Combinations of arrays with different layouts

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H01L2224/14177

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/14177Combinations of arrays with different layouts

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Structures to increase substrate routing density and methods of for...
- Patent number 12,308,321
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including anisotropic conductive film (ACF)
- Patent number 12,167,644
- Issue date Dec 10, 2024
- SHARP KABUSHIKI KAISHA
- Shinzoh Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for pixel data compensation for display drivers w...
- Patent number 12,051,355
- Issue date Jul 30, 2024
- Synaptics Incorporated
- Kazuhiro Okamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, optical structure and method for manufacturing t...
- Patent number 12,033,934
- Issue date Jul 9, 2024
- Advanced Semiconductor Engineering, Inc.
- Yu-Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,916,033
- Issue date Feb 27, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging of light emitting diodes (LEDs)
- Patent number 11,837,585
- Issue date Dec 5, 2023
- CreeLED, Inc.
- Michael John Bergmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip and semiconductor package including the same
- Patent number 11,830,840
- Issue date Nov 28, 2023
- Samsung Electronics Co., Ltd.
- Young Jun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of direct bonding semiconductor components
- Patent number 11,810,892
- Issue date Nov 7, 2023
- Imec VZW
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-pitch leads
- Patent number 11,694,947
- Issue date Jul 4, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,456,268
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment carrier for interconnect bridge assembly
- Patent number 11,393,759
- Issue date Jul 19, 2022
- International Business Machines Corporation
- Thomas Weiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming same
- Patent number 11,387,118
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip power supply system, chip, PCB, and computer device
- Patent number 11,387,226
- Issue date Jul 12, 2022
- Huawei Technologies Co., Ltd.
- Yadong Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,239,192
- Issue date Feb 1, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control device and circuit board
- Patent number 11,227,851
- Issue date Jan 18, 2022
- Realtek Semiconductor Corp.
- Chao-Min Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pitch leads
- Patent number 11,094,616
- Issue date Aug 17, 2021
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 11,088,102
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures having multiple microelectronic devices...
- Patent number 11,075,166
- Issue date Jul 27, 2021
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and systems for coupling semiconductor substrates
- Patent number 10,971,540
- Issue date Apr 6, 2021
- FLIR Systems, Inc.
- Richard E. Bornfreund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,867,951
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging of light emitting diodes (LEDs)
- Patent number 10,854,584
- Issue date Dec 1, 2020
- Cree, Inc.
- Michael John Bergmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures having multiple microelectronic devices...
- Patent number 10,790,231
- Issue date Sep 29, 2020
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management application of interconnect substrates
- Patent number 10,748,845
- Issue date Aug 18, 2020
- Volterra Semiconductor Corporation
- Mihalis Michael
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 10,734,343
- Issue date Aug 4, 2020
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with heat-dissipating structure and method of...
- Patent number 10,679,955
- Issue date Jun 9, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup module and endoscope
- Patent number 10,660,511
- Issue date May 26, 2020
- Olympus Corporation
- Takuro Suyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,607,964
- Issue date Mar 31, 2020
- TOSHIBA MEMORY CORPORATION
- Shinya Fukayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including external terminal groups
- Patent number 10,559,528
- Issue date Feb 11, 2020
- Rohm Co., Ltd.
- Masashi Nagasato
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Bonded structures for package and substrate
- Patent number 10,468,366
- Issue date Nov 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures having multiple microelectronic devices...
- Patent number 10,418,329
- Issue date Sep 17, 2019
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH PILLAR-FIRST CONDUCTIVE VIA FORMATI...
- Publication number 20250218880
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO FACILITATE SEMICONDUCTOR DEVICE ALIGNMENT...
- Publication number 20250218961
- Publication date Jul 3, 2025
- Intel Corporation
- Tolga Acikalin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD DESIGN FOR EMBEDDED INTERCONNECT BRIDGES IN PACKAGE SUBSTRATES
- Publication number 20250218959
- Publication date Jul 3, 2025
- Intel Corporation
- Minglu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF ALIGNMENT STRUCTURES FOR INTERCONNECT BRIDGES
- Publication number 20250218965
- Publication date Jul 3, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES
- Publication number 20250210426
- Publication date Jun 26, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH PRE-SINGULATION EDGE FEATURES IN GL...
- Publication number 20250192069
- Publication date Jun 12, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167151
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Chonghee LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT S...
- Publication number 20250125307
- Publication date Apr 17, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Semiconductor Interconnect Interfaces, Semiconductor...
- Publication number 20250118663
- Publication date Apr 10, 2025
- JARIET TECHNOLOGIES, INC.
- Scott Richard POWELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES
- Publication number 20250112175
- Publication date Apr 3, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250105169
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Leu-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321799
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Kiwon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND HIGH FREQUENCY MODULE
- Publication number 20240250052
- Publication date Jul 25, 2024
- FUJIKURA LTD.
- Michikazu Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD...
- Publication number 20240234358
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- JUNHO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Bump Configurations in Circuitry and Methods of Manufacture...
- Publication number 20240178174
- Publication date May 30, 2024
- Anwar Hashmi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYERS
- Publication number 20240162111
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Seunghyun CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF BUMP MAP DETERMINATION AND BUMP ARRAY FORMATION
- Publication number 20240096834
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Shih Hsuan HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONDUCTIVE PILLAR DEVICE AND METHOD
- Publication number 20240071972
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Hidenori Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTS FOR ARRAYS OF JOSEPHSON TRAVELING WAVE P...
- Publication number 20230337552
- Publication date Oct 19, 2023
- International Business Machines Corporation
- Corrado P. Mancini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, OPTICAL STRUCTURE AND METHOD FOR MANUFACTURING T...
- Publication number 20230317589
- Publication date Oct 5, 2023
- Advanced Semiconductor Engineering, Inc.
- Yu-Ying LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES WITH NON-UNIFORM INTERCONNECT FEATURES
- Publication number 20230317660
- Publication date Oct 5, 2023
- Intel Corporation
- Zhaozhi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT S...
- Publication number 20230197679
- Publication date Jun 22, 2023
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHYSICAL AND ELECTRICAL PROTOCOL TRANSLATION CHIPLETS
- Publication number 20230100228
- Publication date Mar 30, 2023
- Intel Corporation
- Gerald PASDAST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES TO INCREASE SUBSTRATE ROUTING DENSITY AND METHODS OF FOR...
- Publication number 20230038892
- Publication date Feb 9, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE OF CHIP
- Publication number 20220336398
- Publication date Oct 20, 2022
- Sitronix Technology Corp.
- KUO-WEI TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming Same
- Publication number 20220301889
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING BRIDGES
- Publication number 20220270976
- Publication date Aug 25, 2022
- Xiaoxuan Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20220157755
- Publication date May 19, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED MULTI-DIE INTERCONNECT BRIDGE WITH IMPROVED POWER DELIVERY
- Publication number 20220149029
- Publication date May 12, 2022
- Intel Corporation
- Hui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20210407948
- Publication date Dec 30, 2021
- Samsung Electronics Co., Ltd.
- Young Jun KIM
- H01 - BASIC ELECTRIC ELEMENTS

Combinations of arrays with different layouts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Structures to increase substrate routing density and methods of for...

Display device including anisotropic conductive film (ACF)

Device and method for pixel data compensation for display drivers w...

Package structure, optical structure and method for manufacturing t...

Method and system for packing optimization of semiconductor devices

Wafer level packaging of light emitting diodes (LEDs)

Integrated chip and semiconductor package including the same

Method of direct bonding semiconductor components

Multi-pitch leads

Semiconductor package and manufacturing method thereof

Alignment carrier for interconnect bridge assembly

Integrated circuit packages and methods of forming same

Chip power supply system, chip, PCB, and computer device

Method and system for packing optimization of semiconductor devices

Control device and circuit board

Multi-pitch leads

Bonded structures for package and substrate

Microelectronic structures having multiple microelectronic devices...

Method and systems for coupling semiconductor substrates

Semiconductor device

Wafer level packaging of light emitting diodes (LEDs)

Microelectronic structures having multiple microelectronic devices...

Power management application of interconnect substrates

Method and system for packing optimization of semiconductor devices

Semiconductor package with heat-dissipating structure and method of...

Image pickup module and endoscope

Semiconductor device

Semiconductor device including external terminal groups

Bonded structures for package and substrate

Microelectronic structures having multiple microelectronic devices...

Patents Applicationslast 30 patents

MICROELECTRONIC ASSEMBLIES WITH PILLAR-FIRST CONDUCTIVE VIA FORMATI...

METHODS AND APPARATUS TO FACILITATE SEMICONDUCTOR DEVICE ALIGNMENT...

PAD DESIGN FOR EMBEDDED INTERCONNECT BRIDGES IN PACKAGE SUBSTRATES

SELF ALIGNMENT STRUCTURES FOR INTERCONNECT BRIDGES

MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES

MICROELECTRONIC ASSEMBLIES WITH PRE-SINGULATION EDGE FEATURES IN GL...

SEMICONDUCTOR PACKAGE

MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT S...

Heterogeneous Semiconductor Interconnect Interfaces, Semiconductor...

MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND HIGH FREQUENCY MODULE

SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD...

Solder Bump Configurations in Circuitry and Methods of Manufacture...

SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYERS

SYSTEM AND METHOD OF BUMP MAP DETERMINATION AND BUMP ARRAY FORMATION

SEMICONDUCTOR CONDUCTIVE PILLAR DEVICE AND METHOD

HIGH DENSITY INTERCONNECTS FOR ARRAYS OF JOSEPHSON TRAVELING WAVE P...

PACKAGE STRUCTURE, OPTICAL STRUCTURE AND METHOD FOR MANUFACTURING T...

PACKAGE STRUCTURES WITH NON-UNIFORM INTERCONNECT FEATURES

MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT S...

PHYSICAL AND ELECTRICAL PROTOCOL TRANSLATION CHIPLETS

STRUCTURES TO INCREASE SUBSTRATE ROUTING DENSITY AND METHODS OF FOR...

BUMP STRUCTURE OF CHIP

Integrated Circuit Packages and Methods of Forming Same

MICROELECTRONIC ASSEMBLIES INCLUDING BRIDGES

Method and System for Packing Optimization of Semiconductor Devices

EMBEDDED MULTI-DIE INTERCONNECT BRIDGE WITH IMPROVED POWER DELIVERY

INTEGRATED CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME