TREA

Combinations of bonding methods provided for in at least two different groups from H01L2224/868 - H01L2224/86897

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  • CPC
  • H01L2224/86899
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/86899Combinations of bonding methods provided for in at least two different groups from H01L2224/868 - H01L2224/86897
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