Combinations of arrays with different layouts

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H01L2224/17177

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/17177Combinations of arrays with different layouts

Industries

Patents Grantslast 30 patents

Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,170,253
- Issue date Dec 17, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,113,048
- Issue date Oct 8, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform chip gaps via injection-molded solder pillars
- Patent number 12,107,065
- Issue date Oct 1, 2024
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,074,142
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Jongpa Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,074,121
- Issue date Aug 27, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method thereof
- Patent number 12,033,992
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform electrochemical plating of metal onto arrays of pillars hav...
- Patent number 11,923,329
- Issue date Mar 5, 2024
- Jonathan S. Hacker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Alternative surfaces for conductive pad layers of silicon bridges f...
- Patent number 11,848,259
- Issue date Dec 19, 2023
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and method for manufacturing the same
- Patent number 11,837,566
- Issue date Dec 5, 2023
- Advanced Semiconductor Engineering, Inc.
- Mei-Ju Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,824,029
- Issue date Nov 21, 2023
- Advanced Semiconductor Engineering, Inc.
- Chi-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of direct bonding semiconductor components
- Patent number 11,810,892
- Issue date Nov 7, 2023
- Imec VZW
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package and methods of manufacture
- Patent number 11,756,945
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 11,626,372
- Issue date Apr 11, 2023
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 11,616,047
- Issue date Mar 28, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switched power stage with integrated passive components
- Patent number 11,605,580
- Issue date Mar 14, 2023
- CHAOYANG SEMICONDUCTOR (SHANGHAI) CO., LTD
- Taner Dosluoglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform electrochemical plating of metal onto arrays of pillars hav...
- Patent number 11,527,505
- Issue date Dec 13, 2022
- Micron Technology, Inc.
- Jonathan S. Hacker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microelectronic assemblies
- Patent number 11,469,206
- Issue date Oct 11, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,456,268
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including first substrate having first and second...
- Patent number 11,430,755
- Issue date Aug 30, 2022
- Brother Kogyo Kabushiki Kaisha
- Keita Hirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and method for manufacturing the same
- Patent number 11,183,474
- Issue date Nov 23, 2021
- Advanced Semiconductor Engineering, Inc.
- Mei-Ju Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method thereof
- Patent number 11,088,124
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,063,013
- Issue date Jul 13, 2021
- Advanced Semiconductor Engineering, Inc.
- Chi-Han Chen
- G02 - OPTICS
Information Patent Grant
Multi-chip modules
- Patent number 11,018,123
- Issue date May 25, 2021
- International Business Machines Corporation
- Effendi Leobandung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 10,916,514
- Issue date Feb 9, 2021
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform electrochemical plating of metal onto arrays of pillars hav...
- Patent number 10,847,486
- Issue date Nov 24, 2020
- Micron Technology, Inc.
- Jonathan S. Hacker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device including first substrate having first and second...
- Patent number 10,847,484
- Issue date Nov 24, 2020
- Brother Kogyo Kabushiki Kaisha
- Keita Hirai
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Multi-chip modules
- Patent number 10,741,532
- Issue date Aug 11, 2020
- International Business Machines Corporation
- Effendi Leobandung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 10,622,326
- Issue date Apr 14, 2020
- Industrial Technology Research Institute
- Chen-Tsai Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform electrochemical plating of metal onto arrays of pillars hav...
- Patent number 10,396,052
- Issue date Aug 27, 2019
- Micron Technology, Inc.
- Jonathan S. Hacker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of yield prejudgment and bump re-assignment and computer rea...
- Patent number 10,339,253
- Issue date Jul 2, 2019
- Industrial Technology Research Institute
- Chi-Han Lee
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20250022845
- Publication date Jan 16, 2025
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS
- Publication number 20240421113
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE IN A STACK FORM
- Publication number 20240387420
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Soyeon Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package and Methods of Manufacture
- Publication number 20240379645
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240371835
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Jongpa HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321848
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAV...
- Publication number 20240178175
- Publication date May 30, 2024
- Lodestar Licensing Group LLC
- Jonathan S. Hacker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT
- Publication number 20240162192
- Publication date May 16, 2024
- International Business Machines Corporation
- Arvind Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE HAVING BALL GRID ARRAY SUBSTRATE WITH SIGNAL AND PO...
- Publication number 20240145363
- Publication date May 2, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Vivek SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240113061
- Publication date Apr 4, 2024
- Advanced Semiconductor Engineering, Inc.
- Mei-Ju LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE
- Publication number 20230378150
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20230223361
- Publication date Jul 13, 2023
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE AND METHOD FOR PREPARING THE SAME, AND MET...
- Publication number 20230197666
- Publication date Jun 22, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Zengyan FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230154892
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Chu TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20230133235
- Publication date May 4, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAV...
- Publication number 20230104042
- Publication date Apr 6, 2023
- Micron Technology, Inc.
- Jonathan S. Hacker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR CHIP
- Publication number 20230057061
- Publication date Feb 23, 2023
- Samsung Electronics Co., Ltd.
- Seyeong SEOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220406755
- Publication date Dec 22, 2022
- Samsung Electronics Co., Ltd.
- Jongpa HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE
- Publication number 20220278087
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220084972
- Publication date Mar 17, 2022
- Advanced Semiconductor Engineering, Inc.
- Mei-Ju LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS
- Publication number 20220020715
- Publication date Jan 20, 2022
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210366885
- Publication date Nov 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20210343671
- Publication date Nov 4, 2021
- Advanced Semiconductor Engineering, Inc.
- Chi-Han CHEN
- G02 - OPTICS
Information Patent Application
METHOD FOR BONDING SEMICONDUCTOR COMPONENTS
- Publication number 20210159207
- Publication date May 27, 2021
- IMEC vzw
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210134751
- Publication date May 6, 2021
- Advanced Semiconductor Engineering, Inc.
- Mei-Ju LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20210125942
- Publication date Apr 29, 2021
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20210111156
- Publication date Apr 15, 2021
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHED POWER STAGE WITH INTEGRATED PASSIVE COMPONENTS
- Publication number 20210111111
- Publication date Apr 15, 2021
- Chaoyang Semiconductor Jiangyin Technology Co., Ltd.
- Taner Dosluoglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAV...
- Publication number 20210074663
- Publication date Mar 11, 2021
- Micron Technology, Inc.
- Jonathan S. Hacker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20200365544
- Publication date Nov 19, 2020
- Advanced Semiconductor Engineering, Inc.
- Chi-Han CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Combinations of arrays with different layouts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal-free frame design for silicon bridges for semiconductor packages

Microelectronic assemblies

Uniform chip gaps via injection-molded solder pillars

Semiconductor package and method of fabricating the same

Metal-free frame design for silicon bridges for semiconductor packages

Package and manufacturing method thereof

Uniform electrochemical plating of metal onto arrays of pillars hav...

Alternative surfaces for conductive pad layers of silicon bridges f...

Electronic device package and method for manufacturing the same

Semiconductor package structure

Method of direct bonding semiconductor components

Semiconductor device package and methods of manufacture

Metal-free frame design for silicon bridges for semiconductor packages

Microelectronic assemblies

Switched power stage with integrated passive components

Uniform electrochemical plating of metal onto arrays of pillars hav...

Microelectronic assemblies

Semiconductor package and manufacturing method thereof

Electronic device including first substrate having first and second...

Electronic device package and method for manufacturing the same

Package and manufacturing method thereof

Semiconductor package structure

Multi-chip modules

Metal-free frame design for silicon bridges for semiconductor packages

Uniform electrochemical plating of metal onto arrays of pillars hav...

Electronic device including first substrate having first and second...

Multi-chip modules

Chip package structure

Uniform electrochemical plating of metal onto arrays of pillars hav...

Method of yield prejudgment and bump re-assignment and computer rea...

Patents Applicationslast 30 patents

MICROELECTRONIC ASSEMBLIES

UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS

SEMICONDUCTOR PACKAGE IN A STACK FORM

Semiconductor Device Package and Methods of Manufacture

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

PACKAGE AND MANUFACTURING METHOD THEREOF

UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAV...

STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT

FAN-OUT PACKAGE HAVING BALL GRID ARRAY SUBSTRATE WITH SIGNAL AND PO...

ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

CHIP PACKAGING STRUCTURE AND METHOD FOR PREPARING THE SAME, AND MET...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

MICROELECTRONIC ASSEMBLIES

UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAV...

SEMICONDUCTOR CHIP

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE

ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS

PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE

METHOD FOR BONDING SEMICONDUCTOR COMPONENTS

ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

MICROELECTRONIC ASSEMBLIES

SWITCHED POWER STAGE WITH INTEGRATED PASSIVE COMPONENTS

UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAV...

SEMICONDUCTOR PACKAGE STRUCTURE