Combinations of bonding methods provided for in at least two different groups from H01L2224/838 - H01L2224/83904

Industry

CPC
H01L2224/83905

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83905Combinations of bonding methods provided for in at least two different groups from H01L2224/838 - H01L2224/83904

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit film, display device, and method of fabricating pri...
- Patent number 11,737,215
- Issue date Aug 22, 2023
- Samsung Display Co., Ltd.
- Dong Hyun Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Chemical mechanical polishing for hybrid bonding
- Patent number 11,552,041
- Issue date Jan 10, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing the same, and power...
- Patent number 11,183,479
- Issue date Nov 23, 2021
- Mitsubishi Electric Corporation
- Shohei Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly process for circuit carrier and circuit carrier
- Patent number 10,991,632
- Issue date Apr 27, 2021
- A.B. MIKROELEKTRONIK GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG
- Andreas Karch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing for hybrid bonding
- Patent number 10,840,205
- Issue date Nov 17, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Placement method for circuit carrier and circuit carrier
- Patent number 10,672,672
- Issue date Jun 2, 2020
- A.B. MIKROELEKTRONIK GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG
- Andreas Karch
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Bonding method for connecting two wafers
- Patent number 10,134,707
- Issue date Nov 20, 2018
- Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung E.V.
- Kai Zoschke
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wafer stack protection seal
- Patent number 9,768,089
- Issue date Sep 19, 2017
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ranjan Rajoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer stack protection seal
- Patent number 9,406,577
- Issue date Aug 2, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ranjan Rajoo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrically conductive adhesive compound and adhesive tape
- Patent number 9,399,723
- Issue date Jul 26, 2016
- tesa SE
- Klaus Keite-Telgenbüscher
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Bonding structure and method for manufacturing same
- Patent number 8,258,637
- Issue date Sep 4, 2012
- Hitachi, Ltd.
- Eiji Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing of a device including a semiconductor chip
- Patent number 8,193,040
- Issue date Jun 5, 2012
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Minitab rectifier for alternators
- Patent number 6,713,937
- Issue date Mar 30, 2004
- International Rectifier Corporation
- Hugh Richard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Minitab rectifying diode package with two different types of diodes...
- Patent number 6,627,975
- Issue date Sep 30, 2003
- International Rectifier Corporation
- Hugh Richard
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20240379607
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20230268308
- Publication date Aug 24, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230060577
- Publication date Mar 2, 2023
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20210066233
- Publication date Mar 4, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman FOUNTAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND POWER...
- Publication number 20200043887
- Publication date Feb 6, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Shohei OGAWA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, AND METHOD FOR MA...
- Publication number 20200043888
- Publication date Feb 6, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Hiroaki TATSUMI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20190096842
- Publication date Mar 28, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman FOUNTAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STACK PROTECTION SEAL
- Publication number 20140264762
- Publication date Sep 18, 2014
- GLOBAL FOUNDRIES SINGAPORE PTE LTD.
- Ranjan RAJOO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE COMPOUND AND ADHESIVE TAPE
- Publication number 20140216654
- Publication date Aug 7, 2014
- tesa SE
- Klaus Keite-Telgenbüscher
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE FILM ADHESIVE
- Publication number 20140120356
- Publication date May 1, 2014
- ORMET CIRCUITS, INC.
- Catherine Shearer
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ANISOTROPIC CONDUCTIVE ADHESIVE FOR ULTRASONIC WAVE ADHESION, AND E...
- Publication number 20120118480
- Publication date May 17, 2012
- Kyung-Wook PAIK
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Manufacturing of a Device Including a Semiconductor Chip
- Publication number 20110193217
- Publication date Aug 11, 2011
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20110139856
- Publication date Jun 16, 2011
- Hitachi, Ltd.
- Eiji SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS, LOW-TEMPERATURE METAL-METAL COMPOSITE FLIP CHIP INTERCO...
- Publication number 20090242121
- Publication date Oct 1, 2009
- Daewoong Suh
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Minitab rectifier for alternators
- Publication number 20030197265
- Publication date Oct 23, 2003
- International Rectifier Corporation
- Hugh Richard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Minitab rectifier for alternators
- Publication number 20020127765
- Publication date Sep 12, 2002
- Hugh Richard
- H01 - BASIC ELECTRIC ELEMENTS

Combinations of bonding methods provided for in at least two different groups from H01L2224/838 - H01L2224/83904

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connection structure and manufacturing method therefor

Printed circuit film, display device, and method of fabricating pri...

Chemical mechanical polishing for hybrid bonding

Semiconductor device, method for manufacturing the same, and power...

Assembly process for circuit carrier and circuit carrier

Chemical mechanical polishing for hybrid bonding

Placement method for circuit carrier and circuit carrier

Bonding method for connecting two wafers

Wafer stack protection seal

Wafer stack protection seal

Electrically conductive adhesive compound and adhesive tape

Bonding structure and method for manufacturing same

Manufacturing of a device including a semiconductor chip

Minitab rectifier for alternators

Minitab rectifying diode package with two different types of diodes...

Patents Applicationslast 30 patents

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND POWER...

SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, AND METHOD FOR MA...

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

WAFER STACK PROTECTION SEAL

ELECTRICALLY CONDUCTIVE ADHESIVE COMPOUND AND ADHESIVE TAPE

CONDUCTIVE FILM ADHESIVE

ANISOTROPIC CONDUCTIVE ADHESIVE FOR ULTRASONIC WAVE ADHESION, AND E...

Manufacturing of a Device Including a Semiconductor Chip

BONDING STRUCTURE AND METHOD FOR MANUFACTURING SAME

LOW STRESS, LOW-TEMPERATURE METAL-METAL COMPOSITE FLIP CHIP INTERCO...

Minitab rectifier for alternators

Minitab rectifier for alternators