Collar structures

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H01L2224/02166

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/02166Collar structures

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a junction portion contacting a Schottk...
- Patent number 12,057,479
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Yasuhiro Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a dual material redistribution line
- Patent number 12,027,447
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Anhao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 12,002,725
- Issue date Jun 4, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,990,434
- Issue date May 21, 2024
- Rohm Co., Ltd.
- Kazuki Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of the same
- Patent number 11,967,553
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,810,881
- Issue date Nov 7, 2023
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,810,869
- Issue date Nov 7, 2023
- Renesas Electronics Corporation
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display backboard and manufacturing method thereof and display device
- Patent number 11,764,343
- Issue date Sep 19, 2023
- BOE Technology Group Co., Ltd.
- Zhiwei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 11,682,598
- Issue date Jun 20, 2023
- Amkor Technology Singapore Holding Pte.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device having a junction portion contacting a Schottk...
- Patent number 11,610,970
- Issue date Mar 21, 2023
- Rohm Co., Ltd.
- Yasuhiro Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,545,454
- Issue date Jan 3, 2023
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using a standardized carrier to...
- Patent number 11,488,932
- Issue date Nov 1, 2022
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,482,498
- Issue date Oct 25, 2022
- Renesas Electronics Corporation
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion device, image pickup system and method of...
- Patent number 11,437,421
- Issue date Sep 6, 2022
- Canon Kabushiki Kaisha
- Mineo Shimotsusa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an aluminum oxide layer, metal surface with alumi...
- Patent number 11,424,201
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device having a dual material redis...
- Patent number 11,410,882
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Anhao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor design for integrated magnetic devices
- Patent number 11,393,787
- Issue date Jul 19, 2022
- Texas Instruments Incorporated
- Dok Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device with metallization st...
- Patent number 11,348,789
- Issue date May 31, 2022
- Infineon Technologies AG
- Jochen Hilsenbeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with patterned underbump metallization and polym...
- Patent number 11,335,659
- Issue date May 17, 2022
- ATI Technologies ULC
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising getter layers and methods of makin...
- Patent number 11,315,845
- Issue date Apr 26, 2022
- Monolith Semiconductor, Inc.
- Kevin Matocha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method thereof, and electronic...
- Patent number 11,289,527
- Issue date Mar 29, 2022
- Sony Corporation
- Hiroshi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of the same
- Patent number 11,282,784
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal structure of a power semiconductor device
- Patent number 11,239,188
- Issue date Feb 1, 2022
- Infineon Technologies AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,227,862
- Issue date Jan 18, 2022
- Murata Manufacturing Co., Ltd.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus, method of manufacturing semiconductor appa...
- Patent number 11,222,914
- Issue date Jan 11, 2022
- Sony Corporation
- Hiroshi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 11,177,187
- Issue date Nov 16, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 11,133,234
- Issue date Sep 28, 2021
- Lapis Semiconductor Co., Ltd.
- Taiichi Ogumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 11,088,102
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device-bonded body, image pickup module, endoscope and method for m...
- Patent number 11,043,524
- Issue date Jun 22, 2021
- Olympus Corporation
- Takashi Nakayama
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor device
- Patent number 11,011,489
- Issue date May 18, 2021
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING A JUNCTION PORTION CONTACTING A SCHOTTK...
- Publication number 20240355886
- Publication date Oct 24, 2024
- ROHM CO., LTD.
- Yasuhiro Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321658
- Publication date Sep 26, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240021541
- Publication date Jan 18, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY BACKBOARD AND MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE
- Publication number 20230378414
- Publication date Nov 23, 2023
- BOE TECHNOLOGY GROUP CO., LTD.
- Zhiwei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230197791
- Publication date Jun 22, 2023
- ROHM CO., LTD.
- Yasuhiro Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20230103655
- Publication date Apr 6, 2023
- Rohm Co., Ltd.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY BACKBOARD AND MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE
- Publication number 20230097502
- Publication date Mar 30, 2023
- BOE TECHNOLOGY GROUP CO., LTD.
- Zhiwei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230015101
- Publication date Jan 19, 2023
- RENESAS ELECTRONICS CORPORATION
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier to...
- Publication number 20230015504
- Publication date Jan 19, 2023
- STATS ChipPAC Pte Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION DEVICE, IMAGE PICKUP SYSTEM AND METHOD OF...
- Publication number 20220375981
- Publication date Nov 24, 2022
- Canon Kabushiki Kaisha
- Mineo Shimotsusa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A DUAL MATERIAL REDISTRIBUTION LINE
- Publication number 20220352022
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Anhao CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220328437
- Publication date Oct 13, 2022
- Rohm Co., Ltd.
- Kazuki YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE
- Publication number 20220302195
- Publication date Sep 22, 2022
- Sony Semiconductor Solutions Corporation
- HIDEKI MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20220216146
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-FA CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A JUNCTION PORTION CONTACTING A SCHOTTK...
- Publication number 20210234006
- Publication date Jul 29, 2021
- ROHM CO., LTD.
- Yasuhiro Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING FLIP-CHIP TECHNOLOGY
- Publication number 20210202425
- Publication date Jul 1, 2021
- MEDIATEK INC.
- Che-Ya CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...
- Publication number 20210151400
- Publication date May 20, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210066213
- Publication date Mar 4, 2021
- Renesas Electronics Corporation
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE HAVING A DUAL MATERIAL REDIS...
- Publication number 20210020506
- Publication date Jan 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Anhao CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200335491
- Publication date Oct 22, 2020
- Murata Manufacturing Co., Ltd.
- Kenji SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20200303301
- Publication date Sep 24, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-FA CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200266162
- Publication date Aug 20, 2020
- Samsung Electronics Co., Ltd.
- SEOK-HO SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier to...
- Publication number 20200227383
- Publication date Jul 16, 2020
- STATS ChipPAC Pte Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...
- Publication number 20200211931
- Publication date Jul 2, 2020
- RENESAS ELECTRONICS CORPORATION
- Masahiro MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20200185343
- Publication date Jun 11, 2020
- ABLIC Inc.
- Shinjiro KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a juntion portion contacting a schottky...
- Publication number 20200176572
- Publication date Jun 4, 2020
- ROHM CO., LTD.
- Yasuhiro Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION DEVICE, IMAGE PICKUP SYSTEM AND METHOD OF...
- Publication number 20200127033
- Publication date Apr 23, 2020
- Canon Kabushiki Kaisha
- Mineo Shimotsusa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded Structures for Package and Substrate
- Publication number 20200098714
- Publication date Mar 26, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER
- Publication number 20200075522
- Publication date Mar 5, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20200006327
- Publication date Jan 2, 2020
- Rohm Co., Ltd.
- Masatoshi AKETA
- H01 - BASIC ELECTRIC ELEMENTS

Collar structures

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device having a junction portion contacting a Schottk...

Semiconductor device having a dual material redistribution line

Sensor package and manufacturing method thereof

Semiconductor device and method of manufacturing semiconductor device

Semiconductor package and manufacturing method of the same

Semiconductor device

Semiconductor device and method of manufacturing the same

Display backboard and manufacturing method thereof and display device

Sensor package and manufacturing method thereof

Semiconductor device having a junction portion contacting a Schottk...

Semiconductor device

Semiconductor device and method of using a standardized carrier to...

Semiconductor device and method of manufacturing the same

Photoelectric conversion device, image pickup system and method of...

Method of forming an aluminum oxide layer, metal surface with alumi...

Method of forming semiconductor device having a dual material redis...

Conductor design for integrated magnetic devices

Method for manufacturing semiconductor device with metallization st...

Semiconductor chip with patterned underbump metallization and polym...

Semiconductor devices comprising getter layers and methods of makin...

Semiconductor device, manufacturing method thereof, and electronic...

Semiconductor package and manufacturing method of the same

Terminal structure of a power semiconductor device

Semiconductor device

Semiconductor apparatus, method of manufacturing semiconductor appa...

Sensor package and manufacturing method thereof

Semiconductor device and semiconductor device manufacturing method

Bonded structures for package and substrate

Device-bonded body, image pickup module, endoscope and method for m...

Semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING A JUNCTION PORTION CONTACTING A SCHOTTK...

SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

DISPLAY BACKBOARD AND MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

ELECTRONIC COMPONENT

DISPLAY BACKBOARD AND MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Device and Method of Using a Standardized Carrier to...

PHOTOELECTRIC CONVERSION DEVICE, IMAGE PICKUP SYSTEM AND METHOD OF...

SEMICONDUCTOR DEVICE HAVING A DUAL MATERIAL REDISTRIBUTION LINE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SOLID-STATE IMAGING DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE HAVING A JUNCTION PORTION CONTACTING A SCHOTTK...

SEMICONDUCTOR PACKAGE USING FLIP-CHIP TECHNOLOGY

COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD OF FORMING SEMICONDUCTOR DEVICE HAVING A DUAL MATERIAL REDIS...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE

Semiconductor Device and Method of Using a Standardized Carrier to...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

Semiconductor device having a juntion portion contacting a schottky...

PHOTOELECTRIC CONVERSION DEVICE, IMAGE PICKUP SYSTEM AND METHOD OF...

Bonded Structures for Package and Substrate

FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE