Combinations of arrays with different layouts

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H01L2224/09177

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/09177Combinations of arrays with different layouts

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor storage device
- Patent number 12,132,040
- Issue date Oct 29, 2024
- Kioxia Corporation
- Nobuaki Okada
- G11 - INFORMATION STORAGE
Information Patent Grant
Direct bonding in microelectronic assemblies
- Patent number 11,990,448
- Issue date May 21, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device
- Patent number 11,710,727
- Issue date Jul 25, 2023
- Kioxia Corporation
- Nobuaki Okada
- G11 - INFORMATION STORAGE
Information Patent Grant
Serializer-deserializer die for high speed signal interconnect
- Patent number 11,581,282
- Issue date Feb 14, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment carrier for interconnect bridge assembly
- Patent number 11,393,759
- Issue date Jul 19, 2022
- International Business Machines Corporation
- Thomas Weiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device having wafer-to-wafer bonding structure
- Patent number 11,315,895
- Issue date Apr 26, 2022
- SK hynix Inc.
- Sung Lae Oh
- G11 - INFORMATION STORAGE
Information Patent Grant
Multi-chip modules
- Patent number 11,018,123
- Issue date May 25, 2021
- International Business Machines Corporation
- Effendi Leobandung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor package including the same
- Patent number 10,748,871
- Issue date Aug 18, 2020
- Samsung Electronics Co., Ltd.
- Seong Hwan Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip modules
- Patent number 10,741,532
- Issue date Aug 11, 2020
- International Business Machines Corporation
- Effendi Leobandung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for a microelectronic device
- Patent number 10,366,968
- Issue date Jul 30, 2019
- Intel IP Corporation
- Klaus Reingruber
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES
- Publication number 20240274576
- Publication date Aug 15, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE MEMORY DEVICE
- Publication number 20240222322
- Publication date Jul 4, 2024
- SAMSUNG ELECRTONICS CO., LTD.
- Hanmin Nam
- G11 - INFORMATION STORAGE
Information Patent Application
RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20230395536
- Publication date Dec 7, 2023
- Murata Manufacturing Co., Ltd.
- Naohide TOMITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230005885
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- Hyemi Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES
- Publication number 20220093561
- Publication date Mar 24, 2022
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE HAVING WAFER-TO-WAFER BONDING STRUCTURE
- Publication number 20210313288
- Publication date Oct 7, 2021
- SK hynix Inc.
- Sung Lae OH
- G11 - INFORMATION STORAGE
Information Patent Application
ALIGNMENT CARRIER FOR INTERCONNECT BRIDGE ASSEMBLY
- Publication number 20210104464
- Publication date Apr 8, 2021
- International Business Machines Corporation
- Thomas Weiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20210082897
- Publication date Mar 18, 2021
- KIOXIA Corporation
- Nobuaki OKADA
- G11 - INFORMATION STORAGE
Information Patent Application
MULTI-CHIP MODULES
- Publication number 20200235086
- Publication date Jul 23, 2020
- International Business Machines Corporation
- Effendi LEOBANDUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SERIALIZER-DESERIALIZER DIE FOR HIGH SPEED SIGNAL INTERCONNECT
- Publication number 20200075521
- Publication date Mar 5, 2020
- Intel Corporation
- Adel A. Elsherbini
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE
- Publication number 20190333886
- Publication date Oct 31, 2019
- Intel IP Corporation
- Klaus Reingruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20190295986
- Publication date Sep 26, 2019
- Samsung Electronics Co., Ltd.
- SEONG HWAN OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULES
- Publication number 20190279971
- Publication date Sep 12, 2019
- International Business Machines Corporation
- Effendi LEOBANDUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE
- Publication number 20180096970
- Publication date Apr 5, 2018
- Klaus Reingruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...
- Publication number 20180045885
- Publication date Feb 15, 2018
- STMicroelectronics S.r.l.
- Arturo Luigi CANALI
- G02 - OPTICS

Combinations of arrays with different layouts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor storage device

Direct bonding in microelectronic assemblies

Semiconductor storage device

Serializer-deserializer die for high speed signal interconnect

Alignment carrier for interconnect bridge assembly

Semiconductor memory device having wafer-to-wafer bonding structure

Multi-chip modules

Semiconductor chip and semiconductor package including the same

Multi-chip modules

Interconnect structure for a microelectronic device

Patents Applicationslast 30 patents

DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES

NON-VOLATILE MEMORY DEVICE

RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE

SEMICONDUCTOR PACKAGE

DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES

SEMICONDUCTOR MEMORY DEVICE HAVING WAFER-TO-WAFER BONDING STRUCTURE

ALIGNMENT CARRIER FOR INTERCONNECT BRIDGE ASSEMBLY

SEMICONDUCTOR STORAGE DEVICE

MULTI-CHIP MODULES

SERIALIZER-DESERIALIZER DIE FOR HIGH SPEED SIGNAL INTERCONNECT

INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

MULTI-CHIP MODULES

INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...