250169037
- Publication date May 22, 2025
- SHENZHEN ENVICOOL TECHNOLOGY CO., LTD
- Chengsheng SONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NEGATIVE PRESSURE COOLING DISTRIBUTION UNIT HEAT DISSIPATION SYSTEM
- Publication number 20250169040
- Publication date May 22, 2025
- NEW H3C TECHNOLOGIES CO., LTD.
- Kuiyang WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID LIQUID COOLING SYSTEM FOR ELECTRONICS
- Publication number 20250151228
- Publication date May 8, 2025
- Apollo Autonomous Driving USA LLC
- Peng Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULAR FLUID HEAT EXCHANGE SYSTEMS
- Publication number 20250137736
- Publication date May 1, 2025
- COOLIT SYSTEMS, INC.
- Seyed Kamaleddin Mostafavi Yazdi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
THERMAL PAD SERVICE KIT
- Publication number 20250142770
- Publication date May 1, 2025
- Dell Products L.P.
- Shih-Hsuan Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING STRUCTURE FOR ELECTRONIC COMPONENT AND VEHICLE DRIVING DEVICE
- Publication number 20250142791
- Publication date May 1, 2025
- AISIN CORPORATION
- Keisuke TAKEMOTO
- B60 - VEHICLES IN GENERAL
Information Patent Application
HEAT SINKS FOR BARE DIE MULTI-CHIP PACKAGES
- Publication number 20250138602
- Publication date May 1, 2025
- AMAZON TECHNOLOGIES, INC.
- Ali Elashri
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COOLING PLATE AND COOLING SYSTEM
- Publication number 20250142771
- Publication date May 1, 2025
- NIO Technology (Anhui) Co., Ltd.
- Bradley J. Angier
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTRICAL CONNECTOR SYSTEM AND ELECTRIC VEHICLE
- Publication number 20250128618
- Publication date Apr 24, 2025
- TE CONNECTIVITY INDIA PRIVATE LIMITED
- Akshay Sanjay PATIL
- B60 - VEHICLES IN GENERAL
Information Patent Application
LOCKING MECHANISM FOR LIQUID COOLED PLUGGABLE MODULES
- Publication number 20250133676
- Publication date Apr 24, 2025
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Kasey Renee Lench
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROCHANNEL HEAT SINK DEVICE
- Publication number 20250133693
- Publication date Apr 24, 2025
- Advanced Liquid Cooling Technologies Inc.
- Nan Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Liquid cooling system automated additive control
- Publication number 20250130000
- Publication date Apr 24, 2025
- CHILLDYNE, INC.
- Steven Merrill Harrington
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
DUAL FLOW LOW PROFILE COOLANT DISTRIBUTION MANIFOLD
- Publication number 20250133691
- Publication date Apr 24, 2025
- CIENA CORPORATION
- Simon J. Shearman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORTHOGONAL COLD PLATE FOR USE IN ACTIVE LIQUID IMMERSION COOLING
- Publication number 20250133692
- Publication date Apr 24, 2025
- Intel Corporation
- Christian Amoah-Kusi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METALLIC THERMAL INTERFACE MATERIALS AND ASSOCIATED DEVICES, SYSTEM...
- Publication number 20250126746
- Publication date Apr 17, 2025
- Deeia Inc.
- Himanshu Pokharna
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LIQUID-COOLED SMALL FORM FACTOR PLUGGABLE OPTICAL MODULE
- Publication number 20250123454
- Publication date Apr 17, 2025
- CIENA CORPORATION
- Behzad Mohajer
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COLD PLATE WITH STREAMLINED COOLANT TUBES
- Publication number 20250126745
- Publication date Apr 17, 2025
- QUANTA COMPUTER INC.
- Chao-Jung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEMPERATURE ADJUSTMENT DEVICE, SINGLE-PHASE LIQUID COOLING SYSTEM A...
- Publication number 20250120047
- Publication date Apr 10, 2025
- SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD.
- Huanlai ZHU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID-COOLING DEVICE AND ELECTRONIC DEVICE
- Publication number 20250107037
- Publication date Mar 27, 2025
- WISTRON CORP.
- Wen Hua Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINGLE PHASE LIQUID IMMERSION COOLING SYSTEM WITH FORCED COOLING CI...
- Publication number 20250107036
- Publication date Mar 27, 2025
- Fang-Shou LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Cold plates transferring heat from heat source to coolant

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hybrid heat spreading and heating of a computing system in an auton...

Data center cooling system and data center

Actively cooled heat-dissipation lids for computer processors and p...

Component cooler with spring mechanism

Varying topology heat sinks

Liquid cooling plate and server

Heat dissipating structure

Systems for a heat exchanger with a biasing bracket and mounting plate

Structure for detection and collection of leaked coolant

Offset network card computing blade

Receptacle with connectable spring finger for multipoint contact co...

Thermally conductive chamber with stiffening structure for thermal...

Electronic device including accommodation cavity and flow channel i...

Power conversion device

Liquid cooling device mounted on a heat generating electronic compo...

Cold plate module

Extruded heat pipe

Capacitor module, power conversion device, and motor assembly inclu...

Liquid cooling plate assembly and server

Liquid-in-liquid cooling system for electronic components

Disinfecting device

Power electronics assemblies having power electronics devices embed...

Cold plate

Methods and heat distribution devices for thermal management of chi...

Liquid cooled server chassis

Thermal management of high capacity optics in dense arrangements

Cooling device for cooling components of a circuit board

Liquid cooling system with liquid leakage detecting module

Engineered actuators usable in MEMs active cooling devices

Systems for cooler devices and cooling manifolds

Patents Applicationslast 30 patents

CONSTANT-TEMPERATURE HEATING DEVICE AND FLUID HEATING ELECTRIC APPL...

COOLING STRUCTURE AND STRUCTURE

TWO-STAGE COOLING OF HEAT GENERATING COMPONENTS

COOLING DEVICE

THERMAL MANAGEMENT OF HIGH CAPACITY OPTICS IN DENSE ARRANGEMENTS

APPARATUS AND SYSTEM FOR COOLING ELECTRONIC DEVICES

OPTICAL MODULE COOLING APPARATUS, OPTICAL MODULE SYSTEM, AND OPTICA...

HEAT EXCHANGER FOR HIGH PERFORMANCE HEAT CHIP SETS

DEVICES, SYSTEMS, AND METHODS FOR A HYBRID COOLING SYSTEM

REFRIGERANT CIRCULATION DEVICE, COOLING DEVICE, AND PUMP UNIT

DETECTING MECHANISM

NEGATIVE PRESSURE COOLING DISTRIBUTION UNIT HEAT DISSIPATION SYSTEM

HYBRID LIQUID COOLING SYSTEM FOR ELECTRONICS

MODULAR FLUID HEAT EXCHANGE SYSTEMS

THERMAL PAD SERVICE KIT

COOLING STRUCTURE FOR ELECTRONIC COMPONENT AND VEHICLE DRIVING DEVICE

HEAT SINKS FOR BARE DIE MULTI-CHIP PACKAGES

COOLING PLATE AND COOLING SYSTEM

ELECTRICAL CONNECTOR SYSTEM AND ELECTRIC VEHICLE

LOCKING MECHANISM FOR LIQUID COOLED PLUGGABLE MODULES

MICROCHANNEL HEAT SINK DEVICE

Liquid cooling system automated additive control

DUAL FLOW LOW PROFILE COOLANT DISTRIBUTION MANIFOLD

ORTHOGONAL COLD PLATE FOR USE IN ACTIVE LIQUID IMMERSION COOLING

METALLIC THERMAL INTERFACE MATERIALS AND ASSOCIATED DEVICES, SYSTEM...

LIQUID-COOLED SMALL FORM FACTOR PLUGGABLE OPTICAL MODULE

COLD PLATE WITH STREAMLINED COOLANT TUBES

TEMPERATURE ADJUSTMENT DEVICE, SINGLE-PHASE LIQUID COOLING SYSTEM A...

LIQUID-COOLING DEVICE AND ELECTRONIC DEVICE

SINGLE PHASE LIQUID IMMERSION COOLING SYSTEM WITH FORCED COOLING CI...