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Combinations of arrays with different layouts

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  • CPC
  • H01L2224/33177
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/33177Combinations of arrays with different layouts
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method for mounting electronic components
    • Patent number 8,230,590
    • Issue date Jul 31, 2012
    • Fujitsu Semiconductor Limited
    • Takao Nishimura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD FOR MOUNTING ELECTRONIC COMPONENTS
    • Publication number 20080196245
    • Publication date Aug 21, 2008
    • Fujitsu Limited
    • Takao Nishimura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR