Combinations of arrays with different layouts

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CPC
H01L2224/30177

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/30177Combinations of arrays with different layouts

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices with underfill control features, and associat...
- Patent number 10,784,224
- Issue date Sep 22, 2020
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with underfill control features, and associat...
- Patent number 10,424,553
- Issue date Sep 24, 2019
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the diffusion soldering of an electronic component to a...
- Patent number 10,004,147
- Issue date Jun 19, 2018
- Siemens Aktiengesellschaft
- Joerg Strogies
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-Nitride device with solderable front metal
- Patent number 9,312,375
- Issue date Apr 12, 2016
- Infineon Technologies Americas Corp.
- Chuan Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device with solderable front metal
- Patent number 8,853,744
- Issue date Oct 7, 2014
- International Rectifier Corporation
- Chuan Cheah
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Micromechanical method and corresponding assembly for bonding semic...
- Patent number 8,638,000
- Issue date Jan 28, 2014
- Robert Bosch GmbH
- Achim Trautmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with heat dissipation
- Patent number 8,581,390
- Issue date Nov 12, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Edward O. Travis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-nitride power device with solderable front metal
- Patent number 8,399,912
- Issue date Mar 19, 2013
- International Rectifier Corporation
- Chuan Cheah
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method for mounting electronic components
- Patent number 8,230,590
- Issue date Jul 31, 2012
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIAT...
- Publication number 20190371755
- Publication date Dec 5, 2019
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIAT...
- Publication number 20180122762
- Publication date May 3, 2018
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND PACKAGE STRUCTURE
- Publication number 20150243620
- Publication date Aug 27, 2015
- Taiwan Semiconductor Manufacturing Company Limited
- WEI-HUNG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION
- Publication number 20130264698
- Publication date Oct 10, 2013
- Edward O. Travis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Device with Solderable Front Metal
- Publication number 20130207120
- Publication date Aug 15, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Chuan Cheah
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Micromechanical Method and Corresponding Assembly for Bonding Semic...
- Publication number 20120280409
- Publication date Nov 8, 2012
- Achim Trautmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
III-Nitride Power Device with Solderable Front Metal
- Publication number 20110198611
- Publication date Aug 18, 2011
- INTERNATIONAL RECTIFIER CORPORATION
- Chuan Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOUNTING ELECTRONIC COMPONENTS
- Publication number 20080196245
- Publication date Aug 21, 2008
- Fujitsu Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Combinations of arrays with different layouts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices with underfill control features, and associat...

Semiconductor devices with underfill control features, and associat...

Method for the diffusion soldering of an electronic component to a...

III-Nitride device with solderable front metal

Power device with solderable front metal

Micromechanical method and corresponding assembly for bonding semic...

Semiconductor device with heat dissipation

III-nitride power device with solderable front metal

Method for mounting electronic components

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIAT...

SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIAT...

SUBSTRATE AND PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION

Power Device with Solderable Front Metal

Micromechanical Method and Corresponding Assembly for Bonding Semic...

III-Nitride Power Device with Solderable Front Metal

METHOD FOR MOUNTING ELECTRONIC COMPONENTS