Cold plates transferring heat from heat source to coolant

Industry

CPC
H05K7/20254

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20254Cold plates transferring heat from heat source to coolant

Industries

Patents Grantslast 30 patents

Information Patent Grant
Liquid-in-liquid cooling system for electronic components
- Patent number 12,289,861
- Issue date Apr 29, 2025
- Jetcool Technologies Inc.
- Bernard Malouin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Disinfecting device
- Patent number 12,280,165
- Issue date Apr 22, 2025
- JC Technologies LLC
- John Edgar Curry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power electronics assemblies having power electronics devices embed...
- Patent number 12,284,792
- Issue date Apr 22, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 12,278,160
- Issue date Apr 15, 2025
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cold plate
- Patent number 12,279,397
- Issue date Apr 15, 2025
- AURAS TECHNOLOGY CO., LTD.
- Yi-Wun Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid cooled server chassis
- Patent number 12,279,400
- Issue date Apr 15, 2025
- Cooler Master Co., Ltd.
- Shui-Fa Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management of high capacity optics in dense arrangements
- Patent number 12,279,399
- Issue date Apr 15, 2025
- Cisco Technology, Inc.
- M. Baris Dogruoz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling device for cooling components of a circuit board
- Patent number 12,274,024
- Issue date Apr 8, 2025
- Nexalus Limited
- Anthony Robinson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Liquid cooling system with liquid leakage detecting module
- Patent number 12,274,028
- Issue date Apr 8, 2025
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Jiang-Jun Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Engineered actuators usable in MEMs active cooling devices
- Patent number 12,274,035
- Issue date Apr 8, 2025
- Frore Systems Inc.
- Vikram Mukundan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems for cooler devices and cooling manifolds
- Patent number 12,274,026
- Issue date Apr 8, 2025
- TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA INC.
- Sougata Hazra
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling device
- Patent number 12,267,986
- Issue date Apr 1, 2025
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Jiang-Jun Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Rack with trays for plug-in automotive control units
- Patent number 12,262,506
- Issue date Mar 25, 2025
- Aptiv Technologies AG
- Jakub Antoni Korta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus providing liquid temperature data from individual direct...
- Patent number 12,259,280
- Issue date Mar 25, 2025
- ZT GROUP INT'L, INC.
- Sruti Chigullapalli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid cooling system for precise temperature control of radiation...
- Patent number 12,262,463
- Issue date Mar 25, 2025
- Radialis Medical, Inc.
- Oleksandr Bubon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro heat transfer arrays, micro cold plates, and thermal manageme...
- Patent number 12,255,123
- Issue date Mar 18, 2025
- Microfabrica Inc.
- Onnik Yaglioglu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Liquid cooling device
- Patent number 12,250,790
- Issue date Mar 11, 2025
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Jiang-Jun Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 12,243,802
- Issue date Mar 4, 2025
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Water-cooled heat dissipation module assembly
- Patent number 12,238,903
- Issue date Feb 25, 2025
- DONG YANG PISTON CO., LTD.
- Kwan Ho Ryu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Power electronic device assemblies having heat spreaders and electr...
- Patent number 12,238,906
- Issue date Feb 25, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink with adaptive curvature to mitigate thermal runaway for a...
- Patent number 12,238,856
- Issue date Feb 25, 2025
- Cisco Technology, Inc.
- Paul Ton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vehicle power module assembly
- Patent number 12,238,908
- Issue date Feb 25, 2025
- Ford Global Technologies, LLC
- Akash Changarankumarath Pradeepkumar
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Nanosecond pulser ADC system
- Patent number 12,230,477
- Issue date Feb 18, 2025
- Eagle Harbor Technologies, Inc.
- Kenneth Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation module
- Patent number 12,228,146
- Issue date Feb 18, 2025
- AURAS TECHNOLOGY CO., LTD.
- Chih-Wei Chen
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Cooling device
- Patent number 12,232,297
- Issue date Feb 18, 2025
- Nidec Corporation
- Yoshihisa Kitamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for modular radar systems
- Patent number 12,222,438
- Issue date Feb 11, 2025
- Raytheon Company
- Derek P. Rocca
- G01 - MEASURING TESTING
Information Patent Grant
Heat sinks for bare die multi-chip packages
- Patent number 12,222,776
- Issue date Feb 11, 2025
- Amazon Technologies, Inc.
- Ali Elashri
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat exchange assembly for an electrical device
- Patent number 12,225,692
- Issue date Feb 11, 2025
- TE CONNECTIVITY SOLUTIONS GmbH
- Alex Michael Sharf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for assembling a liquid cooling assembly of a family of liqu...
- Patent number 12,219,733
- Issue date Feb 4, 2025
- OVH
- Hadrien Bauduin
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Advanced sealing structure for liquid cooling
- Patent number 12,216,025
- Issue date Feb 4, 2025
- BAIDU USA LLC
- Tianyi Gao
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
MODULAR FLUID HEAT EXCHANGE SYSTEMS
- Publication number 20250137736
- Publication date May 1, 2025
- COOLIT SYSTEMS, INC.
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
THERMAL PAD SERVICE KIT
- Publication number 20250142770
- Publication date May 1, 2025
- Dell Products L.P.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINKS FOR BARE DIE MULTI-CHIP PACKAGES
- Publication number 20250138602
- Publication date May 1, 2025
- AMAZON TECHNOLOGIES, INC.
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COOLING STRUCTURE FOR ELECTRONIC COMPONENT AND VEHICLE DRIVING DEVICE
- Publication number 20250142791
- Publication date May 1, 2025
- AISIN CORPORATION
- B60 - VEHICLES IN GENERAL
Information Patent Application
COOLING PLATE AND COOLING SYSTEM
- Publication number 20250142771
- Publication date May 1, 2025
- NIO Technology (Anhui) Co., Ltd.
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTRICAL CONNECTOR SYSTEM AND ELECTRIC VEHICLE
- Publication number 20250128618
- Publication date Apr 24, 2025
- TE CONNECTIVITY INDIA PRIVATE LIMITED
- Akshay Sanjay PATIL
- B60 - VEHICLES IN GENERAL
Information Patent Application
LOCKING MECHANISM FOR LIQUID COOLED PLUGGABLE MODULES
- Publication number 20250133676
- Publication date Apr 24, 2025
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Kasey Renee Lench
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROCHANNEL HEAT SINK DEVICE
- Publication number 20250133693
- Publication date Apr 24, 2025
- Advanced Liquid Cooling Technologies Inc.
- Nan Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Liquid cooling system automated additive control
- Publication number 20250130000
- Publication date Apr 24, 2025
- CHILLDYNE, INC.
- Steven Merrill Harrington
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
DUAL FLOW LOW PROFILE COOLANT DISTRIBUTION MANIFOLD
- Publication number 20250133691
- Publication date Apr 24, 2025
- CIENA CORPORATION
- Simon J. Shearman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORTHOGONAL COLD PLATE FOR USE IN ACTIVE LIQUID IMMERSION COOLING
- Publication number 20250133692
- Publication date Apr 24, 2025
- Intel Corporation
- Christian Amoah-Kusi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METALLIC THERMAL INTERFACE MATERIALS AND ASSOCIATED DEVICES, SYSTEM...
- Publication number 20250126746
- Publication date Apr 17, 2025
- Deeia Inc.
- Himanshu Pokharna
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LIQUID-COOLED SMALL FORM FACTOR PLUGGABLE OPTICAL MODULE
- Publication number 20250123454
- Publication date Apr 17, 2025
- CIENA CORPORATION
- Behzad Mohajer
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COLD PLATE WITH STREAMLINED COOLANT TUBES
- Publication number 20250126745
- Publication date Apr 17, 2025
- QUANTA COMPUTER INC.
- Chao-Jung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEMPERATURE ADJUSTMENT DEVICE, SINGLE-PHASE LIQUID COOLING SYSTEM A...
- Publication number 20250120047
- Publication date Apr 10, 2025
- SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD.
- Huanlai ZHU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID-COOLING DEVICE AND ELECTRONIC DEVICE
- Publication number 20250107037
- Publication date Mar 27, 2025
- WISTRON CORP.
- Wen Hua Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINGLE PHASE LIQUID IMMERSION COOLING SYSTEM WITH FORCED COOLING CI...
- Publication number 20250107036
- Publication date Mar 27, 2025
- Fang-Shou LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC DEVICES
- Publication number 20250107046
- Publication date Mar 27, 2025
- Microsoft Technology Licensing, LLC
- Kathryn M. OSEEN-SENDA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONDUCTOR MEMBER WITH COOLING STRUCTURE
- Publication number 20250098107
- Publication date Mar 20, 2025
- YAZAKI CORPORATION
- Junya HIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITIES FOR CENTER-PINNED ACTUATOR COOLING SYSTEMS
- Publication number 20250089219
- Publication date Mar 13, 2025
- Frore Systems Inc.
- Suryaprakash Ganti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING PLATE, BATTERY DISCONNECT UNIT, AND A DRIVE SYSTEM
- Publication number 20250081390
- Publication date Mar 6, 2025
- ROBERT BOSCH GmbH
- Markus Schmitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250081389
- Publication date Mar 6, 2025
- DENSO CORPORATION
- TAKUYA YAMAGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLING PLATE ASSEMBLY AND SERVER
- Publication number 20250081391
- Publication date Mar 6, 2025
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Jingnan ZHAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION STRUCTURE AND VEHICLE CHARGING DEVICE
- Publication number 20250071955
- Publication date Feb 27, 2025
- LITE-ON SINGAPORE PTE. LTD.
- Muhammad Azhar Abdul Gafar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROCHANNEL COOLING BLOCK AND COOLING SYSTEM INCLUDING THE SAME
- Publication number 20250071936
- Publication date Feb 27, 2025
- HRL LABORATORIES, LLC
- John H. Martin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT EXCHANGER WITH CONTACT SEALING AND RELATED SYSTEMS AND METHODS
- Publication number 20250071937
- Publication date Feb 27, 2025
- COOLIT SYSTEMS, INC.
- Bradley Zakaib
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COLD PLATE ARCHITECTURE FOR LIQUID COOLING OF DEVICES
- Publication number 20250071938
- Publication date Feb 27, 2025
- Intel Corporation
- Jin YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID-COOLING HEAT DISSIPATION DEVICE
- Publication number 20250071939
- Publication date Feb 27, 2025
- Chien-Hao CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTIMIZED CHIP COOLING INFRASTRUCTURE
- Publication number 20250063688
- Publication date Feb 20, 2025
- Microsoft Technology Licensing, LLC
- Eric C. PETERSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR SUPPORTING A HIGH THERMAL GRADIENT BETWEEN...
- Publication number 20250063650
- Publication date Feb 20, 2025
- Microsoft Technology Licensing, LLC
- Matthew David TURNER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Cold plates transferring heat from heat source to coolant

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Liquid-in-liquid cooling system for electronic components

Disinfecting device

Power electronics assemblies having power electronics devices embed...

Methods and heat distribution devices for thermal management of chi...

Cold plate

Liquid cooled server chassis

Thermal management of high capacity optics in dense arrangements

Cooling device for cooling components of a circuit board

Liquid cooling system with liquid leakage detecting module

Engineered actuators usable in MEMs active cooling devices

Systems for cooler devices and cooling manifolds

Cooling device

Rack with trays for plug-in automotive control units

Apparatus providing liquid temperature data from individual direct...

Liquid cooling system for precise temperature control of radiation...

Micro heat transfer arrays, micro cold plates, and thermal manageme...

Liquid cooling device

Methods and heat distribution devices for thermal management of chi...

Water-cooled heat dissipation module assembly

Power electronic device assemblies having heat spreaders and electr...

Heat sink with adaptive curvature to mitigate thermal runaway for a...

Vehicle power module assembly

Nanosecond pulser ADC system

Heat dissipation module

Cooling device

Systems and methods for modular radar systems

Heat sinks for bare die multi-chip packages

Heat exchange assembly for an electrical device

Method for assembling a liquid cooling assembly of a family of liqu...

Advanced sealing structure for liquid cooling

Patents Applicationslast 30 patents

MODULAR FLUID HEAT EXCHANGE SYSTEMS

THERMAL PAD SERVICE KIT

HEAT SINKS FOR BARE DIE MULTI-CHIP PACKAGES

COOLING STRUCTURE FOR ELECTRONIC COMPONENT AND VEHICLE DRIVING DEVICE

COOLING PLATE AND COOLING SYSTEM

ELECTRICAL CONNECTOR SYSTEM AND ELECTRIC VEHICLE

LOCKING MECHANISM FOR LIQUID COOLED PLUGGABLE MODULES

MICROCHANNEL HEAT SINK DEVICE

Liquid cooling system automated additive control

DUAL FLOW LOW PROFILE COOLANT DISTRIBUTION MANIFOLD

ORTHOGONAL COLD PLATE FOR USE IN ACTIVE LIQUID IMMERSION COOLING

METALLIC THERMAL INTERFACE MATERIALS AND ASSOCIATED DEVICES, SYSTEM...

LIQUID-COOLED SMALL FORM FACTOR PLUGGABLE OPTICAL MODULE

COLD PLATE WITH STREAMLINED COOLANT TUBES

TEMPERATURE ADJUSTMENT DEVICE, SINGLE-PHASE LIQUID COOLING SYSTEM A...

LIQUID-COOLING DEVICE AND ELECTRONIC DEVICE

SINGLE PHASE LIQUID IMMERSION COOLING SYSTEM WITH FORCED COOLING CI...

SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC DEVICES

CONDUCTOR MEMBER WITH COOLING STRUCTURE

CAVITIES FOR CENTER-PINNED ACTUATOR COOLING SYSTEMS

COOLING PLATE, BATTERY DISCONNECT UNIT, AND A DRIVE SYSTEM

ELECTRONIC DEVICE

LIQUID COOLING PLATE ASSEMBLY AND SERVER

HEAT DISSIPATION STRUCTURE AND VEHICLE CHARGING DEVICE

MICROCHANNEL COOLING BLOCK AND COOLING SYSTEM INCLUDING THE SAME

HEAT EXCHANGER WITH CONTACT SEALING AND RELATED SYSTEMS AND METHODS

COLD PLATE ARCHITECTURE FOR LIQUID COOLING OF DEVICES

LIQUID-COOLING HEAT DISSIPATION DEVICE

OPTIMIZED CHIP COOLING INFRASTRUCTURE

SYSTEMS AND METHODS FOR SUPPORTING A HIGH THERMAL GRADIENT BETWEEN...