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Combinations of two or more cleaning methods provided for in at least two different groups from H01L2224/8101 - H01L2224/81014
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CPC
H01L2224/81019
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/81019
Combinations of two or more cleaning methods provided for in at least two different groups from H01L2224/8101 - H01L2224/81014
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Patents Grants
last 30 patents
Information
Patent Grant
Bonding structure manufacturing method, heating and melting treatme...
Patent number
9,119,336
Issue date
Aug 25, 2015
Ayumi Industry Co., Ltd.
Hideyuki Abe
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding structure manufacturing method, heating and melting treatme...
Patent number
8,757,474
Issue date
Jun 24, 2014
Ayumi Industry Co., Ltd.
Hideyuki Abe
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
BONDING STRUCTURE MANUFACTURING METHOD, HEATING AND MELTING TREATME...
Publication number
20140246481
Publication date
Sep 4, 2014
Hideyuki ABE
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Bonding Structure Manufacturing Method, Heating And Melting Treatme...
Publication number
20130105558
Publication date
May 2, 2013
AYUMI INDUSTRY CO., LTD.
Hideyuki Abe
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR